• Journal of Welding and Joining
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• v.24 no.2
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• pp.64-70
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• 2006

The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.34 no.9
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• pp.825-834
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• 2010

In this study, we investigated the effects of adiabatic walls on natural convection in various rectangular cavities experimentally and numerically. Heat transfer rates were measured for cavities with and without adiabatic sidewalls by varying Grashof number from $1.53\times10^7$ to $1.01\times10^{10}$. Some typical test results were successfully simulated using FLUENT. In the case of very narrow cavities, where the adiabatic walls were very close to each other, it was difficult to perform experiments; therefore, FLUENT simulations were performed. The existing heat transfer correlations for rectangular cavities were well predicted by the experimental and numerical results. As expected, the effects of adiabatic walls were restricted to the very narrow region near the walls. This study was carried out during the development of an analogy experimental method in which heat-transfer systems are replaced with mass-transfer systems using copper sulfate electroplating systems. The results of this study provide theoretical background of handling adiabatic walls during the design of test facilities.

• Korean Journal of Metals and Materials
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• v.49 no.12
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• pp.937-944
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• 2011

Studies have been carried out in order to reduce fuel-cladding chemical interaction (FCCI) behavior of metallic fuel in sodium-cooled fast reactors (SFR) using an electroplating technique. A $20{\mu}m$ thick Cr layer has been plated by the electrochemical method in the Sargent bath over the HT9 (12Cr-1Mo) clad material and diffusion couple tests of the U-10Zr metallic fuel as well as the rare earth alloy (70Ce-29La) have been conducted. The results show that the Cr plating can prevent FCCI behavior along the fuel-clad interface. However, cracks developed through the thickness during plating, which resulted in the migration of some fuel constituents. Variation of bath temperature, application of pulse current, and post heat treatment have been conducted to control such cracks. We found out that some conditions like the pulse current and the post heat treatment enhanced the layer property by reducing the internal cracks and improving the diffusion couple test.

• Corrosion Science and Technology
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• v.10 no.4
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• pp.131-135
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• 2011

The demands of high-strength steel have been steadily increased to reduce the weight of vehicles. Although the TRIP steel has been the promising candidate material for the purpose, high strength hinders the application due to the susceptibility to hydrogen delayed fracture in the corrosive environment. Moreover, the testing method was not specified in the ISO standards. In this work, the test method to evaluate the susceptibility of hydrogen delayed fracture was studied by slow strain rate testing technique. The four test experimental parameters were studied : strain rate, hydrogen charging time, holding time after hydrogen charging, and holding time after cadmium plating. The steel was fractured by hydrogen in case the strain rate was in the range of $1{\times}10^{-4}{\sim}5{\times}10^{-7}/sec$. It was confirmed that the slow strain rate test is effective method to evaluate the susceptibility to hydrogen delayed fracture. The holding time over 24 hrs after hydrogen charging, nullified the hydrogen effect, that is, the specimen was no more susceptible to hydrogen after 24 hrs even though the specimen was fully hydrogen-charged. Moreover, cadmium electroplating could not prevent from diffusing out the hydrogen from the steel in the experiment. The effective experimental procedures were discussed.

• Applied Chemistry for Engineering
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• v.27 no.1
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• pp.21-25
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• 2016

When copper alloy is used in etching process for the production of lead frame, the high concentration of heavy metals, such as iron, nickel and zinc may be included in the etching waste. Those etching waste is classified as a specified one. Therefore a customized design was designed for the purification process of the lead frame etching waste liquid containing high concentrations of heavy metals for the production of an electroplating copper(II) oxide. Since the lead frame etching waste solution contains highly concentrated heavy metal species, an ion exchange method is difficult to remove all heavy metals. In this study, a copper(I) chloride was manufactured by using water solubility difference related to the reduction-oxidation method followed by the reunion of copper(II) chloride using sodium sulfate as an oxidant. The hydrazine was chosen as a reducing agent. The optimum added amount was 1.4 mol per 1.0 mol of copper. In the case of removal of heavy metals by using the combination of reduction-oxidation and ion exchange resin methods, 4.3 ppm of $Fe^{3+}$, 2.4 ppm of $Ni^{2+}$ and 0.78 ppm of $Zn^{2+}$ can be reused as raw materials for electroplating copper(II) oxide when repeated three times.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.416-417
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• 2007

MmSH injection molding method to fabricate light guiding plate with nano-sized pattern was developed. A stamper was fabricated through photolithography, dry etching, and electroplating processes. While the stamper with nano-sized pattern in mold was kept at $180^{\circ}C$ during injection process, that was cooled down to $90^{\circ}C$ quickly after the injection process. The nano-sized pattern on light guiding plate processed by MmSH injection molding method was well transferred from stamper compared to that processed by conventional injection molding process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.12
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• pp.919-923
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• 2010

Copper pillar tin bump (CPTB) was developed for high density chip interconnect technology. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM -1250 dry film photoresist (DFR), copper electroplating method and Sn electro-less plating method. Mechanical shear strength measurements were introduced to characterize the bonding process as a function of thermo-compression. Shear strength has maximum value with $330^{\circ}C$ and 500 N thenno-compression process. Through the simulation work, it was proved that when the copper pillar tin bump decreased in its size, it was largely affected by the copper oxidation.

