Picoseconds Laser Drilling and Platform |
Suh, Jeong
(Department of High Density Energy Beam Processing & System, KIMM)
Shin, Dong-Sig (Department of High Density Energy Beam Processing & System, KIMM) Sohn, Hyon-Kee (Department of High Density Energy Beam Processing & System, KIMM) Song, Jun-Yeob (Department of Ultra Precision Machiness & Systems, KIMM) |
1 | Cho, N.-I. and Chon, I., "Anisotropic etching characteristics of single crystal silicon by KOH and KOH - IPA solutions," Journal of the Korean Vacuum Society, Vol. 11, No. 4, pp. 249-255, 2002. 과학기술학회마을 |
2 | Alcatel Micro Machining Systems, http://www.alcatelmicromachining.com |
3 | XSiL, www.xsil.com |
4 | Yole development, http://www.yole.fr |
5 | Rodin, A. M., Callaghan, J. and Brennan, N., "High Throughput Low CoO Industrial Laser drilling Tool," EuroAsia Semiconductor, Vol. 30, No. 6, pp. 11-16, 2008. |
6 | Nagarajan, R., Prasad, K., Ebin, L. and Narayanan, B., "Development of dual-etch via tapering process for through-silicon interconnection," Sensors and Actuators A: Physical, Vol. 139, No. 1-2, pp. 323-329, 2007. DOI |
7 | Coherent Inc, www.coherent.com |
8 | Shin, D. S., Suh, J., Lee, J. H., Kim, J. O. and Lee, W. K., "TSV Formation using Laser-based Hybrid Process," Proc. of KSPE Spring Conference, pp. 657- 658, 2010. |