• Title/Summary/Keyword: Encapsulation Process

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A Study on Optimal Process Conditions for Chip Encapsulation (반도체 칩 캡슐화 공정의 최적조건에 관한 연구)

  • 허용정
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.04b
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    • pp.477-480
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    • 1995
  • Dccisions of optimal filling conditions for the chip encapsulation have been done primarily by an ad hoc use of expertise accumulated over the years because the chip encapsulation process is quite complicated. The current CAE systems do not provide mold designers with necessary knowledge of the chip encapsulation for the successful design of optimal filling except flow simulation capability. There have been no attempts to solve the optimal filling problem in the process of the chip encapsulation. In this paper, we have constructed an design system for optimal filling to avoid short shot in the chip encapsulation process which combines an optimization methodology with CAE software.

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A Multi-Level Knowledge-Based Design System for Semiconductor Chip Encapsulation

  • Huh, Y.J.
    • Journal of the Microelectronics and Packaging Society
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    • v.9 no.1
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    • pp.43-48
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    • 2002
  • Semiconductor chip encapsulation process is employed to protect the chip and to achieve optimal performance of the chip. Expert decision-making to obtain the appropriate package design or process conditions with high yields and high productivity is quite difficult. In this paper, an expert system for semiconductor chip encapsulation has been constructed which combines a knowledge-based system with CAE software.

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Flexible Thin Film Encapsulation and Planarization Effectby Low Temperature Flowable Oxide Process

  • Yong, Sang Heon;Kim, Hoonbea;Chung, Ho Kyoon;Chae, Heeyeop
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.431-431
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    • 2013
  • Flexible Organic Light Emitting Diode (OLED) displays are required for future devices. It is possible that plastic substrates are instead of glass substrates. But the plastic substrates are permeable to moisture and oxygen. This weak point can cause the degradation of fabricated flexible devices; therefore, encapsulation process for flexible substrate is needed to protect organic devices from moisture and oxygen. Y.G. Lee et al.(2009) [1] reported organic and inorganic multilayer structure as an encapsulation barrier for enhanced reliability and life-time.Flowable Oxide process is a low-temperature process which shows the excellent gap-fill characteristics and high deposition rate. Besides, planarization is expected by covering dust smoothly on the substrate surface. So, in this research, Bi-layer structured is used for encapsulation: Flowable Oxide Thin film by PECVD process and Al2O3 thin film by ALD process. The samples were analyzed by water vapor transmission rate (WVTR) using the Calcium test and film cross section images were obtained by FE-SEM.

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Plasma-polymerized Styrene Prganic thin Film as Hybrid OLEDs Encapsulation (플라즈마 중합된 Styrene을 유기박막으로 사용한 하이브리드형 OLED 봉지기술)

  • Jung, Kun-Soo;Lee, Boong-Joo;Shin, Paik-Kyun
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.63 no.10
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    • pp.1412-1416
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    • 2014
  • We report thin-film organic moisture barriers based on polystyrene(PS) laminates deposition by PECVD for an encapsulation of OLEDs. The organic polystyrene thin-film has the benzene ring structure and high hydrophobic characteristics and it was polymerized by PECVD in dry process. Life time properties of Ca test were obtained 32 minutes at the RF 100W process conditions. From the AFM test, the roughness of multi-layer thin-film was more excellent rather than that of a single-layer thin-film. In addition, 5 layers of the multi-layer film properties were obtained 45 minutes. So that the optical and electrical properties were not affected with these plasma polymerized organic thin-film encapsulation. For life time improvement, the inorganic $Al_2O_3$ thin-film were deposited 5nm using ALD atomic layer deposition. The WVTR(Water Vaper Transmission Rate) value of hybrid thin-film encapsulation in the optimum process conditions was resulted by less than $10-3g/m^2/day$. From the results of experiment, plasma polymerized hybrid encapsulation was suggested as the flexible display applications.

Reduction of Wire Sweep during Chip Encapsulation by Runner Balancing and Ram Control (반도체 칩 캡슐화 공정에 있어서 와이어 스윕(wire sweep) 최소화에 관한 연구)

  • Han, S.;Huh, Y.J.
    • Journal of the Korean Society for Precision Engineering
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    • v.13 no.12
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    • pp.13-21
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    • 1996
  • In this paper, methods to reduce wire sweep during the chip-encapsulation process have been studide. Two methods have been tried for this purpose, namely runner balancing and ram velocity control. Runner balancing has been achieved automatically by using a computer program. Ram-velocity control has been achieved using empirical rules and results from a flow simulation of the encapsulation process. A mold which has 12 cavities for chip has been used as a case study. The simulation results show that the wire sweep obtained from the optimal process condition is about 1/5 of that from initial, unoptimized condition.

