• 제목/요약/키워드: Encapsulation Process

검색결과 162건 처리시간 0.027초

천연 수용성 설포라판의 나노입자화를 통한 면역 활성 증진 (Enhancement of Immune Activities of Natural Water-Soluble Sulforaphane by Nano Encapsulation Process)

  • 하지혜;한재건;정향숙;오성호;권민철;최영범;고정림;이현용
    • 한국약용작물학회지
    • /
    • 제16권6호
    • /
    • pp.402-408
    • /
    • 2008
  • This study was performed to investigate improving immune activities of natural water-soluble sulforaphane extracted from Brassica oleracea var. italica by nano encapsulation process. The nanoparticles of the sulforaphane extracted with ultrasonification process at $60^{\circ}C$ promoted human B and T cell growth, about $7{\sim}35%$ compared to the control. The secretion of IL-6 and TNF-${\alpha}$ from T cells were also enhanced as $2.6{\times}10^{-4}pg/cell$ and $2.1{\times}10^{-4} pg/cell$, respectively, by the adding nano samples. NK cell activation was improved about 8%, compare to the control in adding cultured medium of T cell added nano samples. It was also found that sulforaphane extracted from B. oleracea var. italica had highly inhibitory activity on hyaluronidase as $IC_{50}$ about $200\;{\mu}g/m{\ell}$. It can be concluded that natural water-soluble sulforaphane samples by nano-encapsulation, each size is 200 nm, extracted from B. oleracea var. italica has high immune activities through higher efficiency of bio-activation than conventional extracts.

트랜스퍼 금형에 있어서 IC 폐키지의 성형 유동 해석에 관한 연구 (A Study on the Molding Analysis of IC Package in Transfer mold)

  • 구본권
    • 한국공작기계학회:학술대회논문집
    • /
    • 한국공작기계학회 1995년도 추계학술대회 논문집
    • /
    • pp.64-67
    • /
    • 1995
  • Transfer Molding is currently the most widely used process for encapsulation integrated circuits(;IC). Although the process has been introduced over 20 years ago, generating billions of parts each year, it is far from being optimized. With each new mold, epoxy mold, epoxy mold compound, and lead-frame, lengthy period and expensive qualification runs have to be performed to minimized defects ranging from wire sweep, incomplete fill, and internal voids etc. This studies describes how simulation can be applied to transfer molding to yield acceptable design and processing parameter. The non-isothermal filling of non-newtonian reactive epoxy molding compound(;EMC) in a multi-cavity mold is analyzed. Sensitivity analysis is conducted to investigate the influence of process deviations on the final molded profile. This study trend is carried out by following some heuristic process guidelines.

  • PDF

ALD 아르곤 퍼지유량에 따른 Al2O3박막 분석 및 유기발광 다이오드 봉지막 적용에 관한 연구 (A Study on the Al2O3 Thin Film According to ALD Argon Purge Flow Rate and Application to the Encapsulation of OLED )

  • 이동운;김기락;조의식;전용민;권상직
    • 반도체디스플레이기술학회지
    • /
    • 제22권1호
    • /
    • pp.23-27
    • /
    • 2023
  • Organic light-emitting diode(OLED) is very thin organic films which are hundreds of nanometers. Unlike bottom-emission OLED(BEOLED), top-emission OLED(TEOLED) emits light out the front, opaque moisture absorbents or metal foils can't be used to prevent moisture and oxygen. And it is difficult to have flexible characteristics with glass encapsulation, so thin film encapsulation which can compensate for those two disadvantages is mainly used. In this study, Al2O3 thin films by atomic layer deposition(ALD) were examined by changing the argon gas purge flow rate and we applied this Al2O3 thin films to the encapsulation of TEOLED. Ag / ITO / N,N'-Di-[(1-naphthyl)-N,N'-diphenyl]-1,1'-biphenyl-4,4'-diamine / tris-(8-hydroxyquinoline) aluminum/ LiF / Mg:Ag (1:9) were used to fabricate OLED device. The characteristics such as brightness, current density, and power efficiency are compared. And it was confirmed that with a thickness of 40 nm Al2O3 thin film encapsulation process did not affect OLED properties. And it was enough to maintain a proper OLED operation for about 9 hours.

