• Transactions on Electrical and Electronic Materials
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• 제10권3호
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• pp.71-74
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• 2009

Electroplated Cu is a cost efficient metallization method in microelectronic packaging applications. Typically in 3-D chip staking technology, utilizing through silicon via (TSV), electroplated Cu metallization is inevitable for the throughput as well as reducing the cost of ownership (COO).To achieve a comparable film quality to sputtering or CVD, a pre-cleaning process as well as plating process is crucial. In this research, atmospheric plasma is employed to reduce the usage of chemicals, such as trichloroethylene (TCE) and sodium hydroxide (NaHO), by substituting the chemical assisted organic cleaning process with plasma surface treatment for Cu electroplating. By employing atmospheric plasma treatment, marginally acceptable electroplating and cleaning results are achieved without the use of hazardous chemicals. The experimental results show that the substitution of the chemical process with plasma treatment is plausible from an environmentally friendly aspect. In addition, plasma treatment on immersion Sn/Cu was also performed to find out the solderability of plasma treated Sn/Cu for practical industrial applications.

• Korean Chemical Engineering Research
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• 제43권1호
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• pp.53-59
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• 2005

본 연구에서는 계면활성제를 이용하여 초임계이산화탄소와 전해도금액의 매크로에멀젼을 형성한 후 양극과 음극을 통해 통전시켜 초임계에멀젼 전해도금을 수행하였다. 계면활성제로는 친이산화탄소기와 친수기를 동시에 지닌 sodium salt of bis (2,2,3,3,4,4,5,5-octafluoro-1-pentanol) sulfosuccinate를 사용하였으며 (+)극과 (-)극으로 니켈판과 구리판을 각각 사용하였다. 초임계매크로에멀젼 상태에서 도금된 니켈표면과 기존의 상압 상태에서 도금된 니켈표면을 비교해 본 결과 이산화탄소/니켈도금액 매크로에멀젼에 의해 도금된 니켈표면은 기존 방법에 의한 것보다 더 균일하였다. 계면활성제의 농도와 도금액 양이 도금에 미치는 영향을 살펴보기 위하여 도금액에 첨가한 계면활성제의 농도를 2, 4, 7 wt% 변화시켰으며 도금 반응셀 내에서 차지하는 도금액의 부피를 10 vol%에서 70 vol%까지 증가시켰다. 그리고 연속상의 영향을 알아보기 위하여 초임계이산화탄소 대신에 프로판을 사용하여 그 결과를 살펴보았다. 매크로에멀젼이 형성되는 농도 이상에서는 계면활성제의 농도가 높아질수록 전류량과 도금되는 니켈 양이 모두 감소하였으며, 도금액의 부피가 증가할수록 전류량과 전기전도도가 높아지고 도금되는 니켈 양이 증가하였다. 또한, 연속상의 경우, 프로판보다 이산화탄소가 우수한 도금효과를 보임을 알 수 있었다.

• 자원리싸이클링
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• 제22권3호
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• pp.91-99
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• 2013

우리나라 경제의 근간을 이루고 있는 철강산업, 자동차산업이나 전자산업에서 전기도금은 중요한 역할을 담당하고 있다. 전기도금 폐액은 전처리, 도금 및 후처리과정에서 발생하는 폐액이고 다양한 금속염을 포함한 유해한 폐수이다. 현재 일반적인 폐수는 환경법상 배수 규제치 이하로 중화처리한 후 각종 금속이 혼합된 슬러지는 매립하거나 위탁처리하고 있는데, 처리에 따른 막대한 비용이 들뿐만 아니라 매립지 부족과 유가금속 자원 낭비를 초래하고 있다. 따라서 이러한 폐수에서 유가금속을 회수하는 연구가 활발하게 진행되고 있다. 전기도금 폐액에서 금속을 선택적으로 회수하는 새로운 방법은 철산화세균을 이용하는 방법, 황화제를 이용한 황화물(MS) 회수법 및 유기용매를 이용한 용매추출법 등에 관한 연구가 진행되고 있다. 이들의 폐수처리방법을 이용하여 Fe, Cu, Zn, Ni 등의 금속이온이 혼합된 폐수에서 유가금속을 95%이상 회수하는 성과를 거두었다. 이는 전기도금공정에서 배출되는 폐수를 폐기할 것이 아니라 도시광산의 중요한 금속자원으로 활용될 것으로 기대된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.192-193
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electro less plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. In this paper, we investigated low-cost Ni/Cu contact formation by electro less and electroplating for crystalline silicon solar cells.

