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Temperature Analysis of Electrostatic Chuck for Cryogenic Etch Equipment  

Du, Hyeon Cheol (Department of Electronics Engineering, Myongji University)
Hong, Sang Jeen (Department of Electronics Engineering, Myongji University)
Publication Information
Journal of the Semiconductor & Display Technology / v.20, no.2, 2021 , pp. 19-24 More about this Journal
Abstract
As the size of semiconductor devices decreases, the etching pattern becomes very narrow and a deep high aspect ratio process becomes important. The cryogenic etching process enables high aspect ratio etching by suppressing the chemical reaction of reactive ions on the sidewall while maintaining the process temperature of -100℃. ESC is an important part for temperature control in cryogenic etching equipment. Through the cooling path inside the ESC, liquid nitrogen is used as cooling water to create a cryogenic environment. And since the ESC directly contacts the wafer, it affects the temperature uniformity of the wafer. The temperature uniformity of the wafer is closely related to the yield. In this study, the cooling path was designed and analyzed so that the wafer could have a uniform temperature distribution. The optimal cooling path conditions were obtained through the analysis of the shape of the cooling path and the change in the speed of the coolant. Through this study, by designing ESC with optimal temperature uniformity, it can be expected to maximize wafer yield in mass production and further contribute to miniaturization and high performance of semiconductor devices.
Keywords
Electrostatic chuck (ESC); Cryogenic etch; DRIE; HARC; Temperature uniformity;
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