• 제목/요약/키워드: Electrostatic deposition

검색결과 100건 처리시간 0.025초

2단식 전기집진기의 집진판 블록간격 및 입자크기가 입자의 부착효율에 미치는 영향 (Effects of the Block Distance of Collecting Plate and Particle Size on the particle Deposition Efficiency in the Two-Stage Electrostatic Precipitator)

  • 박청연
    • 한국대기환경학회지
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    • 제16권2호
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    • pp.165-178
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    • 2000
  • In this study the effects of block distance have been investigated on the particle deposition efficiency in the collecting cell of two-stage electrostatic precipitator by numerical analysis. Particle trajectories have been changed by the electrostatic and inertial force of particle with the inlet velocity electrostatic number and particle diameter. The total deposition efficiency has a minimum value by the interaction between the effect of particle inertial force and electrostatic force in the collecting cell. The increase of block distance makes the total deposition efficiency decrease under the range of the particle size which has the minimum deposition efficiency. However beyond the range of particle size which has minimum deposition efficiency total deposition efficiency has no trend with the variation of block distance.

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정전기 분무 증착법에 대한 최근 연구 동향 고찰 (Research Issues of Electrostatic Spray Deposition (ESD) Technique)

  • 류성욱;이상용
    • 한국분무공학회지
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    • 제11권1호
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    • pp.7-16
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    • 2006
  • Performance of thin films fabricated with the electrostatic spray deposition (ESD) technique is strongly governed by surface morphology, which depends on deposition parameters such as deposition time and temperature, solution properties, and surface characteristics of substrates. In this article, the state of the art on the relationships between the surface morphology and the deposition parameters is presented. Also studies on the electro-hydrodynamic atomization process and the motion of drops relevant to the ESD technique are briefly reviewed, and the future research works are suggested.

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정전압에 따른 클린룸 벽체에서의 입자침착 특성 (Characteristics of Particle Deposition onto the Cleanroom Wall Panel with Electrostatic Voltages)

  • 노광철;손영태;김종준;오명도
    • 설비공학논문집
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    • 제18권12호
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    • pp.1033-1038
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    • 2006
  • We carried out the experiments on particle deposition onto the cleanroom wall panels. And then we investigated the particle deposition characteristic coefficients for electrostatic voltages and particle size. It was found that there is little difference in characteristics of the particle deposition between the steel panel and the anti-static coating panel. In case of that the particle size is under $1.0{\mu}m$, the particle deposition characteristic coefficient becomes larger as the electrostatic voltage induced to the cleanroom wall panel is increasing. Where in case of that the particle size is over $3.0{\mu}m$, the particle deposition characteristic coefficients do not show any differences with the electrostatic voltages. It is due to that the electrostatic force is the major particle transport mechanism for submicron particles, while the gravitational settling is the major particle transport mechanism for overmicron particles when the electro-static voltages are induced to the cleanroom wall panel.

Numerical Simulation: Effects of Gas Flow and Heat Transfer on Polymer Deposition in a Plasma Dry Etcher

  • Joo, Junghoon
    • Applied Science and Convergence Technology
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    • 제26권6호
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    • pp.184-188
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    • 2017
  • Polymer deposition pattern on the ceramic lid surface is analyzed by numerical modeling. Assumption was made that is affected by gas flow pattern from the horizontal and vertical nozzles, temperature profile from the finger-like branches made of graphite and electrostatic potential effect. Calculated results showed gas flow dynamics is less relevant than two others. Temperature and electrostatic effects are likely determining the polymer deposition pattern based on our numerical simulation results.

정전효과가 있는 가열 수평웨이퍼로의 입자침착에 관한 해석 (Analysis on particle deposition onto a heated, horizontal free-standing wafer with electrostatic effect)

  • 유경훈;오명도;명현국
    • 대한기계학회논문집B
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    • 제21권10호
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    • pp.1284-1293
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    • 1997
  • The electrostatic effect on particle deposition onto a heated, Horizontal free-standing wafer surface was investigated numerically. The deposition mechanisms considered were convection, Brownian and turbulent diffusion, sedimentation, thermophoresis and electrostatic force. The electric charge on particle needed to calculate the electrostatic migration velocity induced by the local electric field was assumed to be the Boltzmann equilibrium charge. The electrostatic forces acted upon the particle included the Coulombic, image, dielectrophoretic and dipole-dipole forces based on the assumption that the particle and wafer surface are conducting. The electric potential distribution needed to calculate the local electric field around the wafer was calculated from the Laplace equation. The averaged and local deposition velocities were obtained for a temperature difference of 0-10 K and an applied voltage of 0-1000 v.The numerical results were then compared with those of the present suggested approximate model and the available experimental data. The comparison showed relatively good agreement between them.

