• 한국세라믹학회지
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• 제51권6호
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• pp.566-569
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• 2014

ZnO and SiC powders were fabricated to make crack-free composite membranes. Parts of some membranes were re-treated with an encapsulation process. These membranes were characterized by XRD, BET, and FE-SEM analyzes. The hydrogen permeation fluxes of the encapsulated and heat-treated membranes after encapsulation were observed using Sievert's type equipment. Values were measured at 1 bar with increasing temperatures. The obtained values of encapsulated and further heat-treated membrane at 298 K were $4.20{\times}10^{-6}$ and $8.64{\times}10^{-5}mol/m^2sPa$, respectively.

• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.41-48
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• 2010

본 연구에서는 일액형 이방 도전성 페이스트(anisotropic conductive paste, ACP) 혼합 조성의 상온 보관성을 향상시키기 위해 2-methyl imidazole 경화 촉매제를 5종의 각기 다른 물질로써 encapsulation하였다. Encapsulation용 분말 물질들은 DSC를 통해 그 융점을 관찰하였으며, 이를 통해 encapsulation용 분말 물질들을 액상으로 용융시켜 encapsulation하는 공정이 가능함을 확인할 수 있었다. Encapsulation된 2-methyl imidazole 분말을 포함한 ACP 혼합물질의 상온 보관성을 평가하기 위하여 시간에 따른 점도 변화가 관찰되었다. 그 결과, stearic acid와 carnauba wax로 encapsulation된 2-methyl imidazole 분말을 포함한 혼합물질에서 향상된 상온 보관성을 관찰할 수 있었으며, 이러한 formulation은 기본 혼합물질과도 유사한 경화 거동을 보임을 확인할 수 있었다. 최종적으로 stearic acid와 carnauba wax로 encapsulation된 2-methyl imidazole 분말을 포함한 혼합물질을 사용하여 RFID 칩을 제조된 안테나 패턴이 형성된 PET 기판에 고속 플립칩 본딩을 실시하였다. 이 경우 측정된 접합 강도는 기본 혼합물질에 비해 약 37%의 수준인 것으로 측정되었다.

• 한국경영과학회:학술대회논문집
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• 한국경영과학회 2000년도 추계학술대회 및 정기총회
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• pp.215-218
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• 2000

Workflow Management System(WfMS) enables corporations to manage business processes efficiently The purpose of this research is to develop a management system that is capable of managing complicated business processes efficiently under distributed environment where many companies or divisions are participating. Run-time encapsulation proposed in this paper is a system design methodology that enables appropriate response to the dynamically changing processes by using nested processes. We have implemented WfMS under Web environment using run-time encapsulation. Run-time encapsulation using nested process is an efficient development methodology for implementing heterogeneous and distributed WfMS under web environment.

• 센서학회지
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• 제28권6호
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• pp.402-406
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• 2019

Recently, semiconducting organic materials have been spotlighted as next-generation electronic materials based on their tunable electrical and optical properties, low-cost process, and flexibility. However, typical organic semiconductor materials are vulnerable to moisture and oxygen. Therefore, an encapsulation layer is essential for application of electronic devices. In this study, SiN_x thin films deposited at process temperatures below 150 ℃ by plasma-enhanced chemical vapor deposition (PECVD) were characterized for application as an encapsulation layer on organic devices. A single structured SiN_x thin film was optimized as an organic light-emitting diode (OLED) encapsulation layer at process temperature of 80 ℃. The optimized SiN_x film exhibited excellent water vapor transmission rate (WVTR) of less than 5 × 10^-5 g/㎡·day and transmittance of over 87.3% on the visible region with thickness of 1 ㎛. Application of the SiN_x thin film on the top-emitting OLED showed that the PECVD process did not degrade the electrical properties of the device, and the OLED with SiN_x exhibited improved operating lifetime

• 한국약용작물학회지
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• 제17권1호
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• pp.54-60
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• 2009

This study was performed to improve immune activities of Rubus coreanus Miquel by encapsulation of nanoparticles. Immuno-activities of R. coreanus were investigated through aqueous extracts associated with process of water at $60^{\circ}C$. It showed high promotion of human B and T cells growth about 50%, compared to the case of other conditions. The secretion of IL-6 and TNF-${\alpha}$ was also enhanced as $2.44{\times}10^{-4}$pg/cell and $1.94{\times}10^{-4}$pg/cell, results by adding nano samples. NK cell activation was improved up to 29% higher than the conventional extraction process. The secretion of NO from macrophage showed 14.9 ${\mu}M$ on the nano-encapsulation process extracts, which was higher than others. The size of nanoparticles was in the range of 50${\sim}$300 nm, which can effect the penetration into the cells. It was clearly observed by real time confocal microscope.

