• Title/Summary/Keyword: Epitaxial

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Synthesis of Graphene Using Polystyrene and the Effect of Boron Oxide on the Synthesis of Graphene (폴리스타이렌을 이용한 그래핀 합성 및 산화 붕소가 그래핀 합성에 미치는 영향)

  • Choi, Jinseok;An, Sung Jin
    • Korean Journal of Materials Research
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    • v.28 no.5
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    • pp.279-285
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    • 2018
  • Graphene is an interesting material because it has remarkable properties, such as high intrinsic carrier mobility, good thermal conductivity, large specific surface area, high transparency, and high Young's modulus values. It is produced by mechanical and chemical exfoliation, chemical vapor deposition (CVD), and epitaxial growth. In particular, large-area and uniform single- and few-layer growth of graphene is possible using transition metals via a thermal CVD process. In this study, we utilize polystyrene and boron oxide, which are a carbon precursor and a doping source, respectively, for synthesis of pristine graphene and boron doped graphene. We confirm the graphene grown by the polystyrene and the boron oxide by the optical microscope and the Raman spectra. Raman spectra of boron doped graphene is shifted to the right compared with pristine graphene and the crystal quality of boron doped graphene is recovered when the synthesis time is 15 min. Sheet resistance decreases from approximately $2000{\Omega}/sq$ to $300{\Omega}/sq$ with an increasing synthesis time for the boron doped graphene.

Emitter-base geometry dependence of electrical performance of AlGaAs/GaAs HBT (에미터와 베이스의 기하구조가 AlGaAs/GaAs HBT의 전기적 특성에 미치는 영향)

  • 박성호;최인훈;최성우;박문평;김영석;이재진;박철순;박형무
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.32A no.2
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    • pp.57-65
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    • 1995
  • The effects of device geometry and layout on high speed performance such as current gain outoff frequency(f$_{T}$) and maximum oscillation frequency(f$_{max}$) are of very improtant for the scaling-down of geterojunction bipolar transistors(HBT$_{s}$). In this paper AlGaAs/GaAs HBTs are fabricated by MBE epitaxial growth and conventional mesa process, and the experimental data of emitter-base geometru dependency of HBT performance are presented in order to provide the quantitative information for optimum device structure design. It is shown that f$_{T}$ and f$_{max}$ are inversely proportional to the emiter stripe width, while the low emitter perimeter/area ratio is better to f$_{T}$ and worse ot f$_{max}$. It is also demonstrated the f$_{T}$ and f$_{max}$ are highly improved by the emitter-base spacing reduction resulting in less parsitic effects. As the result f$_{T}$ of 42GHz and f$_{max}$ of 23GHz are obtained for fabricated HBT with emitter area of 3${\times}20^{\mu}m^{2}$ and E-B spacing of 0.2$\mu$m.m.m.

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Polysilicon-emitter, self-aligned SiGe base HBT using solid source molecular beam epitaxy (고상원 분자선 단결정 성장법을 이용한 다결정 실리콘 에미터, 자기정렬 실리콘 게르마늄 이종접합 쌍극자 트랜지스터)

  • 이수민;염병렬;조덕호;한태현;이성현;강진영;강상원
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.32A no.2
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    • pp.66-72
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    • 1995
  • Using the Si/SiGe layer grown by solid source molecular beam epitaxy(SSMBE) on the LOCOS-patterned wafers, an emitter-base self-aligned hterojunction biplar transistor(HBT) with the polysilicon-emitter and the silicon germanium(SiGe) base has been fabricated. Trech isolation process, planarization process using a chemical-mechanical poliching, and the selectively implanted collector(SIC) process were performed. A titanium disilicide (TiSi$_{2}$), as a base electrode, was used to reduce an extrinsic base resistance. To prevent the strain relaxation of the SiGe epitaxial layer, low temperature (820${^\circ}C$) annealing process was applied for the emitter-base junction formation and the dopant activation in the arsenic-implanted polysilicon. For the self-aligned Si/SiGe HBT of 0.9${\times}3.8{\mu}m^{2}$ emitter size, a cut-off requency (f$_{T}$) of 17GHz, a maximum oscillation frequency (f$_{max}$) of 10GHz, a current gian (h$_{FE}$) of 140, and an emitter-collector breakdown voltage (BV$_{CEO}$) of 3.2V have been typically achieved.

