• Journal of Welding and Joining
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• 제24권2호
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• pp.64-70
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• 2006

The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.

• 대한기계학회논문집B
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• 제34권9호
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• pp.825-834
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• 2010

사각공동내 자연대류 열전달 실험에서, 단열벽에 의해 열전달이 저하가 관찰되는 영역을 실험적으로 그리고 수치해석적으로 평가하였다. $Gr_H$ 수 $1.53\times10^7$부터 $1.01\times10^{10}$까지 변화시키며, 단열벽이 존재할 때와 그렇지 않을 때를 구분하여 열전달률을 측정하였다. FLUENT 실험의 결과를 예측할 수 있는지 확인하고 실험으로 수행하기 어려운 매우 좁은 영역에 대해 FLUENT를 수행하였다. 실험과 FLUENT의 결과를 다른 연구와 비교한 바 일치함을 보였다. 단열벽이 전체 열전달에 미치는 영향은 예상과 같이 단열벽 근처의 매우 좁은 영역에 국한하여 나타남을 확인하였다. 본 연구는 유사성(Analogy) 원리를 이용하여 열전달계를 전기도금계의 물질전달계로 모사하는 방법론을 개발하는 과정에서 실험을 효율화하고자 하는 방안을 강구하기 위하여 추진되었다. 본 연구를 통하여 단열벽간 거리(전극의 폭)를 매우 줄일 수 있는 이론적 근거를 확보하였다.

• 대한금속재료학회지
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• 제49권12호
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• pp.937-944
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• 2011

Studies have been carried out in order to reduce fuel-cladding chemical interaction (FCCI) behavior of metallic fuel in sodium-cooled fast reactors (SFR) using an electroplating technique. A $20{\mu}m$ thick Cr layer has been plated by the electrochemical method in the Sargent bath over the HT9 (12Cr-1Mo) clad material and diffusion couple tests of the U-10Zr metallic fuel as well as the rare earth alloy (70Ce-29La) have been conducted. The results show that the Cr plating can prevent FCCI behavior along the fuel-clad interface. However, cracks developed through the thickness during plating, which resulted in the migration of some fuel constituents. Variation of bath temperature, application of pulse current, and post heat treatment have been conducted to control such cracks. We found out that some conditions like the pulse current and the post heat treatment enhanced the layer property by reducing the internal cracks and improving the diffusion couple test.

• Corrosion Science and Technology
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• 제10권4호
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• pp.131-135
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• 2011

The demands of high-strength steel have been steadily increased to reduce the weight of vehicles. Although the TRIP steel has been the promising candidate material for the purpose, high strength hinders the application due to the susceptibility to hydrogen delayed fracture in the corrosive environment. Moreover, the testing method was not specified in the ISO standards. In this work, the test method to evaluate the susceptibility of hydrogen delayed fracture was studied by slow strain rate testing technique. The four test experimental parameters were studied : strain rate, hydrogen charging time, holding time after hydrogen charging, and holding time after cadmium plating. The steel was fractured by hydrogen in case the strain rate was in the range of $1{\times}10^{-4}{\sim}5{\times}10^{-7}/sec$. It was confirmed that the slow strain rate test is effective method to evaluate the susceptibility to hydrogen delayed fracture. The holding time over 24 hrs after hydrogen charging, nullified the hydrogen effect, that is, the specimen was no more susceptible to hydrogen after 24 hrs even though the specimen was fully hydrogen-charged. Moreover, cadmium electroplating could not prevent from diffusing out the hydrogen from the steel in the experiment. The effective experimental procedures were discussed.

• 공업화학
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• 제27권1호
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• pp.21-25
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• 2016

리드프레임에 구리합금소재를 사용할 경우 구리이외의 고농도의 철, 니켈, 아연 등이 포함되며 여기서 발생되는 에칭폐액은 지정폐기물로 지정되어 있다. 따라서 본 연구에서는 전기도금용 산화구리(II)를 제조하기 위해 고농도 중금속을 함유한 리드프레임 에칭폐액의 맞춤형 정제과정을 설계하였다. 리드프레임 에칭폐액의 경우 중금속 함유량이 높아 이온교환수지법 단독으로는 중금속을 제거하는데 한계가 있었다. 따라서 본 연구에서는 물에 대한 용해도차를 이용한 환원-산화법을 연계하여 염화구리(I)을 제조한 후 산화제인 과황산나트륨을 이용하여 염화구리(II)로 재회수하는 방법을 사용하였다. 최적 환원제로는 하이드라진을 선택하였고, 최적 첨가량은 구리 1.0 mol당 1.4 mol이다. 환원-산화법과 이온교환수지법을 연결하여 중금속을 제거할 경우 3회 반복 시 $Fe^{3+}$ (4.3 ppm), $Ni^{2+}$ (2.4 ppm), $Zn^{2+}$ (0.78 ppm)로 전기도금용 산화구리(II) 제조용 원료로 사용이 가능할 것으로 사료된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.416-417
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• 2007

MmSH injection molding method to fabricate light guiding plate with nano-sized pattern was developed. A stamper was fabricated through photolithography, dry etching, and electroplating processes. While the stamper with nano-sized pattern in mold was kept at $180^{\circ}C$ during injection process, that was cooled down to $90^{\circ}C$ quickly after the injection process. The nano-sized pattern on light guiding plate processed by MmSH injection molding method was well transferred from stamper compared to that processed by conventional injection molding process.