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Design of Zero-Stress Encapsulation for Mechanical Stability of Flexible OLED Displays (유연 OLED 디스플레이의 기계적 안정성을 위한 제로 스트레스 봉지막 설계)

  • Jeong, Eun Gyo
    • Journal of the Semiconductor & Display Technology
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    • v.21 no.1
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    • pp.39-43
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    • 2022
  • In this paper, a study was conducted on encapsulation technology for high mechanical stability of flexible displays. First, unlike conventional encapsulation barrier that exclude cracks as much as possible for low water vapor transmission rate (WVTR), mechanical properties were improved by using a defect suppression mechanism introduced with crack arresters. The zero-stress encapsulation barrier optimizes the residual stress of the thin film based to improve the internal mechanical stability. The zero-stress encapsulation barrier was applied to the organic light emitting diodes (OLEDs) to confirm its characteristics and lifetime. Due to improved internal mechanical stability, it has a longer lifetime more than 35% compared to conventional encapsulation technologies. As the zero-stress encapsulation barrier proposed in this study does not require additional deposition process, it is not difficult to apply it. Based on various advantages, it is expected to play an important role in flexible displays.

A multi Step Cure Process to Prevent Residual Bubbles in LED Encapsulation Silicone Resin (LED Encapsulation 실리콘의 기포잔류방지를 위한 Step 경화공정 연구)

  • Song, M.J.;Kim, H.K.;Yoon, G.S.;Kim, K.H.
    • Transactions of Materials Processing
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    • v.21 no.2
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    • pp.101-106
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    • 2012
  • Generally, rapid cure reaction of LED encapsulation silicone resin causes serious defects in cured resin products such as warpage, residual bubbles, and reduced wettablility. In order to prevent residual bubbles in silicone resin, the step cure process was examined in the present paper. Three kinds of step cure processes were applied, and bubble-free phenomenon was observed. Most of the bubbles were removed under $70^{\circ}C$, the minimum temperature for activating cure reaction. In addition, degree of cure(DOC) and temperature distribution were predicted by using FEM analysis of heat transfer. It was concluded that maintaining cure temperature which provide a DOC under 0.5~0.6 effectively reduces residual bubbles.

A Study on a Knowledge-Based Design System for Chip Encapsulation (반도체 칩의 캡슐화 성형을 위한 지식형 설계시스템에 관한 연구)

  • 허용정;한세진
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.2
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    • pp.99-106
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    • 1998
  • In this paper, we have constructed an expert system for semiconductor chip encapsulation which combines a knowledge-based system with CAE software. The knowledge-base module includes heuristic and pre analysis knowledge for evaluation and redesign. Evaluation of the initial design and generation of redesign recommendations can be developed from the rules as applied to a given chip package. The CAE programs can be used for simulating the filling and packing stage of encapsulation process. The expert system is a new tool which enables package design or process conditions with high yields and high productivity.

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Optimization of Ascorbic Acid Encapsulation in PLA Microcapsules Using Double Emulsion Process (이중유화법을 이용한 PLA 마이크로캡슐 내부로의 아스코르브산 캡슐화 공정 최적화)

  • Ji Won Yun;Young Mi Chung
    • Applied Chemistry for Engineering
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    • v.35 no.2
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    • pp.115-121
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    • 2024
  • This study analyzed the influence of process variables affecting the thermodynamic equilibrium and fluid dynamics of interfaces such as reverse micelle, salt concentration, interfacial tension, and viscosity of fluids to optimize the microencapsulation process using the W1/O/W2 double emulsion method. The process variable with the greatest impact on encapsulation efficiency was found to be the difference in osmotic pressure between the W1 and W2 phases. It was observed that increasing the salt concentration in the W2 phase or decreasing the ascorbic acid concentration in the W1 phase resulted in higher encapsulation efficiency. Additionally, a larger difference in osmotic pressure led to increased damage to the surface of the microparticles, as confirmed by SEM images. The introduction of reverse micelles, which was anticipated to increase encapsulation efficiency, either had a low contribution or even decreased encapsulation efficiency. The yield of microcapsules was expressed as a universal function, applicable to all process conditions or solution compositions. According to this universal function, no further increase in yield was observed beyond the Ca (capillary number) of approximately 20.

Concept of the Encapsulation Process and Equipment for the Spent Fuel Disposal (심지층 처분을 위한 사용후핵연료 포장공정 장비개념 설정)

  • Lee J.Y.;Choi H.J.;Cho D.K.;Kim S.K.;Choi J.W.;Hahn P.S.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.470-473
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    • 2005
  • Spent nuclear fuels are regarded as a high level radioactive waste and they will be disposed in a deep geological repository. To maintain the safety of the repository for hundreds of thousands of years, the spent fuels are encapsulated in a disposal canister and the canister containing spent fuels should have the structural integrity and the corrosion resistance below the several hundreds meters from the ground surface. In this study, the concept of the spent fuel encapsulation process and the process equipment fur deep geological disposal were established. To do this, the design requirements, such as the functions and the spent fuel accumulations, were reviewed. Also, the design principles and the bases were established. Based on the requirements and the bases, the encapsulation process and the equipment from spent fuel receiving process to transferring canister into the underground repository including hot cell processes was established. The established concept of the spent fuel encapsulation process and the process equipment will be improved continuously with the future studies. And this concept can be effectively used in implementing the reference repository system of our own case.

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