• Korean Journal of Medicinal Crop Science
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• v.16 no.6
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• pp.402-408
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• 2008

This study was performed to investigate improving immune activities of natural water-soluble sulforaphane extracted from Brassica oleracea var. italica by nano encapsulation process. The nanoparticles of the sulforaphane extracted with ultrasonification process at $60^{\circ}C$ promoted human B and T cell growth, about $7{\sim}35%$ compared to the control. The secretion of IL-6 and TNF-${\alpha}$ from T cells were also enhanced as $2.6{\times}10^{-4}pg/cell$ and $2.1{\times}10^{-4} pg/cell$, respectively, by the adding nano samples. NK cell activation was improved about 8%, compare to the control in adding cultured medium of T cell added nano samples. It was also found that sulforaphane extracted from B. oleracea var. italica had highly inhibitory activity on hyaluronidase as $IC_{50}$ about $200\;{\mu}g/m{\ell}$. It can be concluded that natural water-soluble sulforaphane samples by nano-encapsulation, each size is 200 nm, extracted from B. oleracea var. italica has high immune activities through higher efficiency of bio-activation than conventional extracts.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1995.10a
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• pp.64-67
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• 1995

Transfer Molding is currently the most widely used process for encapsulation integrated circuits(;IC). Although the process has been introduced over 20 years ago, generating billions of parts each year, it is far from being optimized. With each new mold, epoxy mold, epoxy mold compound, and lead-frame, lengthy period and expensive qualification runs have to be performed to minimized defects ranging from wire sweep, incomplete fill, and internal voids etc. This studies describes how simulation can be applied to transfer molding to yield acceptable design and processing parameter. The non-isothermal filling of non-newtonian reactive epoxy molding compound(;EMC) in a multi-cavity mold is analyzed. Sensitivity analysis is conducted to investigate the influence of process deviations on the final molded profile. This study trend is carried out by following some heuristic process guidelines.

• Journal of the Semiconductor & Display Technology
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• v.22 no.1
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• pp.23-27
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• 2023

Organic light-emitting diode(OLED) is very thin organic films which are hundreds of nanometers. Unlike bottom-emission OLED(BEOLED), top-emission OLED(TEOLED) emits light out the front, opaque moisture absorbents or metal foils can't be used to prevent moisture and oxygen. And it is difficult to have flexible characteristics with glass encapsulation, so thin film encapsulation which can compensate for those two disadvantages is mainly used. In this study, Al₂O₃ thin films by atomic layer deposition(ALD) were examined by changing the argon gas purge flow rate and we applied this Al₂O₃ thin films to the encapsulation of TEOLED. Ag / ITO / N,N'-Di-[(1-naphthyl)-N,N'-diphenyl]-1,1'-biphenyl-4,4'-diamine / tris-(8-hydroxyquinoline) aluminum/ LiF / Mg:Ag (1:9) were used to fabricate OLED device. The characteristics such as brightness, current density, and power efficiency are compared. And it was confirmed that with a thickness of 40 nm Al₂O₃ thin film encapsulation process did not affect OLED properties. And it was enough to maintain a proper OLED operation for about 9 hours.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.1-10
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• 2018

Recently, there has been rapid development in the field of flexible electronic devices, such as organic light emitting diodes (OLEDs), organic solar cells and flexible sensors. Encapsulation process is added to protect the flexible electronic devices from exposure to oxygen and moisture in the air. Using numerical simulation, we investigated the effects of the encapsulation layer on mechanical stability of the silicon chip, especially the fracture performance of center crack in multi-layer package for various loading condition. The multi-layer package is categorized in two type - a wide chip model in which the chip has a large width and encapsulation layer covers only the chip, and a narrow chip model in which the chip covers both the substrate and the chip with smaller width than the substrate. In the wide chip model where the external load acts directly on the chip, the encapsulation layer with high stiffness enhanced the crack resistance of the film chip as the thickness of the encapsulation layer increased regardless of loading conditions. In contrast, the encapsulation layer with high stiffness reduced the crack resistance of the film chip in the narrow chip model for the case of external tensile strain loading. This is because the external load is transferred to the chip through the encapsulation layer and the small load acts on the chip for the weak encapsulation layer in the narrow chip model. When the bending moment acts on the narrow model, thin encapsulation layer and thick encapsulation layer show the opposite results since the neutral axis is moving toward the chip with a crack and load acting on chip decreases consequently as the thickness of encapsulation layer increases. The present study is expected to provide practical design guidance to enhance the durability and fracture performance of the silicon chip in the multilayer package with encapsulation layer.