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A Possible Origin of Ferromagnetism in Epitaxial BiFeO3 thin Films

  • Chang, Jae-wan;Jang, Hyun M.;Kim, Sang-Koog
    • Journal of Magnetics
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    • v.11 no.3
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    • pp.108-110
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    • 2006
  • We successfully enhanced the performance of a spin valve by inserting an ultra-thin layer of partially oxidized Fe in the pinned and free layers. With the exchange bias field kept large, the spin valve reached a GMR of 12%, which corresponded to a 55% increase in GMR when we compared it with that of spin valves without any inserted layer. The layer of partially oxidized Fe was more effective for improving the properties of the spin valve than the layer of partially oxidized $Co_{90}Fe_{10}$. Considering all the results, we can contribute the significant improvement to the combined effect of the modified local electronic structures at the Fe impurities and theenhanced spin-dependent reflections at the $\alpha-Fe_{2}O_{3} phase in the magnetic layer.

High Crystalline Epitaxial Bi2Se3 Film on Metal and Semiconductor Substrates

  • Jeon, Jeong-Heum;Jang, Won-Jun;Yun, Jong-Geon;Gang, Se-Jong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.302-302
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    • 2011
  • The binary chalcogenide semiconductor Bi2Se3 is at the center of intensive research on a new state of matter known as topological insulators. It has Dirac point in their band structures with robust surface states that are protected against external perturbations by strong spin-orbit coupling with broken inversion symmetry. Such unique band configurations were confirmed by recent angle-resolved photoelectron emission spectroscopy experiments with an unwanted n-type doping effect, showing a Fermi level shift of about 0.3 eV caused by atomic defects such as Se vacancies. Since the number of defects can be reduced using the molecular beam epitaxy (MBE) method. We have prepared the Bi2Se3 film on noble metal Au(111) and semiconductor Si(111) substrates by MBE method. To characterize the film, we have introduced several surface sensitive techniques including x-ray photoemission electron spectroscopy (XPS) and micro Raman spectroscopy. Also, crystallinity of the film has been confirmed by x-ray diffraction (XRD). Using home-built scanning tunneling microscope, we observed the atomic structure of quintuple layered Bi2Se3 film on Au(111).

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Atomic-scale Controlled Epitaxial Growth and Characterization of Oxide Thin Films

  • Yang, G.Z.;Lu, H.B.;Chen, F.;Zhao, T.;Chen, Z.H.
    • Proceedings of the Optical Society of Korea Conference
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    • 2001.02a
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    • pp.6-11
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    • 2001
  • More than ten kinds of oxide thin films and their heterostructure have been successfully fabricated on SrTiO$_3$(001) substrates by laser molecular beam epitaxy (laser MBE). Measurements of atomic force microscopy (AFM), high-resolution transmission electron microscopy (HRTEM) and X-ray small-angle reflectivity reveal that the surfaces and interfaces are atom-level-smooth. The unit cell layers and the lattice structure are perfect. The electrical and optical properties of BaTiO$_3$-x thin films and BaTiO$_3$/SrTiO$_3$ (BTO/STO) superlattices were examined. The all-perovskite oxide P-N junctions have been successfully fabricated and the better I-V curves were observed.

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Heteroepitaxial Growth of Single 3C-SiC Thin Films on Si (100) Substrates Using a Single-Source Precursor of Hexamethyldisilane by APCVD

  • Chung, Gwiy-Sang;Kim, Kang-San
    • Bulletin of the Korean Chemical Society
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    • v.28 no.4
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    • pp.533-537
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    • 2007
  • This paper describes the heteroepitaxial growth of single-crystalline 3C-SiC (cubic silicon carbide) thin films on Si (100) wafers by atmospheric pressure chemical vapor deposition (APCVD) at 1350 oC for micro/nanoelectromechanical system (M/NEMS) applications, in which hexamethyldisilane (HMDS, Si2(CH3)6) was used as a safe organosilane single-source precursor. The HMDS flow rate was 0.5 sccm and the H2 carrier gas flow rate was 2.5 slm. The HMDS flow rate was important in obtaing a mirror-like crystalline surface. The growth rate of the 3C-SiC film in this work was 4.3 μm/h. A 3C-SiC epitaxial film grown on the Si (100) substrate was characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), reflection high energy electron diffraction (RHEED), atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS) and Raman scattering, respectively. These results show that the main chemical components of the grown film were single-crystalline 3C-SiC layers. The 3C-SiC film had a very good crystal quality without twins, defects or dislocations, and a very low residual stress.