• 마이크로전자및패키징학회지
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• 제13권4호
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• pp.45-50
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• 2006

3D package의 SiP에서 구리의 via filling은 매우 중요한 사항으로 package밀도가 높아짐에 따라 via의 크기가 줄어들며 전기도금법을 이용한 via filling이 연구되어왔다. Via filling시 via 내부에 결함이 발생하기 쉬운데 전해액 내에 억제제, 가속제등 첨가제를 첨가하고 펄스-역펄스(PRC)의 전류파형을 인가하여 결함이 없는 via의 filling이 가능하다. 본 연구에서는 건식 식각 방법 중 하나인 DRIE법을 이용하여 깊이 $100{\sim}190\;{\mu}m$, 직경이 각각 $50{\mu}m,\;20{\mu}m$인 2가지 형태의 via을 형성하였다. DRIE로 via가 형성된 Si wafer위에 IMP System으로 Cu의 Si으로 확산을 막기 위한 Ta층과 전해도금의 씨앗층인 Cu층을 형성하였다. Via시편은 직류, 펄스-역펄스의 전류 파형과 억제제, 가속제, 억제제의 첨가제를 모두 사용하여 filling을 시도하였고, 공정 후 via의 단면을 경면 가공하여 SEM으로 관찰하였다.

• 한국표면공학회지
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• 제39권4호
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• pp.160-165
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• 2006

Ni-SiC composite coating layers were prepared by electroplating method and their deposition rate, codeposition of SiC, morphology, surface roughness, hardness, wear and friction properties were investigated. It was found that the deposition rate and the codeposition of SiC in the composite coating layer increased with increasing concentration of SiC in the solution only at the early stage. Both of them reached certain maxima and then decreased with increasing concentration of SiC. Rough surface was obtained with increasing codeposition of SiC, which is probably due to the agglomeration of the SiC particle in the vicinity of surface. Vickers hardness increased with increasing codeposition of SiC and heat treatment at $300^{\circ}C$ in air for 1 hour. Wear volume decreased with increasing codeposition of SiC and friction coefficient increased with increasing codeposition of SiC at the early stage, and it became almost constant. Such wear and friction behaviors are desirable for the practical application.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.314-317
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• 2006

Electroformed part is widely used in modem manufacturing industries, especially semi-conductor division. It is basically a specialized form of electroplating. So, it has very similar parameters with electroplating. The object of this study is development of the fine metal mask by electroforming process. In this paper considered two parameters. The first is relationship of UV exposure and soft baking time. The other one is thickness uniformity of electroformed parts by distance of between electrodes. This paper presents the fabrication method of fine metal mask by electroforming process.

• 대한임상독성학회지
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• 제4권1호
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• pp.55-57
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• 2006

Cyanides and Hydrogen cyanide are used in production of chemicals, electroplating, photographic development, making plastics, fumigating ships, and some mining processes. We experienced of Hydrogen cyanide inhalation injury. A 45-year-old man worked at electroplating. As soon as he mixed sodium cyanide with acid, cyanide produced hydrogen cyanide, occasionally he inhaled Hydrogen cyanide and he lost his consciousness. He was moved to near hospital and took emergency treatment and then was transferred to our hospital. On arrival he had severe dyspnea, metabolic acidosis, and tachycardia. After he was treated with supportive method he recovered his consciousness in 20 hours at emergency room.

• 한국정밀공학회지
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• 제23권2호
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• pp.138-145
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• 2006

An injection molding is necessary to mass-product for micro-nano system, so micro-nano mold must be developed for injection molding. The micro-nano mold has precision and strength to overcome a surround of injection. So in this paper, two methods were used. First, after etching the Al, Ni was electroplated in etched AI. The other, LIGA method was used. A temperature and thickness of Ni are important factors in these methods. So after fabrication, the simulation was processed to find optimal thickenss of Ni and temperature.

• Journal of Welding and Joining
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• 제31권3호
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• pp.11-16
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• 2013

Through-silicon-via (TSV) is a major technology in microelectronics for three dimensional high density packaging. The 3-dimensional TSV technology is applied to CMOS sensors, MEMS, HB-LED modules, stacked memories, power and analog, SIP and so on which can be employed to car electronics. The copper electroplating is widely used in the TSV filling process. In this paper, the various Cu filling methods using the control of the plating process were described in detail including recent studies. Via filling behavior by each method was also introduced.