Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Analysis of Frequency Response Depending on Wire-bonding Length Variation

Wire-bonding의 길이 변화에 따른 주파수별 특성 분석

  • Gwon, Eun-Jin (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute) ;
  • Mun, Jong-Won (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute) ;
  • Ryu, Jong-In (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute) ;
  • Park, Se-Hoon (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute) ;
  • Kim, Jun-Chul (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute)
  • 권은진 (전자소재 패키징 연구센터 전자부품연구원) ;
  • 문종원 (전자소재 패키징 연구센터 전자부품연구원) ;
  • 류종인 (전자소재 패키징 연구센터 전자부품연구원) ;
  • 박세훈 (전자소재 패키징 연구센터 전자부품연구원) ;
  • 김준철 (전자소재 패키징 연구센터 전자부품연구원)
  • Published : 2008.06.18
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Abstract

This paper presets a results of frequency response in variation of wire bonding length. A gold ball bonding is used as a wire bonding process, and a DPDT(double pole double thru) switch is adapted as a device for test. Wire length is ranged from 442um to 833um and a measured frequency range is from 1 GHz to 6 GHz. Little difference are measured in insertion loss and return loss depending on wire length. Measured S21 and S11 are -0.58 dB and -17.7 dB, respectively. S21 insertion loss is rising up and S11 insertion loss is falling down as the frequency is increased.

Keywords