• Land and Housing Review
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• v.10 no.1
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• pp.19-23
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• 2019

In recent years, many studies have been conducted on smart low carbon cities through the fusion of ICT information technology for the purpose of reducing carbon. In this study, we investigated 13 cities in three continents that implement low-carbon city policies and analyzed the size, economic and social characteristics of each city to identify the degree of dynamic mechanism for carbon reduction. To this end, we quantified the elements of the city and analyzed the basic requirements for low-carbon cities using the TOPSIS method. The study found that most cities were better able to activate institutions and cultural conditions, facilities and functional conditions, and economic and industrial conditions than other engines, and these three were the main forms of power for smart low carbon cities. The results of this study are expected to be used as a basis for suggesting policy recommendations and improvement measures for future smart low carbon cities.

• Journal of the Korean Home Economics Association
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• v.39 no.4
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• pp.1-18
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• 2001

Korea huts been dramatically changed during the last century in many aspect of society, with the introduction of western culture in the beginning of 20th century. This study aims at understanding the changes in our traditional culture shown by costume as well as examining the aspects of the changes of traditional clothing according to age, by comparing the differences of our traditional dress Hanbok between ear1y and the late of the 20th century. Analysis of photographs showing Hanbok of both ages was used. 155 photographs of people wearing traditional Hanbok in the beginning of the 20th century were collected from the photo collection books portraying various living conditions of common people at that time. 748 Photographs of Hanbok worm today were obtained by taking pictures of various occasions like wedding ceremonies in 5 big cities during 1997. The process of analysis consists of 3 stages: setting standards, sorting, and grouping by positioning. The results showed that traditional Hanbok room in the early 20th century has maintained its basic silhouette and design during the century, but the methods of color coordination, ornamentation, construction have underdone many changes in detail. Consequently, traditional frame exits, but actually there are many variations of tradition produced by individual tastes and fashion trend. These changes show that continuing influx of the western culture which has made enormous social changes in Korea had an influence even on Hanbok.

• Journal of the Korean Institute of Landscape Architecture
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• v.29 no.5
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• pp.1-19
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• 2001

This paper is designed to find and develop new concepts for the sustainable traditional village in Korea. To this end, it is necessary that concern for the traditional village should diversify and expand, and not concentrate solely on the cultural properties and architecture-oriented historic elements. In consideration of this notion, this paper suggests introduction of maintenance and management as a practical concept for the embodiment of the sustainable traditional village. This paper aims to explore the concrete maintenance and management systems of Korean and Japanese cases, to analyze differences and characteristics between the two nation\\\\`s, and through these comparisons, to suggest sustainable maintenance and management methods for the traditional village in Korea. Primary data was collected by field and interview survey on each village in the two nations several times during about a two year period. The major findings of this paper are presented in three categories--maintenance management frame, maintenance management contents, and necessary principles for progressive maintenance management, and are as follows; In the first step, suggests the basic directions, boundaries, and systems for the maintenance and management of sustainable traditional villages. And in the second step, analyzes the relationship among the contents of maintenance and management methods with focus on the village space, village attraction, and village community. Our results suggests diverse maintenance and management contents for the sustainable village maintenance and management. Finally, the basic principles for the application, and use as valuable tools for sustainable village maintenance and management, are strongly recommended.

• Proceedings of the KIEE Conference
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• 2005.10b
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• pp.261-263
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• 2005

In this paper, we implement an identification system using the vein image of the hand. The vein pattern is obtained in the grey-scale 2D image through the infrared-red imaging from back of the hand. Since the frame has lack of clearance, we use some enhancing methods such as the complement, addition, and multiplication to the image to increase the contrast. After Wiener filtering for smoothness of the vein pattern, we transform the image into the binary image with mean function. The binarized image is session thinned and the cross-points in the vein tree are obtained by calculating the number of pixels connected because the image is shaped as a tree. We choose the point and find the nearest to the center if it has majority, where we find the two end points of the selected line. We can get the angle between the two lines joined at the cross-point and store its coordinates, angle, and label the values. The values are used as the feature vector of the vein pattern. This procedure is similar to the human cognition sequences. It is shown that the proposed method is simple for the vein recognition.

• Journal of the Ergonomics Society of Korea
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• v.17 no.1
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• pp.23-36
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• 1998

The primary objective of this research was to establish and quantify the relationship between the physical degradation factors of multimedia telecommunications (teleconferencing) system and Subjective human perception. The research was performed in two stages. A field survey of the real users and pilot experiments were carried out in the first stage to determine customers' major complaints and corresponding system degradation factors. A prototype teleconferencing simulator was developed in two separate sound-treated chambers equipped with audio/video equipment running under a custom-developed software program. In the second stage, simulation experiments using the semantic differential methodology were performed utilizing 26 paid participants (14 college students and 12 housewives). The results indicated that audio/video synchronization and the frame rate were the main system factors for both subject groups, but different pattern of factors' influence was found according to the group, implying that the system configuration would hopefully accommodate the characteristics of the end users. Also, a single quality index, developed for system preference, was revealed to be highly correlated with user satisfaction. The results provide some fundamental data on the human subjective perception of multimedia telecommunications quality, and further can help establish the quality standards to enhance service level.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.5
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• pp.653-658
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• 2011

In general, the purpose of packaging fasteners is a series of management activities to maintain the condition at the time of production until they get delivered to the end user. An automatic packing system for fasteners is consisted of bucket conveyor, slide feeder, vision inspection system, box-magazine conveyor system and automatic packing machine. Also, the automatic packing machine is consisted of six modules including charging device, clamping/opening device, sealing/cutting device, feeding/air-shower device, supplying/adjusting device and device frame, etc. In this paper, we proposed an automatic packing mechanism of the one station concept for packing work of fastener objects where the continuous batch work is performed in a finite space. The proposed one-station packing mechanism has been optimized through mechanical, dynamical, structural and fluid analyses. And it had been manufactured as the prototype of automatic packing machine. The field test for validation of performance was performed directly at the production line of bolt and screw. In the field test, this packing machine showed an efficiency of about 4.5 times the manual operation. It also showed 30% reduction in the consumption of packing materials compared to the manual operation. This automatic packing machine for fastener objects will be commercialized soon.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.18 no.2
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• pp.169-179
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• 2005

An improved method for evaluating effective buckling lengths of beam-column members in plane frames is newly proposed based on system inelastic buckling analysis. To this end, the tangent stiffness matrix of be am-column elements is first calculated using stability functions and then the inelastic buckling analysis method is presented. The scheme for determining effective length of individual members is also addressed. Design examples and numerical results ?uc presented to show the validity of the proposed method.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Advances in concrete construction
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• v.9 no.6
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• pp.577-588
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• 2020

In this paper, vibration attributes of chiral double-walled carbon nanotubes (CNTs) based on nonlocal elastic shell model have been investigated. The impact of small scale is being perceived by establishing Flügge shell model. The wave propagation is engaged to frame the ruling equations as eigen value system. The influence of nonlocal parameter subjected to different end supports has been overtly examined. A suitable choice of material properties and nonlocal parameter been focused to analyze the vibration characteristics. The new set of inner and outer tubes radii investigated in detail against aspect ratio and length. The dominance of boundary conditions via nonlocal parameter is shown graphically. Whereas for lower aspect ratio the frequencies coincide but as it continues to expand the difference between all respective boundary conditions slightly tend to increase. The results generated furnish the evidence regarding applicability of nonlocal shell model and also verified by earlier published literature.