• Proceedings of the KIEE Conference
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• 1998.07a
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• pp.312-315
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• 1998

There have been great advances in communication and networking in recent times. It is necessary to take advantage of this information infrastructure for the purpose of developing an engineering education system. But the networking system was expensive or hard to develop. The current international networking is converging to the use of the World Wide Web system. It has become a new standard for global network communication. But there are not a great number of applications which take full advantage of this environment. In this paper an interactive education system for engineering education using the World Wide Web will be presented. This can be used as a supplementary kit for engineering education of transformer induction motor design. The system is developed using JAVA and can be accessed using Web browsers.

• Transactions on Electrical and Electronic Materials
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• v.14 no.4
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• pp.203-207
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• 2013

P-type Si wafers were dipped in HF solution. The minority carrier lifetime (lifetime) increased after HF treatment due to the hydrogen termination effect. To investigate the film passivation effect, PECVD was used to deposit $SiN_x$ on both HF-treated and untreated wafers. $SiN_x$ generally helped to improve the lifetime. A thermal process at $850^{\circ}C$ reduced the lifetime of all wafers because of the dehydrogenation at high temperature. However, the HF-treated wafers showed better lifetime than untreated wafers. PERCs both passivated and not passivated by HF treatment were fabricated on the rear side, and their characteristics were measured. The short-circuit current density and the open-circuit voltage were improved due to the effectively increased lifetime by HF treatment.

• Journal of the Semiconductor & Display Technology
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• v.12 no.1
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• pp.29-33
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• 2013

We have fabricated transparent polymer composite films with high thermal emissivity, which can be used for heat dissipation of transparent electronics. PMMA (poly(methyl methacrylate)) solution with high transparency and thermal emissivity is mixed with various fillers (carbon nanotubes (CNTs), aluminum nitride (AlN), or silicon carbide (SiC)) with high thermal conductivity. We have achieved the thermal emissivity as high as 0.94 by the addition of CNTs. Compared with the PMMA film on glass, however, the addition of AlN or SiC is shown to rather decrease the thermal emissivity. It is also observed that the thickness of the PMMA film does not affect its thermal emissivity. To avoid any degradation of the thermal conductivity, therefore, the PMMA film thickness is desirable to be $1{\mu}m$. There also exists a tradeoff between the optical transmittance and thermal conductivity on the selection of the amount of fillers.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.11 no.9
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• pp.4510-4526
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• 2017

Most available methods of facial gender recognition work well under a constrained situation, but the performances of these methods have decreased significantly when they are implemented under unconstrained environments. In this paper, a method via low-rank and collaborative representation is proposed for facial gender recognition in the wild. Firstly, the low-rank decomposition is applied to the face image to minimize the negative effect caused by various corruptions and dynamical illuminations in an unconstrained environment. And, we employ the collaborative representation to be as the classifier, which using the much weaker $l_2-norm$ sparsity constraint to achieve similar classification results but with significantly lower complexity. The proposed method combines the low-rank and collaborative representation to an organic whole to solve the task of facial gender recognition under unconstrained environments. Extensive experiments on three benchmarks including AR, CAS-PERL and YouTube are conducted to show the effectiveness of the proposed method. Compared with several state-of-the-art algorithms, our method has overwhelming superiority in the aspects of accuracy and robustness.

• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.31-35
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• 2017

We have fabricated flexible and stretchable pressure sensors using silver nanowires (AgNWs) and analyzed their electric responses. AgNWs are spray coated directly onto uncured polydimethylsiloxane (PDMS) such that AgNWs penetrate into the uncured PDMS, enhancing the adhesion properties of AgNWs. However, the single-layered AgNW sensor exhibits unstable electric response and low pressure sensitivity. To tackle it, we have coated a conductive polymer, poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate) (PEDOT:PSS) onto the AgNW layer. Such a hybrid bilayer sensor ensures a stable electric response because the over-coating layer of PEDOT:PSS effectively suppresses the protrusion of AgNWs from PDMS during release. To enhance the sensitivity further, we have also fabricated a stacked bilayer AgNW sensor. However, its electric response varies depending sensitively on the initial overlap pressure.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.39-44
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• 2022

Using a CFD (computational fluid dynamics) simulation tool, we have offered a design guideline of a slot-die head having a simple T-shaped cavity through an analysis of the fluid dynamics in terms of cavity pressure and outlet velocity, which affect the uniformity of coated thin films. We have visualized the fluid flow with a transparent slot-die head where poly(3,4-ethylenedioxythiophene):poly(4-styrenesulfonate) (PEDOT:PSS) is injected. We have shown that the fluid dynamics inside the slot-die head depends sensitively on the cavity depth, cavity length, land length, and channel gap (i.e., shim thickness). Of those, the channel gap is the most critical parameter that determines the uniformity of the pressure and velocity distributions. A pressure drop inside the cavity is shown to be reduced with decreasing shim thickness. To quantify it, we have also calculated the coefficient of variation (CV). In accordance with Hagen-Poiseuille's laws and electron-hydraulic analogy, the CV value is decreased with increasing cavity depth, cavity length, and land length.