2축배향 금속기판을 이용한 YBCO coated conductor 제조를 위한 다층 산화물 박막 제조

  • Jung, Jun-Ki;Shi, Dong-Qi;Choi, Soo-Jung;Yang, Jian;Ko, Rak-Gil;Shin, Ki-Chul;Park, Yu-Mi;Song, Kyu-Jung;Park, Chan;Yoo, Sang-Im
    • Proceedings of the Korea Crystallographic Association Conference
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    • 2003.05a
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    • pp.12-12
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    • 2003
  • 초전도 선재로의 응용을 위하여 Pulsed laser deposition(PLD)법으로 고온 초전도 체 YBa₂Cu₃O/sub 7-δ/(YBCO) coated conductor를 제조하였다. coated conductor는 금속기판/완충층/초전도층의 구조를 이루고 있는데 완충층은 금속 기판의 집합조직을 초전도층까지 전달하는 역할과 금속기판의 금속이 초전도층으로 확산되어 초전도층의 전기적 특성을 열화시키는 것을 막아주는 확산장벽으로의 역할 등을 수행한다. 완충층의 박막 성장이 제대로 이루어지지 않으면 우수한 초전도 특성을 가지는 초전도층을 얻을 수 없다. 완충층은 금속기판과의 lattice match, thermal match등이 요구되고, 화학적으로 금속기판 및 초전도층과 반응하지 않아야 하며, 긍속기판의 산화없이 epitaxial하게 박막증착이 이루어질 수 있는 재료이어야 한다. 이러한 조건을 만족하는 YBCO, CeO₂, YSZ 등이 주로 사용되고 있다. 전기연구원에서 YBCO coated conductor 선재를 제조하기 위하여 사용하고 있는 다층 박막의 구조는 YBCO/CeO₂/YSZ/CeO₂/Ni(002)과 YBCO/CeO₂/YSZ/Y₂O₃/Ni(002)이며, 최적의 증착조건을 찾기 위하여 성장시 챔버의 산소분압, 완충층의 두께, 기판 온도 등을 변화시켰다. 증착된 완충층 및 초전도층의 집합 조직은 D8-Discover with GADDS(General Area Detector Diffraction System)로 XRD분석을 했고, 미세구조는 SEM으로 관찰하였으며 4단자법을 이용하여 초전도 특성을 측정하였다.

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Electrical properties of Ultra-Shallow Junction formed by using Epitaxial $CoSi_{2}$ Thin Film as Diffusion Source ($CoSi_{2}$ 에피박막을 확산원으로 이용하여 형성한 매우 얇은 접합의 전기적 특성)

  • Koo, Bon-Cheol;Shim, Hyun-Sang;Jung, Yun-Sil;Bae, Kyoo-Sik
    • Korean Journal of Materials Research
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    • v.8 no.5
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    • pp.470-473
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    • 1998
  • $As^+$ was ion-implanted onto $CoSi_{2}$ thin films formed by rapidly thermal-annealed Co/Ti bilayers. Then the specimens were drive-in annealed at 500~100$0^{\circ}C$ to form ultra-shallow $n^+$p junction diodes and to measure their 1- V characteristics. When drive-in annealed at 50$0^{\circ}C$ for 280 sec., 50 nm thick ultra-shallow junctions were formed and di¬odes showed the best 1- V characteristics with low leakage current. In particular. the leakage current was 2 orders lower than that of diodes formed by using Co monolayer. It was attributed to uniform $CoSi_{2}$/Si interfaces.

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Microstructure and Thermal Properties of Mn-Ir/Ni-Ee Exchange Biased Multilayers (Mn-Ir/Ni-Fe 교환결합형 다층박막의 미세구조 및 열적특성)

  • 윤성용;전동민;김장현;서수정;노재철;이확주
    • Journal of the Korean Magnetics Society
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    • v.10 no.6
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    • pp.274-279
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    • 2000
  • The microstructure and thermal properties of the Mn-IriNi-Fe exchange biased multi-layers with various buffer layers and stacking structures have been investigated. The H$_{e{\chi}}$ and the T$_{b}$ depend on the Mn-Ir grain size at the interface between the Mn-Ir layer and the Ni-Fe layer, The (111) preferred orientation of Mn-Ir/Ni-Fe on the Ta buffer layer may promote the values of J$_{k}$ and H$_{e{\chi}}$. The samples which produce the Hex have the epitaxial relationship at the interface between the Mn-Ir layer and the Ni-Fe layer due to the generation of misfit dislocation.

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