• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.1
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• pp.159-165
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• 1995

A double-heterostructure mesa-stripe-geometry laser diode integrated with thermoelectric Peltier cooler has been designed and fabricated. Epi-layers have been grown by metal organic chemical vapor deposition(MOCVD) method. Peltier cooling effect has been measured for devices with a mesa width of 14$\mu$m and a cavity length of 380$\mu$m. The effects of thermoelectric cooling could be shown by measuring the optical output of the laser with the increase of the current in the thermoelectric cooler. While the input courrent of the laser was maintained at 250mA, the optical output was decreased from 4.8mW to 3.8mW due to heating, but with the thermoelectric cooler on the optical output power was recovered by more than 40%. The results show that the complicated cooling device is not needed since the cooling can be achevied by the developement of the fabrication processing.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.15 no.6
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• pp.454-460
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• 2003

In order to investigate the cooling and heating characteristics of a variable-capacity system A/C applying a digital scroll compressor, the cooling and heating capacities and COP are measured by the psychrometric calorimeter. The capacity of the system is controlled by the digital scroll compressor, which is operated by controling PWM valve and the loading vs. unloading time. In the case of unloading compared that of loading, the consumption power of the compressor is about 11% and the capacity variation of the system A/C is within about 1%. When the system A/C is operated under the cooling and heating standard conditions, COP is nearly uniform but cooling capacity and heating capacity increase at minimum, rated and maximum modes. The system A/C applying the digital scroll compressor is effective for the range with high load or the width of large load variation. When the auxiliary heater is on, at the cold region, the system A/C produces the excellent heating capacity.

• Journal of the Korean Institute of Telematics and Electronics
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• v.13 no.4
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• pp.6-11
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• 1976

The carbon (the iron) -beewax.polyethylene thermistors have been prepared by heating the well ground mixture of carbon (iron), beewax and polyethylene at 16$0^{\circ}C$ for one hour and by cooling it under pressure of 12kgw/cm2. The resistivity for the former (the latter) increased from 102$\Omega$.cm (104$\Omega$.cw) to 1010$\Omega$.cm(1010$\Omega$.cm) as temperature changed from 2$0^{\circ}C$ to 9$0^{\circ}C$. The resistivity, 102$\Omega$.cm at room temperature for the former, was lower by order Q( two than that for the papostor made by the earlier reporter. The reproducibility, which has been an important Problem for this type of thermistors to be industrialized, was improved by introducing pressure in cooling procedure for both carbon and iron thermistors.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.19-24
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• 2021

As the size of semiconductor devices decreases, the etching pattern becomes very narrow and a deep high aspect ratio process becomes important. The cryogenic etching process enables high aspect ratio etching by suppressing the chemical reaction of reactive ions on the sidewall while maintaining the process temperature of -100℃. ESC is an important part for temperature control in cryogenic etching equipment. Through the cooling path inside the ESC, liquid nitrogen is used as cooling water to create a cryogenic environment. And since the ESC directly contacts the wafer, it affects the temperature uniformity of the wafer. The temperature uniformity of the wafer is closely related to the yield. In this study, the cooling path was designed and analyzed so that the wafer could have a uniform temperature distribution. The optimal cooling path conditions were obtained through the analysis of the shape of the cooling path and the change in the speed of the coolant. Through this study, by designing ESC with optimal temperature uniformity, it can be expected to maximize wafer yield in mass production and further contribute to miniaturization and high performance of semiconductor devices.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.22 no.2
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• pp.253-266
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• 1998

A numerical study on the cooling performance for electronic components mounted with heat sink in an electronic system has been performed. The model of electronic system consisted with lower and upper modules in which the electronic components mounted with heat sink were arrayed. To find better configuration under a given fan power for effective cooling, the cases called 'No heat sink','Both heat sinks','Lower heat sinks', and 'Upper heat sinks' were tested. The results showed that the cooling performance in 'Upper heat sinks' was the best among four cases.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.11
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• pp.60-66
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• 2021

The antenna transmits and receives signals has a number of electronics that generate heat. For cooling, four fans and airways circulate air inside the antenna-equipped housing to exchange heat from the cooling plate assembly. In this study, fluid analysis was conducted to assess the suitability of the cooling system. The electronic components of the antenna exhibited temperature values lower than the maximum operating temperature of the components, which showed that the cooling system for the antenna had sufficient performance.

• Journal of the Korea Society of Computer and Information
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• v.16 no.7
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• pp.1-11
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• 2011

Many researchers have studied on the methods to improve the processor performance. However, high integrated semiconductor technology for improving the processor performance causes many problems such as battery life, high power density, hotspot, etc. Especially, as hotspot has critical impact on the reliability of chip, thermal problems should be considered together with performance and power consumption when designing high-performance processors. To alleviate the thermal problems of processors, there have been various researches. In the past, mechanical cooling methods have been used to control the temperature of processors. However, up-to-date microprocessors causes severe thermal problems, resulting in increased cooling cost. Therefore, recent studies have focused on architecture-level thermal-aware design techniques than mechanical cooling methods. Even though architecture-level thermal-aware design techniques are efficient for reducing the temperature of processors, they cause performance degradation inevitably. Therefore, if the mechanical cooling methods can manage the thermal problems of processors efficiently, the performance can be improved by reducing the performance degradation due to architecture-level thermal-aware design techniques such as dynamic thermal management. In this paper, we analyze the cooling efficiency of high-performance multicore processors according to mechanical cooling methods. According to our experiments using air cooler and liquid cooler, the liquid cooler consumes more power than the air cooler whereas it reduces the temperature more efficiently. Especially, the cost for reducing $1^{\circ}C$ is varied by the environments. Therefore, if the mechanical cooling methods can be used appropriately, the temperature of high-performance processors can be managed more efficiently.

• Electronics and Telecommunications Trends
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• v.38 no.6
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• pp.41-51
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• 2023

Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.21 no.5
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• pp.297-304
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• 2009

The aim of this study is to investigate the cooling performance of ground source multi-heat pump systems with a vertical single U-tube GLHX(U-tube system) and a vertical double tube GLHX(double tube system), which were installed in a school building located in Cheonan. All systems were operated in a part load conditions for all day, and the maximum COP of the single U-tube system and the double tube system were 6.2 and 5.2 at cooling mode, respectively. The double tube GLHX designed by the GLHEPRO, commercial program, was estimated to have the same performance as the U-tube GLHX, because the inlet temperatures of each outdoor unit heat exchanger for the former was similar to the latter. However, it is needed to prove the long tenn performance. It is suggested that the new algorithms to control the flow rate of secondary fluid for GLHX according to load variation have to be developed in order to enhance the performance of the system.

• ETRI Journal
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• v.20 no.3
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• pp.284-300
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• 1998

A new thermosyphon cooling module (TSCM) has designed, fabricated and tested to cool the multi-chip module consists of a cold plate and an integrated condenser. With an allowable temperature rise of $56^{\circ}C$ on the surface of the heater, the cooling module TSCM can handle a heat flux of about 2.7 $W/cm^2$ using R11 as working fluid. The transient characteristics of the cooling module have been proved to be excellent: that is, when a heat load is applied inside of the system, steady state can be achieved within 10 to 15 minutes. It has been found that the length of the vapor channel between the cold plate and the condenser in addition to the ambient and the condenser temperatures affect the system performance.