• Electronics and Telecommunications Trends
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• v.5 no.1
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• pp.55-70
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• 1990

SIMOX SOI is known to be one of the most useful technologies for fabrications of new generation ULSI devices. This paper describes the current status of SIMOX SOI technology for ULSI applications. The SIMOX wafer is vertically composed of buried oxide layer and silicon epitaxial layer on top of the silicon substrate. The buried oxide layer is used for the vertical isolation of devices The oxide layer is formed by high energy ion implantation of high dose oxygen into the silicon wafer, followed by high temperature annealing. SIMOX-based CMOS fabrication is transparent to the conventional IC processing steps without well formation. Furthermore, thin film CMOX/SIMOX can overcome the technological limitations which encountered in submicron bulk-based CMOS devices, i.e., soft-error rate, subthreshold slope, threshold voltage roll-off, and hot electron degradation can be improved. SIMOX-based bipolar devices are expected to have high density which comparable to the CMOX circuits. Radiation hardness properties of SIMOX SOI extend its application fields to space and military devices, since military ICs should be operational in radiation-hardened and harsh environments. The cost of SIMOX wafer preparation is high at present, but it is expected to reduce as volume increases. Recent studies about SIMOX SOI technology have demonstrated that the performance of the SIMOX-based submicron devices is superior to the circuits using the bulk silicon.

• Journal of the Korean Magnetics Society
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• v.3 no.3
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• pp.215-220
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• 1993

Microstructural dependence of magnetic property of RF/DC sputtered $Co_{69.0}Ni_{18.5}Cr_{12.5}/Cr$ double layer thin film was studied. Grain size was found to be decreased with substrate temperature in the range of $100-200^{\circ}C$ and Cr underlayer thickness(from $500\;{\AA}-2000\;{\AA}$). The peaks (200) and (1120) of X-ray diffraction patterns were evidently grown with the substrate temperature for the Cr underlayer and magnetic layer, respectively. The CoNiCr magnetic layer was found to be well epitaxialy grown on Cr underlayer, and subsequently the coercivity was enhanced.

• International Journal of Internet, Broadcasting and Communication
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• v.12 no.2
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• pp.30-36
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• 2020

We demonstrated a successful fabrication of 4" Gallium Nitride (GaN)/Diamond High Electron Mobility Transistors (HEMTs) incorporated with Inner Slot Via Hole process. We made in manufacturing technology of 4" GaN/Diamond HEMT wafers in a compound semiconductor foundry since reported [1]. Wafer thickness uniformity and wafer flatness of starting GaN/Diamond wafers have improved greatly, which contributed to improved processing yield. By optimizing Laser drilling techniques, we successfully demonstrated a through-substrate-via process, which is last hurdle in GaN/Diamond manufacturing technology. To fully exploit Diamond's superior thermal property for GaN HEMT devices, we include Aluminum Nitride (AlN) barrier in epitaxial layer structure, in addition to conventional Aluminum Gallium Nitride (AlGaN) barrier layer. The current collapse revealed very stable up to Vds = 90 V. The trapping behaviors were measured Emission Microscope (EMMI). The traps are located in interface between Silicon Nitride (SiN) passivation layer and GaN cap layer.

• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.41-41
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• 1998

Rare earth metal films have been used as a buffer layer for growing ferroelectric t thin film or a seed layer for magnetic multilayer. But when it was deposited on s semiconductor substrates for the application of magneto-optic (MO) storage media, it i is difficult to exactly measure magnetic cons떠nts due to shunting current, and so it n needs to grow metal films on insulator substrate to reduce such effect. Recently, it w was reported that ultra-thin Pt layer were epitaxially grown on A12O:J by ion beam s sputtering in 비떠 high vacuum and it can be used as a seed layer for the growth of C Co-contained magnetic multilayer. In this stu$\phi$, Pt thin film were epi떠xially grown on AI2D3 ($\alpha$)OJ) by RF magnetron s sputtering. The crystalline structure was analyzed by transmission electron microscope ( (TEM) and Rutherford Back Scattering (RBS)/Ion Channeling. In TEM study, Pt was b believed to be twinned on AI잉3($\alpha$)01) su$\pi$ace about Pt(ll1) plane.Moreover, RBS c channeling spectra showed that minimum scattering yield of Pt(111)/AI2O:J(1$\alpha$)OJ) was 4 4% and Pt(11J)/AI2D3($\alpha$)OJ) had 3-fold symmetry.

• Journal of IKEEE
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• v.22 no.4
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• pp.1226-1229
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• 2018

We investigated the improvement of surface roughness and states after high temperature annealing using reduced-graphene oxide (r-GO) capping layer on ion-implanted 4H-SiC epitaxial layer. The specification of the 4H-SiC wafer grown on n-type $4^{\circ}$ off-axis 4H-SiC was $10{\mu}m$-thick and n-type epitaxial layer with a dose of $1.73{\times}10^{15}cm^{-2}$. The $n^+$ region were formed by multiple nitrogen ion-implantations and r-GO capping layer was produced by spray coating method. AFM measurements revealed that RMS value of the sample capped with r-GO was tenfold decrease compared to the sample without r-GO capping. The improvement of surface states was also verified by the improvement of leakage current level.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.7 no.2
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• pp.271-275
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• 1997

