• Journal of Sensor Science and Technology
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• v.4 no.4
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• pp.1-9
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• 1995

The ${\gamma}$-ray deposition spectra were calculated by Monte Calro method to obtain the scintillation characteristics of the ${\gamma}$-ray for BGO scintillation detector with the spherical shape of 1.25 cm radius. The code used in calculating the ${\gamma}$-ray deposition spectra was made for personal computer with qbasic language. Also the ${\gamma}$-ray energy spectra of $^{22}Na$, $^{137}Cs$ and $^{207}Bi$ were measured with the detector. The energy dependent resolution below 2000 keV for the detector was determined by estimating the standard deviation of the photopeak fitted with gaussian function, and $X^{2}$ fitting using Nardi's empirical formula. The measured spectra of $^{22}Na$ and $^{137}Cs$ were compared with the broadened spectra which were obtained by broadening the calculated ${\gamma}$-ray deposition spectra with the energy dependent resolution. The absolute efficiency and the intrinsic peak efficiency of the detector were obtained by calculating the ${\gamma}$-ray deposition spectrum with the code.

• Journal of Industrial Technology
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• v.16
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• pp.157-168
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• 1996

The deposition characteristics of ultrafine $SiO_2$ particles were investigated in a tube furnace reactor theoretically and experimentally controlling tube wall temperature in deposition zone. The model equations such as mass and energy balance equations and aerosol dynamic equations inside reactor and deposition tube were solved to predict the particle growth and deposition. The particle size and deposition efficiencies of $SiO_2$ particles were calculated, changing the process conditions such as tube furnace setting temperature, total gas flow rate inlet $SiCl_4$ concentration and were compared with the experimental results.

• The Korean Journal of Ceramics
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• v.3 no.3
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• pp.173-176
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• 1997

Direct metal ion beam deposition is considered to be a whole new thin film deposition technique. Unlike other conventional thin film deposition processes, the individual deposition particles carry its own ion beam energies which are directly coupled for the formation of this films. Due to the nature of ion beams, the energies can be controlled precisely and eventually can be tuned for optimizing the process. SKION's negative C- ion beam source is used to investigate the initial nucleation mechanism and growth. Strong C- ion beam energy dependence has been observed. Complete phase control of sp3 and sp3, control of the C/SiC/Si interface layer, control of crystalline and amorphous mode growth, and optimization of the physical properties for corresponding applications can be achieved.

• Journal of the Korean Ceramic Society
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• v.28 no.1
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• pp.1-10
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• 1991

Zirconium dioxide(ZrO2) thin films have been deposited by chemical vapor deposition technique involving the application of gas mixture of ZrCl4, and H2O into silicon wafers. The relationships between the deposition rate and various reaction parameters such as the deposition time, the gas flow rate, the deposition temperature, and the composition of reactant gases were studied. The film was identified as nearly stoichiometric monoclinic ZrO2. The apparent activation energy is about 19Kcal/mole at surface chemical reaction controlled region. The deposition rate is mainly influenced by the H2O-forming reacting between CO2 and H2.

• Korean Journal of Materials Research
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• v.21 no.12
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• pp.666-672
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• 2011

The a-Si:H/c-Si hetero-junction (HJ) solar cells have a variety of advantages in efficiency and fabrication processes. It has already demonstrated about 23% in R&D scale and more than 20% in commercial production. In order to further reduce the fabrication cost of HJ solar cells, fabrication processes should be simplified more than conventional methods which accompany separate processes of front and rear sides of the cells. In this study, we propose a simultaneous deposition of intrinsic thin a-Si:H layers on both sides of a wafer by dual hot wire CVD (HWVCD). In this system, wafers are located between tantalum wires, and a-Si:H layers are simultaneously deposited on both sides of the wafer. By using this scheme, we can reduce the process steps and time and improve the efficiency of HJ solar cells by removing surface contamination of the wafers. We achieved about 16% efficiency in HJ solar cells incorporating intrinsic a-Si:H buffers by dual HWCVD and p/n layers by PECVD.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.66.1-66.1
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• 2010

