• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.551-552
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• 2008

This paper presets a results of frequency response in variation of wire bonding length. A gold ball bonding is used as a wire bonding process, and a DPDT(double pole double thru) switch is adapted as a device for test. Wire length is ranged from 442um to 833um and a measured frequency range is from 1 GHz to 6 GHz. Little difference are measured in insertion loss and return loss depending on wire length. Measured S21 and S11 are -0.58 dB and -17.7 dB, respectively. S21 insertion loss is rising up and S11 insertion loss is falling down as the frequency is increased.

• Proceedings of the IEEK Conference
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• 2004.06b
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• pp.541-544
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• 2004

This paper presents a new circuit panitioning algorithm using wire redundancy removal. This algorithm consist of the two steps. In the first step. We propose a new IIP(Iterative Improvement Partitioning) technique that selects the method to choice cells according to improvement status using two kinds of bucket structures, the one kept by total gain, and the other by updated gain. In the second step, we select the target wire in the cut-set. We add a alternative wire in the circuit to remove the target wire. For this we use wire redundancy removal and addition method The experimental results on MCNC benchmark circuits show improvement up to $41-50\%$ in cut-size over previous algorithms

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.4-4
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• 2009

Surface analysis on defective wire-bonding pads are performed in flash memory assembly. Week wire bonding may cause a significant effect on the final product reliability, and the surface condition of the aluminum bond pads is critical in terms of product reliability. To find out possible week bonding on semiconductor interconnects, ball sheer test (BST) has been performed. On some defective or week bonded pads, we have investigated the surface contents, assuming that the week bonding is induced from the surface conditions. AES and XPS are employed for the quantitative surface analysis on defective dies.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.3
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• pp.23-27
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• 1999

A lot of electronic parts are used for recent vehicles. If electronic parts break down, it will bring passenger to fatal wound. The very representative trouble of electronic parts is a cut aluminium wire of a hybrid IC. In this study, I analyzed a cause of cut aluminium wire and the main results obtained on this study are summarized as follows; (1) The forces acting on the aluminium wire are because of thermal expansion of a resin. (2) The forces acting on the aluminium wire are obtained by the theoretical analysis and those results are agree well with those of the FEM.

• Transactions on Electrical and Electronic Materials
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• v.17 no.4
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• pp.231-234
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• 2016

The AC insulation breakdown voltage was investigated for seven types of winding coils made of polyamideimide (PAI), flexural PAI (nanosilica 5 wt%) and anti-corona PAI (nanosilica 15 wt%) wires with various winding coil diameters of φ5, φ15 and φ25 mm. The winding coil was made of enameled wire with an enamel thickness of 30~50 μm, and the rectangular copper wire had a thickness of 0.77~ to 0.83 mm and width of 1.17~ to 1.23 mm, respectively. The insulation breakdown voltages of the original PAI coils with diameters of φ5, φ15 and φ25 mm were 7.30, 6.58, and 5.95 kV, respectively, and those values decreased as the winding coil diameter increased, regardless of the wire types.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.04a
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• pp.21-24
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• 2002

In this paper, for the study on the fabrication of YBCO superconductor wire, a double layered YBCO superconductor wire was fabricated by electrophoretic method on metal Ag wire(${\Psi}$0.8 mm). On the basis of previous researches for the fabrication of superconductor wire, the acetone suspension solution with 8 vol.% of 1% PEG(1000) was used and high molecular adhesive was experimentally performed for an improvement of the critical current density of superconductor wire. It was found that the Ag inter-layer deposited on the superconductor wire affect to the state of second YBCO film and its critical current density.

• IE interfaces
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• v.9 no.1
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• pp.63-71
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• 1996

A wire harness is an assembly cables and/or wires to transmit signals between electronic assemblies in automobiles and electronic appliances. Inspection of such a wire harness is to check the sequence of assembled cabled each of which is identified by its own color. This paper presents an automated visual inspection system for wire harnesses incorporating back-propagation neural network as a color identification device. The tests performed by using real test specimens show that the inspection system works well enough.

• Journal of the Optical Society of Korea
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• v.7 no.1
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• pp.7-12
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• 2003

A numerical approach for the analysis of quantum wire structures has been presented using a finite-element method which includes the strain analysis and the band analysis of the Luttinger-Kohn Hamiltonian with the deformation potential. A systematic implementation of the multiband Hamiltonian in the finite-element scheme is outlined and the corresponding variational functional is derived for arbitrarily shaped strained quantum wire arrays. This method is then applied to calculate the band structures of strained quantum wire arrays.

• Journal of the Optical Society of Korea
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• v.7 no.1
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• pp.13-19
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• 2003

The effects of strain distribution in quantum wire arrays have been analyzed using a finite-element method including both the hydrostatic and shear strain components. Their effects on the optical properties of the quantum wire arrays are assessed for various types of stress profiles by calculating the optical gain and the polarization dependence. The results show unique polarization dependency, which can be exploited either for the single polarization or the polarization-independent operation in quantum wire photonic devices.

• Electrical & Electronic Materials
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• v.7 no.3
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• pp.252-261
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• 1994