• Proceedings of the Korea Information Processing Society Conference
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• 2022.11a
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• pp.188-190
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• 2022

본 연구에서는 정전류(Constant Current) 방식에 전압강하법을 이용하여 접촉저항 측정 시스템을 구현하고 측정값을 블루투스 통신을 통해 안드로이드 운영체제에서 확인할 수 있도록 앱을 개발한다. 측정가능한 범위로 0 Ω에서 10.24 Ω 사이의 접촉 저항을 MCP3424 18 bit 분해능 ADC를 사용하여 측정할 수 있도록 설계하였다. 기존에는 반고정 저항과 별도의 전류계를 이용하여 정전류를 설정하였으나, 본 연구에서는 측정의 정밀도 및 편리성 개선을 위해 0.1% 고정밀 고정저항을 병렬로 4개 연결하여 구현하였으며, 또한 1:1 Unity Gain Buffer를 구성하고 Ultra High Precision Z-Foil 방식으로 오차 0.01%, 온도 계수 0.05 ppm/℃ 저항을 사용하여 실제로 측정한 샘플 저항 값의 결과를 확인하였다.

• Journal of Engineering Education Research
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• v.18 no.3
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• pp.24-32
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• 2015

The purpose of this research is to consider theoretical points of view on a preceding research related to an engineering design and abstract the definition of engineering design ability, its subdivision and element on the basis of experts' recognition. To achieve this goal, various literature researches were carried out by examining domestic and foreign articles in journals, lots of dissertations, and books related to engineering design through theoretical consideration. And to secure the validity on the definition of engineering design ability, its subdivision and element through the theoretical study, a feasibility evaluation method by the experts was applied. And the feasibility evaluation of the experts was conducted through 2 stages. The major conclusions of this study are as follows. Firstly, based on the experts' recognition on the definition of engineering design ability, its subdivision and element, which were revised through the 1st feasibility evaluation and then utilized in the 2st one, the validity was confirmed, and the subdivisions of the engineering design ability were divided into 5 and the elements of the subdivision ability were 33. Secondly, the engineering design ability was defined as "the one to design a realizable product with consumers' demand fully satisfying, based on a knowledge application ability, thinking ability, communication ability, problem-solving ability, and teamwork ability to solve engineering problems." Thirdly, the subdivisions of the engineering design ability were divided as a knowledge application ability, thinking ability, communication ability, problem-solving ability, and teamwork ability.

• Journal of Engineering Education Research
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• v.18 no.6
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• pp.32-37
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• 2015

Since ABEEK ("Accreditation Board for Engineering Education of Korea") began its accreditation in 2001, the 595 programs in 100 institutions have been accredited, and now the number of accredited programs is continuously increasing. On the other hand, NCS ("National Competency Standards") which is directed by government, has been also introduced in recent years, and it becomes the center of attentions of many universities in Korea. Each of these 2 systems has its own strengths and weaknesses, even though their main purposes are very similar. This paper deals with the comparison between the curriculum based on NCS with ABEEK. And also, the examples of making the curriculum based on the NCS would be introduced. At the conclusion, some suggestions for the new NCS system would be proposed.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.67-72
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• 2016

In this study, the texturing and the emitter formation processes were carried out with the wafer adhesion method to increase the productivity and reduce the production cost of the multi-crystalline silicon solar cell. After fabricating $156{\times}156mm$ solar cell according to the wafer adhesion method, the operation characteristics were analyzed and compared with those of the solar cell fabricated by the standard process method. In the case of a solar cell formed by the wafer adhesion method, it showed Jsc of $32.87mA/cm^2$, Voc of 0.612V, FF of 78.04% and efficiency of 15.71% respectively. The efficiency of the solar cell formed by the wafer adhesion method was 0.1% higher than that of the solar cell formed by the standard method. In addition, the productivity of the texturing and the emitter formation processes is expected to be approximately doubled. Therefore, it is expected that the manufacturing cost of the multi-crystalline solar cell can be reduced due to the improved productivity compared with the standard process.