• Geomechanics and Engineering
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• v.10 no.1
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• pp.109-124
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• 2016

In this paper, process of dynamic powder compaction is investigated experimentally using impact of drop hammer and die tube. A series of test is performed using aluminum powder with different grain size. The energy of compaction of powder is determined by measuring height of hammer and the results presented in term of compact density and rupture stress. This paper also presents a mathematical modeling using experimental data and neural network. The purpose of this modeling is to display how the variations of the significant parameters changes with the compact density and rupture stress. The closed-form obtained model shows very good agreement with experimental results and it provides a way of studying and understanding the mechanics of dynamic powder compaction process. In the considered energy level (from 733 to 3580 J), the relative density is varied from 63.89% to 87.41%, 63.93% to 91.52%, 64.15% to 95.11% for powder A, B and C respectively. Also, the maximum rupture stress are obtained for different types of powder and the results shown that the rupture stress increases with increasing energy level and grain size.

• Journal of the Institute of Electronics Engineers of Korea CI
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• v.46 no.4
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• pp.79-86
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• 2009

In this paper, we propose a new clustering scheme that provides optimal data aggregation effect and reduces energy consumption of nodes by considering the density of nodes when forming clusters. Since the size of the cluster is determined to ensure optimal data aggregation rate, our scheme reduces transmission range and minimizes interference between clusters. Moreover, by clustering using locally adjacent nodes and aggregating data received from cluster members, we reduce energy consumption of nodes. Through simulation, we confirmed that energy consumption of the whole network is minimized and the sensor network life-time is extended. Moreover, we show that the proposed clustering scheme improves the performance of network compared to previous LEACH clustering scheme.

• Journal of Welding and Joining
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• v.15 no.3
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• pp.79-87
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• 1997

This study was performed to evaluate basic characteristics of electron beam welding process for a 9% Ni steel plate. The principal welding process parameters, such as working distance, accelerating voltage, beam current and welding speed were investigated. The AB (Arata Beam) test method was also applied to characterize beam size and energy density of the electron beam welding process. The electron beam size was found to decrease with the increase of accelerating voltage and the decrease of working distance. So, in case of high voltage (150kV), spot size and energy density of electron beam were revealed to be 0.9mm and $6.5\times10^5W/\textrm{cm}^2$ respectively. The accelerating voltage among the welding parameters was found to be the most important factor governing the penetration depth. When the accelerating voltage of electron beam was low ($\leq$90kV), beam current and welding speed did not affect on the penetration depth significantly. However, in case of high voltage ($\geq$120kV), the depth of penetration increased very sensitively with the increase of beam current and the decrease of welding speed.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.40-44
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• 2010

Laser drilling is an enabling technology for Through Silicon Via (TSV) interconnect applications. Recent advances in picoseconds laser drilling of blind, micron sized vias in silicon is presented here highlighting some of the attractive features of this approach such as excellent sidewall quality. In this study, we dealt with comparison of heat affection around drilled hole between a picosecond laser and a nanosecond laser process under the UV wavelength. Points which special attention should be paid are that picosecond laser process lowered experimentally recast layer, surface debris and micro-crack around hole in comparison with nanosecond laser process. These finding suggests that laser TSV process has possibility to drill under $10{\mu}m$ via. Finally, the laser drilling platform was constructed successfully.

• Laser Solutions
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• v.14 no.1
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• pp.14-18
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• 2011

Semiconductor industry demands decrease in line/space dimensions of IC substrates. Particularly for IC substrates for CPU, line/space dimensions below $10{\mu}m/10{\mu}m$ are expected to be used in production since 2014. Conventional production technologies (SAP, etc.) based on photolithography are widely agreed to be reaching capability limits. To address this limitation, the embedded circuit fabrication technology using laser ablation has been recently developed. In this paper, we used a nanosecond UV laser and a picosecond UV laser to fabricate embedded circuit patterns into a buildup film with $SiO_2$ powders for IC substrate. We conducted SEM and EDS analysis to investigate surface quality of the embedded circuit patterns. Experimental results showed that due to higher recoil pressure, picosecond UV laser ablation of the buildup film generated a better surface roughness.