  • PDF

봉지막이 박형 실리콘 칩의 파괴에 미치는 영향에 대한 수치해석 연구 (Effects of Encapsulation Layer on Center Crack and Fracture of Thin Silicon Chip using Numerical Analysis)

  • 좌성훈;장영문;이행수
    • 마이크로전자및패키징학회지
    • /
    • 제25권1호
    • /
    • pp.1-10
    • /
    • 2018
  • 최근 플렉서블 OLED, 플렉서블 반도체, 플렉서블 태양전지와 같은 유연전자소자의 개발이 각광을 받고 있다. 유연소자에 밀봉 혹은 봉지(encapsulation) 기술이 매우 필요하며, 봉지 기술은 유연소자의 응력을 완화시키거나, 산소나 습기에 노출되는 것을 방지하기 위해 적용된다. 본 연구는 봉지막(encapsulation layer)이 반도체 칩의 내구성에 미치는 영향을 고찰하였다. 특히 다층 구조 패키지의 칩의 파괴성능에 미치는 영향을 칩의 center crack에 대한 파괴해석을 통하여 살펴보았다. 다층구조 패키지는 폭이 넓어 칩 위로만 봉지막이 덮고있는 "wide chip"과 칩의 폭이 좁아 봉지막이 칩과 기판을 모두 감싸고 있는 "narrow chip"의 모델로 구분하였다. Wide chip모델의 경우 작용하는 하중조건에 상관없이 봉지막의 두께가 두꺼울수록, 강성이 커질수록 칩의 파괴성능은 향상된다. 그러나 narrow chip모델에 인장이 작용할 때 봉지막의 두께가 두껍고 강성이 커질수록 파괴성능은 악화되는데 이는 외부하중이 바로 칩에 작용하지 않고 봉지막을 통하여 전달되기에 봉지막이 강하면 강한 외력이 칩내의 균열에 작용하기 때문이다. Narrow chip모델에 굽힘이 작용할 경우는 봉지막의 강성과 두께에 따라 균열에 미치는 영향이 달라지는데 봉지막의 두께가 작을 때는 봉지막이 없을 때보다 파괴성능이 나쁘지만 강성과 두께의 증가하면neutral axis가 점점 상승하여 균열이 있는 칩이 neutral axis에 가까워지게 되므로 균열에 작용하는 하중의 크기가 급격히 줄어들게 되어 파괴성능은 향상된다. 본 연구는 봉지막이 있는 다층 패키지 구조에 다양한 형태의 하중이 작용할 때 패키지의 파괴성능을 향상시키기 위한 봉지막의 설계가이드로 활용될 수 있다.

Nonlinear dynamics and stability of film casting process

  • Lee, Joo-Sung;Hyun, Jae-Chun
    • Korea-Australia Rheology Journal
    • /
    • 제13권4호
    • /
    • pp.179-187
    • /
    • 2001
  • As part of continuing efforts to investigate nonlinear dynamics and stability of film casting process, our earlier results obtained by Lee et al. (2001b) have been extended in the present study to cover the film casting of both extension thickening and extension thinning fluids. The same instability mechanism and draw resonance criterion previously derived have been found valid here, and a rather complex dynamic behavior of film width in contrast to that of film thickness has also been confirmed. The effect of fluid viscoelasticity on draw resonance, however, exhibits opposite results depending on whether the fluid is extension thickening or thinning, i.e., it stabilizes film casting in the former while destabilizing in the latter. The encapsulation extrusion method which recently has been successfully employed to stabilize industrially important paper coating process, has been theoretically explained in the present study as to why such stabilization is possible.

  • PDF

Production of virus-like particles of nervous necrosis virus displaying partial VHSV's glycoprotein at surface and encapsulating DNA vaccine plasmids

  • Yang, Jeong In;Bessaid, Mariem;Kim, Ki Hong
    • 한국어병학회지
    • /
    • 제33권2호
    • /
    • pp.103-109
    • /
    • 2020
  • In order to use nervous necrosis virus (NNV) virus-like particles (VLPs) as a delivery tool for heterologous antigens or plasmids, we attempted to produce red-spotted grouper nervous necrosis virus (RGNNV) VLPs displaying a partial region of viral hemorrhagic septicemia virus (VHSV) glycoprotein at the surface and VLPs that are harboring DNA vaccine plasmids within the VLP. A peptide encoding 105 amino acids of VHSV glycoprotein was genetically inserted in the loop region of NNV capsid gene, and VLPs expressing the partial part of VHSV glycoprotein were successfully produced. However, in the transmission electron microscope analysis, the shape and size of the partial VHSV glycoprotein-expressing NNV VLPs were irregular and variable, respectively, indicating that the normal assembly of capsid proteins was inhibited by the relatively long foreign peptide (105 aa) on the loop region. To encapsulate by simultaneous transformation with both NNV capsid gene expressing plasmids and DNA vaccine plasmids (having an eGFP expressing cassette under the CMV promoter), NNV VLPs containing plasmids were produced. The encapsulation of plasmids in the NNV VLPs was demonstrated by PCR and cells exposed to the VLPs encapsulating DNA vaccine plasmids showed fluorescence. These results suggest that the encapsulation of plasmids in NNV VLPs can be done with a simple one-step process, excluding the process of disassembly-reassembly of VLPs, and NNV VLPs can be used as a delivery tool for DNA vaccine vectors.

