• 전자공학회논문지A
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• 제32A권1호
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• pp.159-165
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• 1995

A double-heterostructure mesa-stripe-geometry laser diode integrated with thermoelectric Peltier cooler has been designed and fabricated. Epi-layers have been grown by metal organic chemical vapor deposition(MOCVD) method. Peltier cooling effect has been measured for devices with a mesa width of 14$\mu$m and a cavity length of 380$\mu$m. The effects of thermoelectric cooling could be shown by measuring the optical output of the laser with the increase of the current in the thermoelectric cooler. While the input courrent of the laser was maintained at 250mA, the optical output was decreased from 4.8mW to 3.8mW due to heating, but with the thermoelectric cooler on the optical output power was recovered by more than 40%. The results show that the complicated cooling device is not needed since the cooling can be achevied by the developement of the fabrication processing.

• 설비공학논문집
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• 제15권6호
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• pp.454-460
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• 2003

In order to investigate the cooling and heating characteristics of a variable-capacity system A/C applying a digital scroll compressor, the cooling and heating capacities and COP are measured by the psychrometric calorimeter. The capacity of the system is controlled by the digital scroll compressor, which is operated by controling PWM valve and the loading vs. unloading time. In the case of unloading compared that of loading, the consumption power of the compressor is about 11% and the capacity variation of the system A/C is within about 1%. When the system A/C is operated under the cooling and heating standard conditions, COP is nearly uniform but cooling capacity and heating capacity increase at minimum, rated and maximum modes. The system A/C applying the digital scroll compressor is effective for the range with high load or the width of large load variation. When the auxiliary heater is on, at the cold region, the system A/C produces the excellent heating capacity.

• 대한전자공학회논문지
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• 제13권4호
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• pp.6-11
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• 1976

beewax와 polyethylene을 혼합한 모체에 탄색 및 연분말을 징량첨가시켜서 정특성감온소자를 제조하였다. C.(beewax·Polyethylene)시편은 온도범위 20°∼90℃에서 104-1010Ωcm의 PTC특성을 나타내었으며 제조과정상에 분말혼합 및 가압냉각방법를 도입함으로써 그 재현성과 안정성을 현저히 개선시킬 수 있었다. 또한 Fe-(betwax· polyethylene)시편은 같은 온도범위에서 102-1010Ωcm의 PTC특성을 나타내었으며 저저항범위에서 PTC효과를 얻을 수 있었다. The carbon (the iron) -beewax·polyethylene thermistors have been prepared by heating the well ground mixture of carbon (iron), beewax and polyethylene at 160℃ for one hour and by cooling it under pressure of 12kgw/cm2. The resistivity for the former (the latter) increased from 102Ω·cm (104Ω·cw) to 1010Ω·cm(1010Ω·cm) as temperature changed from 20℃ to 90℃. The resistivity, 102Ω·cm at room temperature for the former, was lower by order Q( two than that for the papostor made by the earlier reporter. The reproducibility, which has been an important Problem for this type of thermistors to be industrialized, was improved by introducing pressure in cooling procedure for both carbon and iron thermistors.

• 반도체디스플레이기술학회지
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• 제20권2호
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• pp.19-24
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• 2021

As the size of semiconductor devices decreases, the etching pattern becomes very narrow and a deep high aspect ratio process becomes important. The cryogenic etching process enables high aspect ratio etching by suppressing the chemical reaction of reactive ions on the sidewall while maintaining the process temperature of -100℃. ESC is an important part for temperature control in cryogenic etching equipment. Through the cooling path inside the ESC, liquid nitrogen is used as cooling water to create a cryogenic environment. And since the ESC directly contacts the wafer, it affects the temperature uniformity of the wafer. The temperature uniformity of the wafer is closely related to the yield. In this study, the cooling path was designed and analyzed so that the wafer could have a uniform temperature distribution. The optimal cooling path conditions were obtained through the analysis of the shape of the cooling path and the change in the speed of the coolant. Through this study, by designing ESC with optimal temperature uniformity, it can be expected to maximize wafer yield in mass production and further contribute to miniaturization and high performance of semiconductor devices.

• 대한기계학회논문집B
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• 제22권2호
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• pp.253-266
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• 1998

A numerical study on the cooling performance for electronic components mounted with heat sink in an electronic system has been performed. The model of electronic system consisted with lower and upper modules in which the electronic components mounted with heat sink were arrayed. To find better configuration under a given fan power for effective cooling, the cases called 'No heat sink','Both heat sinks','Lower heat sinks', and 'Upper heat sinks' were tested. The results showed that the cooling performance in 'Upper heat sinks' was the best among four cases.