• ETRI Journal
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• 제34권5호
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• pp.713-718
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• 2012

Sensor nodes in ubiquitous sensor networks require autonomous replacement of deteriorated gas sensors with reserved sensors, which has led us to develop an encapsulation technique to avoid poisoning the reserved sensors and an autonomous activation technique to replace a deteriorated sensor with a reserved sensor. Encapsulations of $In_2O_3$ nanoparticles with poly(ethylene-co-vinyl alcohol) (EVOH) or polyvinylidene difluoride (PVDF) as gas barrier layers are reported. The EVOH or PVDF films are used for an encapsulation of $In_2O_3$ as a sensing material and are effective in blocking $In_2O_3$ from contacting formaldehyde (HCHO) gas. The activation process of $In_2O_3$ by removing the EVOH through heating is effective. However, the thermal decomposition of the PVDF affects the property of the $In_2O_3$ in terms of the gas reactivity. The response of the sensor to HCHO gas after removing the EVOH is 26%, which is not significantly different with the response of 28% in a reference sample that was not treated at all. We believe that the selection of gas barrier materials for the encapsulation and activation of $In_2O_3$ should be considered because of the ill effect the byproduct of thermal decomposition has on the sensing materials and other thermal properties of the barrier materials.

• 반도체디스플레이기술학회지
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• 제13권4호
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• pp.15-20
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• 2014

The fracture analysis of $SiN_x$ layers, which were deposited by low-temperature plasma enhanced chemical vapor deposition (LT-PECVD) and could be used for an encapsulation layer of a flexible organic light emitting display (OLED), was performed by an electrical method. The specimens of metal-insulator-metal (MIM) structure were prepared using Pt and ITO electrodes. We stressed MIM specimen mechanically by bending outward with a bending radius of 15mm repeatedly and measured leakage current through the top and bottom electrodes. We also observed the cracks, were generated on surface, by using optical microscope. Once the cracks were initiated, the leakage current started to flow. As the amount of cracks increased, the leakage current was also increased. By correlating the electrical leakage current in the MIM specimen with the bending times, the amount of cracks in the encapsulation layer, generated during the bending process, was quantitatively estimated and fracture behavior of the encapsulation layer was also closely investigated.

• 반도체디스플레이기술학회지
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• 제20권3호
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• pp.22-26
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• 2021

Thin-film encapsulation (TFE) technology is most effective in preventing water vapor and oxygen permeation in the organic light emitting diodes (OLED). Of those, a laminated structure of Al₂O₃ and MgO were applied to provide efficient barrier performance for increasing the stability of devices in air. Atomic layer deposition (ALD) method is known as the most promising technology for making the laminated Al₂O₃/MgO and is used to realize a thin film encapsulation technology in organic light-emitting diodes. Atomic layer deposited inorganic films have superior barrier performance and have advantages of excellent uniformity over large scales at relatively low deposition temperatures. In this study, the control system of the MgCP₂ precursor for the atomic layer deposition of MgO was established in order to deposit the MgO layer stably by the injection time of second level and the stable heating temperature. The deposition rate was obtained stably to be from 4 to 10 Å/cycle using the injection pulse times ranging from 3 to 12 sec and a substrate temperature ranging from 80 to 150 ℃.

• 한국표면공학회지
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• 제46권3호
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• pp.111-115
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• 2013

To study the encapsulation method for large-area organic light emitting devices (OLEDs), OLED of ITO / 2-TNATA / NPB / $Alq_3$:Rubrene / $Alq_3$ / LiF / Al structure was fabricated, which on $Alq_3$/LiF/Al as protective layer of OLED was deposited to protect the damage of OLED, and subsequently it was encapsulated using attaching film and flat glass. The current density and luminance of encapsulated OLED using attaching film and flat glass has similar characteristics compared with non-encapsulated OLED when thickness of Al as a protective layer was 1200 nm, otherwise power efficiency of encapsulated OLED was better than non-encapsulated OLED. Encapsulation process using attaching film and flat glass did not have any effects on the emission spectrum and the Commission International de L'Eclairage (CIE) coordinate. The lifetime of encapsulated OLED using attaching film and flat glass was 287 hours in 1200 nm Al thickness, which was increased according to thickness of Al protective layer, and was improved 54% compared with 186 hours in same Al thickness, lifetime of encapsulated OLED using epoxy and flat glass. As a result, it showed the improved efficiency and the long lifetime, because the encapsulation method using attaching film and flat glass could minimize the impact on OLED caused through UV hardening process in case of glass encapsulation using epoxy.

• 조명전기설비학회논문지
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• 제25권2호
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• pp.10-18
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• 2011

In order to develop highly-integrated RGBY(Red, Green, Blue, Yellow) LED light, a high thermal radiation ceramic package was manufactured, and the encapsulation process was applied with a vacuum printing encapsulation system(VPES). After the completion of vacuum printing, the shape of the encapsulation layer could be controlled by heat treatment during the curing process, and the optical power became highly increased as the encapsulation layer approached a dome shape. The optical characteristics involved in a Correlated Color Temperature(CCT), a Color Rendering Index (CRI), and the efficiency of RGBY LED light were able to be identified by the experimental designing method. Regarding the characteristics of the white light of RGBY LED light, which were measured on the basis of the aforementioned optical characteristics, CRI posted 88, CCT recorded 5,720[$^{\circ}K$], and efficiency exhibited 52[lm/W]. The chip temperature of RGBY LEDs was below 55[$^{\circ}C$] when the consumption power of LED chips was 0.1[W] for the red, 0.3[W] for the green, 0.08[W] for the blue, and 0.24[W] for the yellow. Also, the thermal resistance of the highly-integrated RGBY LED light measured by T3Ster was 2.3[K/W].