• 한국전기전자재료학회논문지
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• 제23권12호
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• pp.919-923
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• 2010

Copper pillar tin bump (CPTB) was developed for high density chip interconnect technology. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM -1250 dry film photoresist (DFR), copper electroplating method and Sn electro-less plating method. Mechanical shear strength measurements were introduced to characterize the bonding process as a function of thermo-compression. Shear strength has maximum value with $330^{\circ}C$ and 500 N thenno-compression process. Through the simulation work, it was proved that when the copper pillar tin bump decreased in its size, it was largely affected by the copper oxidation.

• 한국초전도ㆍ저온공학회논문지
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• 제12권1호
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• pp.1-5
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• 2010

Silver stabilizing layer of coated conductor has been prepared by dip coating method using organic silver complexes containing 10 wt% silver as a starting material. Coated silver complex layer was dried in situ with hot air and converted to crystalline silver by post heat treatment in flowing oxygen atmosphere. A dense continuous silver layer with good surface coverage and proper thickness of 230 nm is obtained by multiple dip coatings and heat treatments. The film heat treated at $500^{\circ}C$ showed good mechanical adhesion and crystallographic property. The interface resistivity between superconducting YBCO layer and silver layer prepared by dip coating was measured as $0.67\;{\times}\;10^{-13}\;{\Omega}m^2$. Additional protecting copper layer with the thickness of $20\;{\mu}m$ was successfully deposited by electroplating. The critical current measured with the specimen prepared by dip coating and sputtering on same quality YBCO layer showed similar value of ~140 A and proved its ability to replace sputtering method for industrial production of coated conductor.

• 한국환경보건학회지
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• 제28권2호
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• pp.109-116
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• 2002

The purpose of this study was to evaluate a new sampling and analytical method for the determination of airborne hexavalent chromium, Cr(Ⅵ), in a field plating operation. The procedures of this new method (Shin & Paik's Method) are as the following: Airborne hexavalent chromium is collected on polyvinyl chloride (PVC) filter according to the National Institute iota Occupational Safety and Health (NIOSH) Method 7600, and the filler sample is placed in a screw-capped vial and soaked with 2% NaOH/3% Na₂CO₃ solution immediately after sampling. The Cr(Ⅵ) sample is analyzed by ion chromatography/visible spectrophotometry (IC/VS) according to the U.S. Environmental Protection Agency (EPA) Method 218.6. The airborne Cr(Ⅵ) concentrations measured by this method were compared with those determined by three reference methods: One (NIOSH/EPA Method) consisted of sampling airborne Cr(Ⅵ) on PVC filters and storing the sample filters in strew-capped vials according to the NIOSH method, and analyzing Cr(Ⅵ) in samples using IC/VS according to the EPA method. The second method (Impinger Method/NaHCO₃) consisted of absorbing airborne Cr(Ⅵ) into 0.02 M NaHCO₃ solution in midget impinger, and analyzing the Cr(Ⅵ) in samples using IC/VS. The third method was the OSHA Method ID-215. Using these four different methods, lour replicates of air samples were collected at an electroplating process and analyzed simultaneously. Two-way ANOVA and paired t-test were used to test difference among values determined by the methods. There was no significant difference and a strong correlation (r²:0.99) between Cr(Ⅵ) concentrations measured by the Shin & Paik's Method and an impinger method (p>0.05). However, Cr(Ⅵ) concentrations determined by Shin & Paik's Method were significant1y different from those by the NIOSH/EPA Method (p<0.05) or the OSHA method (p<0.05). The Cr(Ⅵ) concentrations of Shin & Paik's Method were significantly higher than those of the NIOSH/EPA Method or the OSHA method. This result indicated that the Shin & Paik's Method may prevent Cr(Ⅵ) losses caused by reduction and give more reliable results of airborne Cr(Ⅵ) concentrations in work environments.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집D
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• pp.31-36
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• 2001

As a part of micro engine development feasibility estimation was done through fabrication and test of down scaled combustor and MEMS fabricated spark electrode. In an experimental observation of the down scaled combustion phenomena where flame propagation was observed by optical method and pressure change in combustor which gives the information about the reaction generated thermal energy was recorded and analyzed. Optimal combustor scale was derived to be about 2mm considering increased heat loss effect and thermal energy generation capability. Through the fabrication and discharge test of MEMS electrode effects of electrode width and gap was investigated. Electrode was fabricated by thick PR mold and electroplating. From the result discharge voltage characteristic in sub millimeter scale electrode having thickness of $40{\mu}m$ was obtained. From the result base technology for design and fabrication of micro engine was obtained.