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Development of Micro mold with Electroplating Ni for Injection molding  

Hwang, Kyo-Il (성균관대학교 기계공학부 Microsystem Lab.)
Kim, Hun-Mo (성균관대학교 기계공학부)
Publication Information
Journal of the Korean Society for Precision Engineering / v.23, no.2, 2006 , pp. 138-145 More about this Journal
Abstract
An injection molding is necessary to mass-product for micro-nano system, so micro-nano mold must be developed for injection molding. The micro-nano mold has precision and strength to overcome a surround of injection. So in this paper, two methods were used. First, after etching the Al, Ni was electroplated in etched AI. The other, LIGA method was used. A temperature and thickness of Ni are important factors in these methods. So after fabrication, the simulation was processed to find optimal thickenss of Ni and temperature.
Keywords
Micro mold; Electroplating; LIGA; Injection molding;
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