• Progress in Superconductivity and Cryogenics
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• v.12 no.1
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• pp.1-5
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• 2010

Silver stabilizing layer of coated conductor has been prepared by dip coating method using organic silver complexes containing 10 wt% silver as a starting material. Coated silver complex layer was dried in situ with hot air and converted to crystalline silver by post heat treatment in flowing oxygen atmosphere. A dense continuous silver layer with good surface coverage and proper thickness of 230 nm is obtained by multiple dip coatings and heat treatments. The film heat treated at $500^{\circ}C$ showed good mechanical adhesion and crystallographic property. The interface resistivity between superconducting YBCO layer and silver layer prepared by dip coating was measured as $0.67\;{\times}\;10^{-13}\;{\Omega}m^2$. Additional protecting copper layer with the thickness of $20\;{\mu}m$ was successfully deposited by electroplating. The critical current measured with the specimen prepared by dip coating and sputtering on same quality YBCO layer showed similar value of ~140 A and proved its ability to replace sputtering method for industrial production of coated conductor.

• Journal of Environmental Health Sciences
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• v.28 no.2
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• pp.109-116
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• 2002

The purpose of this study was to evaluate a new sampling and analytical method for the determination of airborne hexavalent chromium, Cr(Ⅵ), in a field plating operation. The procedures of this new method (Shin & Paik's Method) are as the following: Airborne hexavalent chromium is collected on polyvinyl chloride (PVC) filter according to the National Institute iota Occupational Safety and Health (NIOSH) Method 7600, and the filler sample is placed in a screw-capped vial and soaked with 2% NaOH/3% Na₂CO₃ solution immediately after sampling. The Cr(Ⅵ) sample is analyzed by ion chromatography/visible spectrophotometry (IC/VS) according to the U.S. Environmental Protection Agency (EPA) Method 218.6. The airborne Cr(Ⅵ) concentrations measured by this method were compared with those determined by three reference methods: One (NIOSH/EPA Method) consisted of sampling airborne Cr(Ⅵ) on PVC filters and storing the sample filters in strew-capped vials according to the NIOSH method, and analyzing Cr(Ⅵ) in samples using IC/VS according to the EPA method. The second method (Impinger Method/NaHCO₃) consisted of absorbing airborne Cr(Ⅵ) into 0.02 M NaHCO₃ solution in midget impinger, and analyzing the Cr(Ⅵ) in samples using IC/VS. The third method was the OSHA Method ID-215. Using these four different methods, lour replicates of air samples were collected at an electroplating process and analyzed simultaneously. Two-way ANOVA and paired t-test were used to test difference among values determined by the methods. There was no significant difference and a strong correlation (r²:0.99) between Cr(Ⅵ) concentrations measured by the Shin & Paik's Method and an impinger method (p>0.05). However, Cr(Ⅵ) concentrations determined by Shin & Paik's Method were significant1y different from those by the NIOSH/EPA Method (p<0.05) or the OSHA method (p<0.05). The Cr(Ⅵ) concentrations of Shin & Paik's Method were significantly higher than those of the NIOSH/EPA Method or the OSHA method. This result indicated that the Shin & Paik's Method may prevent Cr(Ⅵ) losses caused by reduction and give more reliable results of airborne Cr(Ⅵ) concentrations in work environments.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.31-36
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• 2001

As a part of micro engine development feasibility estimation was done through fabrication and test of down scaled combustor and MEMS fabricated spark electrode. In an experimental observation of the down scaled combustion phenomena where flame propagation was observed by optical method and pressure change in combustor which gives the information about the reaction generated thermal energy was recorded and analyzed. Optimal combustor scale was derived to be about 2mm considering increased heat loss effect and thermal energy generation capability. Through the fabrication and discharge test of MEMS electrode effects of electrode width and gap was investigated. Electrode was fabricated by thick PR mold and electroplating. From the result discharge voltage characteristic in sub millimeter scale electrode having thickness of $40{\mu}m$ was obtained. From the result base technology for design and fabrication of micro engine was obtained.