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http://dx.doi.org/10.5370/KIEE.2014.63.10.1412

Plasma-polymerized Styrene Prganic thin Film as Hybrid OLEDs Encapsulation  

Jung, Kun-Soo (Dept. of Electrical Engineering, Inha University)
Lee, Boong-Joo (Dept. of Electronic Engineering, Namseoul University)
Shin, Paik-Kyun (Dept. of Electrical Engineering, Inha University)
Publication Information
The Transactions of The Korean Institute of Electrical Engineers / v.63, no.10, 2014 , pp. 1412-1416 More about this Journal
Abstract
We report thin-film organic moisture barriers based on polystyrene(PS) laminates deposition by PECVD for an encapsulation of OLEDs. The organic polystyrene thin-film has the benzene ring structure and high hydrophobic characteristics and it was polymerized by PECVD in dry process. Life time properties of Ca test were obtained 32 minutes at the RF 100W process conditions. From the AFM test, the roughness of multi-layer thin-film was more excellent rather than that of a single-layer thin-film. In addition, 5 layers of the multi-layer film properties were obtained 45 minutes. So that the optical and electrical properties were not affected with these plasma polymerized organic thin-film encapsulation. For life time improvement, the inorganic $Al_2O_3$ thin-film were deposited 5nm using ALD atomic layer deposition. The WVTR(Water Vaper Transmission Rate) value of hybrid thin-film encapsulation in the optimum process conditions was resulted by less than $10-3g/m^2/day$. From the results of experiment, plasma polymerized hybrid encapsulation was suggested as the flexible display applications.
Keywords
OLED; Styrene; Plasma-polymerization; Encapsulation; Multi-layer; PECVD;
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