Cooling performance of an electronic system including electronic components mounted with heat sink

히트 싱크 부착 전자부품을 가진 통신시스템의 냉각성능 연구

A numerical study on the cooling performance for electronic components mounted with heat sink in an electronic system has been performed. The model of electronic system consisted with lower and upper modules in which the electronic components mounted with heat sink were arrayed. To find better configuration under a given fan power for effective cooling, the cases called 'No heat sink','Both heat sinks','Lower heat sinks', and 'Upper heat sinks' were tested. The results showed that the cooling performance in 'Upper heat sinks' was the best among four cases.