• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.125.1-125.1
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• 2010

A high efficiency polymer electrolyte membrane (PEM) fuel cell stack was developed for pressurized pure hydrogen and oxygen supplying conditions. The design objective for the cell stack was to maximize the electric efficiency and to minimize exhaust-gas emissions from it simultaneously. To achieve this objective, the cell stack was designed to use pure hydrogen and oxygen as fuel and oxidant, respectively, and to be operated under high gas inlet pressures and in a stage-wise dead-end operation mode. Major components constituting the cell stack, such as membrane electrode assembly, bipolar-plate, and gasket, have been developed to meet a target durability even in severe operating conditions: high gas inlet pressures and usage of pure oxygen. A high-power fuel cell stack was assembled using these components to verify the performance. The cell stack showed a good performance in terms of the efficiency and maximum power output.

• Transactions on Electrical and Electronic Materials
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• v.16 no.6
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• pp.317-322
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• 2015

The metal oxide varistor (MOV) is a major component of the surge protection devices (SPDs) currently in use. The device is judged to be faulty when fatigue caused by the continuous inflow of lightning accumulates and reaches the damage limit. In many cases, induced lightning resulting from lightning strikes flows in to the device several times per second in succession. Therefore, the frequency or the rate at which the SPD is actually exposed to stress, called a surge, is outside the range of human perception. For this reason, the protective device should be replaced if it actually approaches the end of its life even though it is not faulty at present, currently no basis exists for making the judgment of remaining lifetime. Up to now, the life of an MOV has been predicted solely based on the number of inflow surges, irrespective of the magnitude of the surge current or the amount of energy that has flowed through the device. In this study, nonlinear data that shows the damage to an MOV depending on the count of surge and the amount of input current were collected through a high-voltage test. Then, a failure prediction algorithm was proposed by preparing a look-up table using the results of the test. The proposed method was experimentally verified using an impulse surge generator

• 한국신재생에너지학회:학술대회논문집
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• 2008.05a
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• pp.154-156
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• 2008

A prototype of the desiccant cooling system with a regenerative evaporative cooler was built and tested for the performance evaluation. The regenerative evaporative cooler is to cool a stream of air using evaporative cooling effect without an inc6rease in the humidity ratio. It is comprised of multiple pairs of dry and wet channels and the evaporation water is supplied only to the wet channels. By redirecting a portion of the air flown out of the dry channel into the wet channel, the air can be cooled down to a temperature lower than its inlet wet-bulb temperature at the outlet end of the dry channels. Incorporating a regenerative evaporative cooler eliminates the need for deep dehumidification in the desiccant rotor that is necessary to achieve low air temperature in the system with a direct evaporative cooler. Subsequently, the regenerative evaporative cooler enables the use of low temperature heat source to regenerate the dehumidifier permitting the desiccant cooling system more beneficial compared with other thermal driven air conditioners. At the ARI condition with the regeneration temperature of $60^{\circ}C$, the prototype showed the cooling capacity of 4.4 kW and COP of 0.75.

• Journal of Korean Society for Atmospheric Environment
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• v.21 no.E3
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• pp.107-113
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• 2005

Using a sampling device of our own making, airborne pollen has been monitored in Kyoto, Japan from the middle of February to the end of May 2004. From the morphological analysis of pollen grains by Scanning Electron Microscope (SEM), it was possible to identify some pollen types like Cryptomeria, Pine, Alder, Cyclobalanopsis, Chamaecyparis, and Equisetum. Daily average airborne pollen counts show strong variations from the day to day which makes the appropriate daily forecasts that could be of practical use for patients difficult. Diurnal variation of airborne pollen grains at our local sampling site is very irregular and shows no similarity between pollen types. The highest concentrations of Cryptomeria and Alder pollens in the south -west wind directions might be attributed to the airborne pollen transport, while the increase in Pine pollen grain in the southern wind direction was probably due to the local spread. Prevailing wind direction (SW) during the pollinating periods of Cryptomeria and Alder pollens could suggest a long-distance transport from a distant mountain.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.705-706
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• 2008

There has been, in recent years, effort to make cast copper rotors for industrial use of induction motors. Because the incorporation of copper for the conductor bars and end rings of the induction motor in place of aluminum would result in attractive improvements in motor energy efficiency. The purpose of this method is a reducing the copper loss as using higher conductivity of copper. In this paper as the single phase induction motor is studied, the stator slots and coil turn number is designed for adjusting the slot fill factor and improving its efficiency. At this time design is basis on calculation of reducing loss. And finally this paper shows that the before and after result is compared and analyzed.

• Advances in concrete construction
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• v.9 no.6
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• pp.557-568
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• 2020

In this study, the impact of ring supports around the shell circumferential has been examined for their various positions along the shell axial length using Rayleigh-Ritz formulation. These shells are stiffened by rings in the tangential direction. For isotropic materials, the physical properties are same everywhere where the laminated and functionally graded materials, they vary from point to point. Here the shell material has been taken as functionally graded material. The influence of the ring supports is investigated at various positions. These variations have been plotted against the locations of ring supports for three values of length-to-diameter ratios. Effect of ring supports with middle layer thickness is presented using the Rayleigh-Ritz procedure with three different conditions. The influence of the positions of ring supports for clamped-clamped is more visible than simply supported and clamped-free end conditions. The frequency first increases and gain maximum value in the midway of the shell length and then lowers down. The Lagrangian functional is created by adding the energy expressions for the shell and rings. The axial modal deformations are approximated by making use of the beam functions. The comparisons of frequencies have been made for efficiency and robustness for the present numerical procedure. Throughout the computation, it is observed that the frequency behavior for the boundary conditions follow as; clamped-clamped, simply supported-simply supported frequency curves are higher than that of clamped-simply curves. To generate the fundamental natural frequencies and for better accuracy and effectiveness, the computer software MATLAB is used.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2009.11a
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• pp.23-26
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• 2009

Despite vigorous studies on ultra high-strength concrete in Korea, it still faces many challenges in application to on-site construction methods. This study intends to evaluate the applicability of the VH separated-pouring method which is currently used and was designed to pour ultra high-strength concrete with a design strength of 60, 100N/㎟ separately to girder and beam. When it comes to VH separated-pouring, there is a difference in the required design strength between a girder and a beam, which tends to be larger for ultra high-strength concrete. The tensile strength and cold joint at the joint end have not been commonly evaluated and thus the inevitably of its use is dependent on a structural analysis of the structural stress of reinforcement. In the study, potential problems with respect to the building material which might occur during the pouring of ultra high-strength concrete was evaluated and issues on joint surface performance, the hydration energy contained in the members, and the effects of contraction in concrete were considered as the key elements for study.

• Polymer(Korea)
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• v.36 no.2
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• pp.190-195
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• 2012

Interfacial and rheological properties of selected hydrogel formulations were studied to understand the contact-lens comfort in end use. It was concluded that protein adsorption from aqueous solution decreased monotonically with increasing surface energy (water wettability) of tested hydrogels. Also, it has revealed that friction coefficient of polydimethylsiloxane-polyvinylpyrrolidone (PDMS-PVP) was significantly larger that 2-hydroxyethyl methacrylate (HEMA) based hydrogels. Interestingly, in artificial tear solution, friction coefficients of HEMA based hydrogels were larger than silicone hydrogels.