• Laser Solutions
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• v.15 no.3
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• pp.7-10
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• 2012

Dimensions (line/space) of circuits in IC substrates for high-end chips (e.g. CPU, etc.) are anticipated to decrease as small as $10{\mu}m/10{\mu}m$ in 2014. Since current etch-based circuit-patterning processes are not able to address the urgent requirement from industry, laser-based circuit patterning processes are under active research in which UV laser is used to engrave embedded circuits patterns into IC substrates. In this paper, we used a nanosecond UV laser to directly fabricate embedded circuit patterns into IC substrates with/without ceramic powders. In experiments, we engraved embedded circuit patterns with dimensions (width/depth) of abut $10{\mu}m/10{\mu}m$ and $6{\mu}m/6{\mu}m$ into the IC substrates. Due to the recoil pressure occurring during ablation, the circuit patterning of the IC substrates with ceramic powders showed the higher ablation rate.

• Laser Solutions
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• v.12 no.4
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• pp.6-11
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• 2009

The LDS(Laser Direct Structuring) process uses thermoplastic polymers with a additive compound that serves as plating seed after the activation by laser. It can realize industry requirement such as miniaturization of electrical component, design flexibility and reduction of production steps. The purpose of this study is to introduce LDS, and to investigate the fundamental mechanism. Also the characteristics of conductive patterns were investigated with respect to laser fluence and intensity. We have used a pulsed fiber laser (wavelength : 1064nm) and copper electroless plating to fabricate conductive patterns. The result showed that laser induced metal-organic complex was caused metalization by electroless copper plating, the critical laser fluence was $1.41\;J/cm^2$ at a scan speed of 1 m/s.

• Laser Solutions
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• v.12 no.4
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• pp.12-16
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• 2009

The engineering ceramic is one of the materials advantageous in various conditions with high strength, endurance at high temperature, abrasion resistance and corrosion resistance, etc. However, due to high strength and high brittleness, ceramic incurs high costs and long time on finishing process required after sintering. So a process for obtaining wanted measurements of them has been studied using the high temperature which makes ceramics softened and heat affected recently. This study makes an estimate of laser-assisted machining (LAM) if an economically practical process for manufacturing precision silicon nitride ceramic parts using laser beam. In this study, mechanical properties of silicon nitride at high temperature were observed. And during the LAM, it was observed that cutting force and tool wear were reduced and oxidation of machined surface was increased according to a increase of laser power.

• Proceedings of the KIEE Conference
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• 1999.07e
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• pp.2170-2172
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• 1999

A low energy large aperture(LELA) pulsed electron beam generator of a cold cathode type has been developed for environmental applications, for example, waste water cleaning, flue gas cleaning, and pasteurization etc. The operational principle is based on the emission of secondary electrons from cold cathode when ions in the plasma hit the cathode, which are accelerated toward exit window by the gradient of an electric potential. We have fabricated the LELA electron beam generator with the peak energy of 200keV and beam diameter of 200mm and obtained the large aperture electron beam in air. The electron beam current density has been investigated as a function of glow discharge current, accelerating voltage and radial distribution in front of the exit window foil. The plasma density and electron temperature have been measured in order to confirm the relation with the electron beam current density. We are going to upgrade the LELA electron beam generator in the electron energy, electron beam current and stability of operation for various applications.

• Journal of the Korean Magnetics Society
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• v.24 no.4
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• pp.97-100
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• 2014

We have studied electronic and magnetic structure of Mn-dimer molecule using OpenMX method based on density functional method. The calculated density of states shows that the four O atoms split $e_g$ and $t_{2g}$ energy levels. The energy splitting by the crystal field is smaller than bulk MnO with cubic structure, because of small coordination number of atoms. Total energy with antiferromagnetic spin configuration is lower than that of ferromagnetic configurations. Calculated exchange interaction J between Mn atoms is one order larger than that of the other Mn-O magnetic molecules. That comes from the direct exchange interaction between Mn 3d orbitals and the super-exchange interactions caused by strong ${\sigma}$-bonding of Mn-O orbitals.