We have successfully grown Cl-doped ZnSe epitaxial layers on GaAs(100) sub-strates by HWE using $ZnCl_2$ as a doping source. The Cl-doped ZnSe layers showed mirrorlike morphology and good crystallinity. It has been found that the layer exhibited an n-type conduction with low resistivity. The carrier concentration is, obtained about $10^{16}\textrm {cm}^{-3}$, where a resistivity reached 10 $\Omega \textrm {cm}$. The layer with an appropriate doping level exhibited blue photoluminescence at room temperature. The strong blue PL was obtained at the hall mobility of $100^2\textrm {cm}$/Vㆍsec.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.52-54
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• 2008

The authors investigated the InGaN/GaN multi-quantum well blue light emitting diodes with the implements of the photonic crystals fabricated at the top surface of p-GaN layer or the bottom interface of n-GaN layer. The top photonic crystals result in the lattice-dependent photoluminescence spectra for the blue light emitting diodes, which have a wavelength of 450nm. However, the bottom photonic crystal shows a big shift of the photoluminescence peak from 444 nm to 504 nm and played as a role of quality enhancement for the crystal growth of GaN thin film. The micro-Raman spectroscopy shows the improved epitaxial quality of GaN thin film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.77-80
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• 2001

Crystallographic and magnetic characteristics of CoCr-based magnetic thin film for perpendicular magnetic recording media were influenced on preparing conditions. In these, there is that substrate temperature was parameter that increases perpendicular coercivity of CoCrTa magnetic layer using recording layer. While preparation of CoCr-based doublelayer, by optimizing substrate temperature, we expect to increase perpendicular anisotropy of CoCr magnetic layer and prepare ferromagnetic recording layer with a good quality by epitaxial growth. CoCrTa/Si doublelayer showed a good dispersion angle of c-axis orientation $\Delta\theta_{50}$ caused by inserting amorphous Si underlayer which prepared at underlayer substrate temperature 250C. Perpendicular coercivity was constant, in-plane coercivity was controlled a low value about 200Oe. This result implied that Si underlayer could restrain growth of initial layer of CoCrTa thin film, which showed bad magnetic properties effectively without participating magnetization patterns of magnetic layer. In case of CoCrTa/Si that prepared with ultra thin underlayer, crystalline orientation of CoCrTa was improved rather underlayer thickness 1nm, it was expected that amorphous Si layer played a important role in not only underlayer but also seed layer.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.24 no.3
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• pp.89-93
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• 2014

In this study, effects of the V/III ratio on a-plane GaN epitaxial on r-plane grown by HVPE have been investigated. According to increasing of V/III ratio, the value of FWHM of a-plane (11-20) GaN and the value of surface roughness (Ra) were decreased. Growth rate of a-plane GaN epitaxial layer were increased until V/III ratio = 7 as the increasing of V/III ratio, but it was reduced at V/III ratio = 10. At V/III ratio = 10, the FWHM of a-plane (11-20) GaN RC and the surface roughness (Ra) were 829 arcsec and 1.58 nm, respectively, as the lowest value in this study. Also for V/III ratio = 10, cracks under surface or voids were observed the lowest values in images of optical microscope. An M-shaped azimuthal dependence over $360^{\circ}$ angle range was observed for all samples. At V/III ratio = 10, the difference of FWHM of a-plane GaN between $0^{\circ}$ and $90^{\circ}$ was 439 arcsec revealed as the lowest value in the 4 samples.

• Journal of Electrochemical Science and Technology
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• v.15 no.4
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• pp.476-483
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• 2024

Lithium-ion (Li-ion) batteries are essential to modern society, but pose safety risks because of thermal runaway and ignition. This study explores the use of hybrid aqueous electrolytes to enhance the safety and performance of Li-ion batteries, focusing on the solid-electrolyte interface (SEI) formed on lithium titanate (Li₄Ti₅O₁₂; LTO) electrodes. We employed high-resolution transmission electron microscopy (HRTEM) and density functional theory (DFT) calculations to analyze the microstructure and stability of the SEI layer. Further, we prepared LTO and LiMn₂O₄ (LMO) electrodes, assembled full cells with hybrid aqueous electrolytes, and carried out electrochemical testing. The HRTEM analysis revealed the epitaxial growth of a LiF SEI layer on the LTO electrode, which has a coherent lattice structure that enhances electrochemical stability. The DFT calculations confirmed the energetic favorability of the LiF-LTO interface, indicating strong adhesion and potential for epitaxial growth. The full cell demonstrated excellent discharge performance, showing a notable improvement in coulombic efficiency after the initial cycle and sustained capacity over 100 cycles. Notably, the formation of a dense, crystalline LiF SEI layer on the LTO electrode is crucial for preventing continuous side reactions and maintaining mechanical stability during cycling. The experimental results, supported by the DFT results, highlight the importance of the orientational relationship between the SEI and the electrode in improving battery performance. The integration of experimental techniques and computational simulations has led to the development of an LTO/LMO full cell with enhanced discharge capabilities and stability. This study provides insights into the growth mechanisms of the SEI layer and its impact on battery performance, demonstrating the potential of hybrid aqueous electrolytes in advancing lithium-ion battery technology. The findings affirm the viability of this approach for optimizing next-generation Li-ion batteries, which can promote the development of safer and more reliable energy storage solutions.