정전효과가 있는 100mm보다 큰 반도체 웨이퍼로의 입자침착 (Particle deposition on a semiconductor wafer larger than 100 mm with electrostatic effect)

  • 송근수;유경훈;이건형
    • 한국입자에어로졸학회지
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    • 제5권1호
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    • pp.17-27
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    • 2009
  • Particle deposition on a semiconductor wafer larger than 100 mm was studied experimentally and numerically. Particularly the electrostatic effect on particle deposition velocity was investigated. The experimental apparatus consisted of a particle generation system, a particle deposition chamber and a wafer surface scanner. Experimental data of particle deposition velocity were obtained for a semiconductor wafer of 200 mm diameter with the applied voltage of 5,000 V and PSL particles of the sizes between 83 and 495 nm. The experimental data of particle deposition velocity were compared with the present numerical results and the existing experimental data for a 100 mm wafer by Ye et al. (1991) and Opiolka et al. (1994). The present numerical method took into consideration the particle transport mechanisms of convection, Brownian diffusion, gravitational settling and electrostatic attraction in an Eulerian frame of reference. Based on the comparison of the present experimental and numerical results with the existing experimental results the present experimental method for a 200 mm semiconductor wafer was found to be able to present reasonable data.

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구형파 펄스를 인가한 정전분무 장치의 대전량 특성 (Charging Characteristics of Electrostatic Sprayer Applied Square Pulse)

  • 박승록;문재덕
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제52권12호
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    • pp.573-578
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    • 2003
  • In this study, new type of induction charging system for electrostatic spraying was manufactured and proposed to improve the electrical safety and charging efficiency. And parameters of proposed system to generate the maximum deposition current with electrical safety were selected and investigated. The selected parameters were frequency of square pulse and thickness of insulation material, outer diameter of device and thickness and positions of electrode. Charging quantity of water drop was measured by deposition current detected from sensing plate indirectly. The maximum deposition current for each parameter were 3.5[uA] at the frequency of 15[kHz] and thickness of 0.25[mm] insulating layer. And maximum deposition currents were 2.8[uA] and 3.0[uA] at 25[mm] outer diameter of charging device and 0.25[mm] thickness of electrode each. Effects of electrode position from spraying nozzle on deposition current was a little.

정전효과를 고려한 반도체 웨이퍼의 입자침착 특성 (Particle Deposition Characteristics with Electrostatic Effect on Semiconductor Wafers)

  • 이건형;채승기;문영준
    • 대한설비공학회:학술대회논문집
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    • 대한설비공학회 2006년도 하계학술발표대회 논문집
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    • pp.779-785
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    • 2006
  • Particle transport and deposition characteristics on semiconductor wafers inside the chamber were experimentally investigated via a particle generation & deposition system and a wafer surface scanner. Especially the relation between particle size($0.083{\sim}0.495{\mu}m$) and particle deposition velocity with ESA(Electrostatic Attraction) effect was studied. Spot deposition technique with the deposition system using nozzle type outlets of the chamber was newly conducted to derive particle deposition velocity and all experiment results were compared with the previous study and were in a good agreement as well.

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평판형 방전판을 갖는 2단식 전기집진기의 집진판 블록배열이 집진효율에 미치는 영향 (Effects of the Block Arrangement on the Collection Efficiency in the Two-Stage Electrostatic Precipitator with Charging Plate)

  • 박성호;박청연;김태권
    • 한국대기환경학회지
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    • 제16권6호
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    • pp.641-652
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    • 2000
  • The effect of block arrangement has been investigated on the particle deposition in the specified collecting cell of two-stage electrostatic precipitator by numerical analysis. Recirculation zone existed at the downstream of the block in the collecting cell, and the particles entering the recirculation zone were deposited on the collecting plate. Particle trajectory and deposition had considerably different phenomenon according to electrostatic and inertial effect, which depended on inlet mean velocity, electrostatic number, and particle diameter in the collecting cell. The total collection efficiency reached a minimum value through an interaction of electrostatic and inertial effect. In the computational domain, total collection efficiency for the case of two blocks in the computational domain was more than that of one block at the relative small electrostatic number. However as the block distance and inertial effect increased, the difference between the collection efficiency of two cases decreased. In the range of relatively small particle size total collection efficiency was always superior to particle collection efficiency that was predicted by Deutsch equation.

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정전분무법을 이용한 YSZ 박막 제조 (Preparation of Thin YSZ Film by Electrostatic Spray Deposition)

  • 권병완;김진수;박정훈
    • 공업화학
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    • 제19권1호
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    • pp.117-121
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    • 2008
  • 본 연구에서는 정전분무법을 이용하여 YSZ 박막을 제조하였다. 제조된 박막은 제조시 전구체 용액, 지지체 온도 등에 크게 영향을 받았으며, 특히 지지체 온도가 $400^{\circ}C$일 때 치밀한 YSZ 박막을 형성할 수 있었다. 최적조건 하에서 정전분무법을 활용하면 약 $12{\mu}m/h $의 속도로 치밀한 YSZ 박막을 형성할 수 있었다. 제조된 박막은 XRD, FE-SEM, EDX 등을 이용하여 분석하였다.