• Korea-Australia Rheology Journal
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• v.13 no.4
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• pp.179-187
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• 2001

As part of continuing efforts to investigate nonlinear dynamics and stability of film casting process, our earlier results obtained by Lee et al. (2001b) have been extended in the present study to cover the film casting of both extension thickening and extension thinning fluids. The same instability mechanism and draw resonance criterion previously derived have been found valid here, and a rather complex dynamic behavior of film width in contrast to that of film thickness has also been confirmed. The effect of fluid viscoelasticity on draw resonance, however, exhibits opposite results depending on whether the fluid is extension thickening or thinning, i.e., it stabilizes film casting in the former while destabilizing in the latter. The encapsulation extrusion method which recently has been successfully employed to stabilize industrially important paper coating process, has been theoretically explained in the present study as to why such stabilization is possible.

• Journal of fish pathology
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• v.33 no.2
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• pp.103-109
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• 2020

In order to use nervous necrosis virus (NNV) virus-like particles (VLPs) as a delivery tool for heterologous antigens or plasmids, we attempted to produce red-spotted grouper nervous necrosis virus (RGNNV) VLPs displaying a partial region of viral hemorrhagic septicemia virus (VHSV) glycoprotein at the surface and VLPs that are harboring DNA vaccine plasmids within the VLP. A peptide encoding 105 amino acids of VHSV glycoprotein was genetically inserted in the loop region of NNV capsid gene, and VLPs expressing the partial part of VHSV glycoprotein were successfully produced. However, in the transmission electron microscope analysis, the shape and size of the partial VHSV glycoprotein-expressing NNV VLPs were irregular and variable, respectively, indicating that the normal assembly of capsid proteins was inhibited by the relatively long foreign peptide (105 aa) on the loop region. To encapsulate by simultaneous transformation with both NNV capsid gene expressing plasmids and DNA vaccine plasmids (having an eGFP expressing cassette under the CMV promoter), NNV VLPs containing plasmids were produced. The encapsulation of plasmids in the NNV VLPs was demonstrated by PCR and cells exposed to the VLPs encapsulating DNA vaccine plasmids showed fluorescence. These results suggest that the encapsulation of plasmids in NNV VLPs can be done with a simple one-step process, excluding the process of disassembly-reassembly of VLPs, and NNV VLPs can be used as a delivery tool for DNA vaccine vectors.

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.130.1-130.1
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• 2011

Nowadays, the number of PV module corporation is increasing due to demand growth of silicon solar module. However almost study of module is research about increasing of efficiency for it. This study is evaluation and development for process of module using the silicone encapsulation material instead of existing EVA sheet. We are changed adding material ratio on silicone and thickness of silicone. So we get better efficiency than EVA sheet through the evaluation for silicone liquid and modulation. Also, we are test after establishing manufacture system being able to quicker than existing modules line. The result of EVA sheet is average 207.47W and silicone material is 211.32W so we think that silicone is better than EVA sheet.

• Journal of Microbiology and Biotechnology
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• v.15 no.1
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• pp.7-13
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• 2005

Chitosan-alginate capsules were formed by electrostatic interactions and exhibited an appropriate mechanical strength, permeability, and stability for the culture of hepatocytes. Pig hepatocytes were isolated and hepatocyte spheroids formed and immobilized in chitosan-alginate capsules. An encapsulation procedure of 3 min and spheroid formation period of 24 h were the optimum conditions for the best liver functions. Pig hepatocytes with a cell density of $6.0{\tomes}10^6$ cells/ml in the capsules were found to be most suitable for application in a bioartificial liver support system. The encapsulated pig hepatocyte spheroids exhibited stable ammonia removal and urea secretion rates in a bioreactor for 2 weeks. Accordingly, chitosan-alginate encapsulated hepatocyte spheroids in a packed-bed bioreactor would appear to have potential as a bioartificial liver.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.2
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• pp.102-110
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• 2001

In this paper, methods to analyze wire sweep and paddle shift during the semiconductor ship-encapsulation process have been studied. The analysis of wire sweep includes flow-field analysis in a complicated geometry, drag-force calculation for given flow of fluid, and wire-deformation calculation for given loads. The paddle-shift analysis is used to analyze the deformation of the paddle due to the pressure difference in two cavities. the analysis is done using either analytical solutions or numerical simulation. The analytical solution is used for rough but fast calculation of wire sweep. The numerical solution is used for more accurate calculation of wire-sweep. The numerical results of wire sweep show good agreements with the experimental ones.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.12
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• pp.91-99
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• 1995

An effort has been made to more accurately analyze the flow in the chip cavity, particularly to model the flow through the openings in the leadframe and correctly treat the thermal boundary condition at the leadframe. The theoretical analysis of the flow has been done by using the Hele- Shaw approximation in each cavity separated by a leadframe. The cross-flow through the openings in the leadframe has been incorporated into the Hele-Shaw formulation as a mass source term. The temperature of the leadframe has been calculated based on energy balance in the leadframe. The flow behavior in the leadframe has been verified experimentally. In the experiment, a transparent mold and clear fluid have been used for flow visualization. Comparisons were made between the calculation and experimental results which showed a good agreement.