Microcrystalline silicon at low temperatures has been developed using plasma enhanced chemical vapor deposition (PECVD). It has been found that energetically positive ion and atomic hydrogen collision on to growing surface have important effects on increasing growth rate, and atomic hydrogen density is necessary for the increasing growth rate correspondingly, while keeping ion bombardment is less level. Since the plasma potential is determined by working pressure, the ion energy can be reduced by increasing the deposition pressure of 700-1200 Pa. Also, correlation of the growth rate and crystallinity with deposition parameters such as working pressure, hydrogen flow rate and input power were investigated. Consequently an efficiency of 7.9% was obtained at a high growth rate of 0.92 nm/s at a high RF power 300W using a plasma-enhanced chemical vapor deposition method (27.12MHz).

• Transactions of the Korean hydrogen and new energy society
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• v.14 no.1
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• pp.8-16
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• 2003

$TiO_2$ thin films were deposited by DC reactive magnetron sputtering with variations in sputtering parameter such as Ar and $O_2$ flow rate, DC power, substrate temperature and magnetic field. Deposition rate, crystal structure, chemical bond of $TiO_2$ films on the deposition conditions were investigated by Alpha-step, X-ray Diffractometer(XRD), X-ray Photoelectron Spectroscopy(XPS). When the DC power was applied at 500watt, deposition rate of $TiO_2$ film was about 480A/min. $TiO_2$ films coated under the deposition condition of 15sccm Ar and 7~10sccm $O_2$ flow rate was only observed anatase phase. With increasing substrate temperature from RT to $300^{\circ}C$, crystal orientation of $TiO_2$ films variously became.

• Laser Solutions
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• v.18 no.3
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• pp.1-5
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• 2015

A 3D printer based on laser powder deposition (LPD), also known as DED (direct energy deposition), has been developed for fabricating metal parts. The printer uses a ytterbium fiber laser (1070nm, 1kW) and is equipped with an Ar purge chamber, a three-dimensional translation stage and a powder feeding system composed of a powder chamber and delivery nozzles. To demonstrate the performance of the printer, a tapered cylinder of 320mm in height has been fabricated successfully using Ti-6Al-4V powders. The process parameters including the laser output power, the scan speed, and the powder feeding rate have been optimized. A 3D printed test specimen shows mechanical properties (yield strength, ultimate tensile strength, and elongation) exceeding the criteria to employed in a variety of Ti alloy applications.

• Korean Journal of Materials Research
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• v.30 no.12
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• pp.660-665
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• 2020

Silicon heterojunction solar cells can achieve high conversion efficiency with a simple structure. In this study, we investigate the passivation characteristics of VOx thin films as a hole-selective contact layer using ALD (atomic layer deposition). Passivation characteristics improve with iVoc (implied open-circuit voltage) of 662 mV and minority carrier lifetime of 73.9 µs after post-deposition annealing (PDA) at 100 ℃. The improved values are mainly attributed to a decrease in carbon during the VOx thin film process after PDA. However, once it is annealed at temperatures above 250 ℃ the properties are rapidly degraded. X-ray photoelectron spectroscopy is used to analyze the chemical states of the VOx thin film. As the annealing temperature increases, it shows more formation of SiOx at the interface increases. The ratio of V5+ to V4+, which is the oxidation states of vanadium oxide thin films, are 6:4 for both as-deposition and annealing at 100 ℃, and 5:5 for annealing at 300 ℃. The lower the carbon content of the ALD VOx film and the higher the V5+ ratio, the better the passivation characteristics.

• Journal of Powder Materials
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• v.29 no.1
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• pp.56-62
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• 2022

Atomic layer deposition (ALD) is a promising technology for the uniform deposition of thin films. ALD is based on a self-limiting mechanism, which can effectively deposit thin films on the surfaces of powders of various sizes. Numerous studies are underway to improve the performance of thermoelectric materials by forming core-shell structures in which various materials are deposited on the powder surface using ALD. Thermoelectric materials are especially relevant as clean energy storage materials due to their ability to interconvert between thermal and electrical energy by the Seebeck and Peltier effects. Herein, we introduce a surface and interface modification strategy based on ALD to control the performance of thermoelectric materials. We also discuss the properties of the interface between various deposition materials and thermoelectric materials.