Encapsulation용 silicone을 사용한 모듈제조 공정에 대한 연구 (The study on PV module development using the silicone encapsulation)

  • 정인성;이우진;이범수;양오봉;정은석;김종일
    • 한국신재생에너지학회:학술대회논문집
    • /
    • 한국신재생에너지학회 2011년도 춘계학술대회 초록집
    • /
    • pp.130.1-130.1
    • /
    • 2011
  • Nowadays, the number of PV module corporation is increasing due to demand growth of silicon solar module. However almost study of module is research about increasing of efficiency for it. This study is evaluation and development for process of module using the silicone encapsulation material instead of existing EVA sheet. We are changed adding material ratio on silicone and thickness of silicone. So we get better efficiency than EVA sheet through the evaluation for silicone liquid and modulation. Also, we are test after establishing manufacture system being able to quicker than existing modules line. The result of EVA sheet is average 207.47W and silicone material is 211.32W so we think that silicone is better than EVA sheet.

  • PDF

Optimization of Chitosan-Alginate Encapsulation Process Using Pig Hepatocytes or Development of Bioartificial Liver

  • LEE , JI-HYUN;LEE, DOO-HOON;SON, JEONG-HWA;PARK, JUNG-KEUG;KIM, SUNG-KOO
    • Journal of Microbiology and Biotechnology
    • /
    • 제15권1호
    • /
    • pp.7-13
    • /
    • 2005
  • Chitosan-alginate capsules were formed by electrostatic interactions and exhibited an appropriate mechanical strength, permeability, and stability for the culture of hepatocytes. Pig hepatocytes were isolated and hepatocyte spheroids formed and immobilized in chitosan-alginate capsules. An encapsulation procedure of 3 min and spheroid formation period of 24 h were the optimum conditions for the best liver functions. Pig hepatocytes with a cell density of $6.0{\tomes}10^6$ cells/ml in the capsules were found to be most suitable for application in a bioartificial liver support system. The encapsulated pig hepatocyte spheroids exhibited stable ammonia removal and urea secretion rates in a bioreactor for 2 weeks. Accordingly, chitosan-alginate encapsulated hepatocyte spheroids in a packed-bed bioreactor would appear to have potential as a bioartificial liver.

반도체 칩 캡슐화 성형 공정에 있어서 와이어 스윕 및 패들 변형에 관한 연구 (A Study of Wire Sweep, Pre-conditioning and Paddle Shift during Encapsulation of Semiconductor Chips)

  • 한세진;허용정;이성철
    • 한국정밀공학회지
    • /
    • 제18권2호
    • /
    • pp.102-110
    • /
    • 2001
  • In this paper, methods to analyze wire sweep and paddle shift during the semiconductor ship-encapsulation process have been studied. The analysis of wire sweep includes flow-field analysis in a complicated geometry, drag-force calculation for given flow of fluid, and wire-deformation calculation for given loads. The paddle-shift analysis is used to analyze the deformation of the paddle due to the pressure difference in two cavities. the analysis is done using either analytical solutions or numerical simulation. The analytical solution is used for rough but fast calculation of wire sweep. The numerical solution is used for more accurate calculation of wire-sweep. The numerical results of wire sweep show good agreements with the experimental ones.

  • PDF

반도체 칩 캡슐화(encapsulation)를 위한 트랜스퍼 금형 캐비티(cavity)에서의 설계 해석 및 실험에 관한 연구 (Design Analysis in a Cavity with Leadframe during Semiconductor Chip Encapsulation)

  • 한세진;허용정
    • 한국정밀공학회지
    • /
    • 제12권12호
    • /
    • pp.91-99
    • /
    • 1995
  • An effort has been made to more accurately analyze the flow in the chip cavity, particularly to model the flow through the openings in the leadframe and correctly treat the thermal boundary condition at the leadframe. The theoretical analysis of the flow has been done by using the Hele- Shaw approximation in each cavity separated by a leadframe. The cross-flow through the openings in the leadframe has been incorporated into the Hele-Shaw formulation as a mass source term. The temperature of the leadframe has been calculated based on energy balance in the leadframe. The flow behavior in the leadframe has been verified experimentally. In the experiment, a transparent mold and clear fluid have been used for flow visualization. Comparisons were made between the calculation and experimental results which showed a good agreement.

  • PDF