• 한국기계가공학회지
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• 제20권11호
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• pp.60-66
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• 2021

The antenna transmits and receives signals has a number of electronics that generate heat. For cooling, four fans and airways circulate air inside the antenna-equipped housing to exchange heat from the cooling plate assembly. In this study, fluid analysis was conducted to assess the suitability of the cooling system. The electronic components of the antenna exhibited temperature values lower than the maximum operating temperature of the components, which showed that the cooling system for the antenna had sufficient performance.

• 한국컴퓨터정보학회논문지
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• 제16권7호
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• pp.1-11
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• 2011

사용자들의 높은 요구 사항을 만족시키는 컴퓨팅 시스템을 개발하기 위해 프로세서의 성능을 향상시키기 위한 연구는 지속적으로 진행되어 왔다. 공정 기술 발달을 비롯한 다양한 기술 발전을 통하여 프로세서의 성능은 비약적으로 발전하였으나 그 이면에는 새로운 문제들이 발생하게 되었다. 그 중에서, 최근 들어 주된 문제점 중 하나로 인식되고 있는 열섬 현상은 칩의 신뢰성에 심각한 영향을 미치기 때문에 프로세서 설계 시 성능, 전력 효율성과 함께 반드시 고려되어야 한다. 과거에는 기계적인 냉각 기법으로 프로세서의 온도를 효과적으로 제어할 수 있었지만, 최근에는 프로세서의 성능이 높아져 발생되는 온도가 높아 냉각 비용이 급속히 증가하고 있다. 이로 인해, 최근의 온도 제어 연구는 기계적인 냉각 기법보다는 구조적 기법을 통한 온도 제어에 더욱 집중되는 추세를 보이고 있다. 하지만, 구조적 기법을 통해 온도를 제어하는 방안은 프로세서의 온도를 낮추는 데에는 효율적이지만 이를 위해 성능을 희생한다는 단점이 존재한다. 따라서, 기계적 냉각 기법을 통해 프로세서의 온도를 효율적으로 제어할 수 있다면, 성능 저하가 발생되는 구조적 기법을 통한 온도 제어기법의 사용 빈도가 줄어 그 만큼 성능이 향상될 수 있을 것으로 기대된다. 본 논문에서는 고성능 멀티코어 프로세서에서 발생하는 온도를 기계적인 냉각 기법이 얼마나 효율적으로 제어할 수 있는지를 상세하게 분석해 보고자 한다. 공랭식 냉각기와 수랭식 냉각기를 이용하여 다양한 실험을 수행한 결과, 공랭식 냉각기와 비교하여 수랭식 냉각기가 온도를 효과적으로 제어하는 반면에 전력 소모가 더 많음을 확인할 수 있다. 특히, 1W의 전력을 통해 낮출 수 있는 온도를 분석해 보면 공랭식에 비해서 수랭식이 더 효율적임을 알 수 있으며, 수랭식 냉각기의 경우에는 냉각 단계가 냉각 효율은 오히려 감소하게 됨을 확인할 수 있다. 실험 결과를 바탕으로 온도에 따라 적절하게 기계적 냉각 기법을 활용한다면 프로세서의 온도를 더욱 효과적으로 제어할 수 있을 것으로 기대된다.

• 전자통신동향분석
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• 제38권6호
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• pp.41-51
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• 2023

Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

• 설비공학논문집
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• 제21권5호
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• pp.297-304
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• 2009

The aim of this study is to investigate the cooling performance of ground source multi-heat pump systems with a vertical single U-tube GLHX(U-tube system) and a vertical double tube GLHX(double tube system), which were installed in a school building located in Cheonan. All systems were operated in a part load conditions for all day, and the maximum COP of the single U-tube system and the double tube system were 6.2 and 5.2 at cooling mode, respectively. The double tube GLHX designed by the GLHEPRO, commercial program, was estimated to have the same performance as the U-tube GLHX, because the inlet temperatures of each outdoor unit heat exchanger for the former was similar to the latter. However, it is needed to prove the long tenn performance. It is suggested that the new algorithms to control the flow rate of secondary fluid for GLHX according to load variation have to be developed in order to enhance the performance of the system.

• ETRI Journal
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• 제20권3호
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• pp.284-300
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• 1998

A new thermosyphon cooling module (TSCM) has designed, fabricated and tested to cool the multi-chip module consists of a cold plate and an integrated condenser. With an allowable temperature rise of $56^{\circ}C$ on the surface of the heater, the cooling module TSCM can handle a heat flux of about 2.7 $W/cm^2$ using R11 as working fluid. The transient characteristics of the cooling module have been proved to be excellent: that is, when a heat load is applied inside of the system, steady state can be achieved within 10 to 15 minutes. It has been found that the length of the vapor channel between the cold plate and the condenser in addition to the ambient and the condenser temperatures affect the system performance.