• KIEE International Transaction on Electrical Machinery and Energy Conversion Systems
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• 제11B권3호
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• pp.59-63
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• 2001

This paper presents a new modeling of the two dimensional magnetic property in soft magnetic materials for the magnetic field computations. In this modeling an approximate treatment is introduced to expand the applicable exciting frequency range. The result shows that the new modeling presented here is very useful in simplicity of magnetic field analysis.

• ETRI Journal
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• 제30권1호
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• pp.170-172
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• 2008

A substitution box (S-box) plays a central role in cryptographic algorithms. In this paper, an efficient method for designing S-boxes based on chaotic maps is proposed. The proposed method is based on the mixing property of piecewise linear chaotic maps. The S-box so constructed has very low differential and linear approximation probabilities. The proposed S-box is more secure against differential and linear cryptanalysis compared to recently proposed chaotic S-boxes.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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• pp.1314-1317
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• 1997

For realizing artificial skin sensing as a final goal, a mono-material pressure-conductive rubber sensor which is also sensitive for temperature is described. Firstly, discimination of the hardness and the thermal property of material using a proposed sensor is presented. Furthermore, a tactile sensor constints of four pressure-conductive rubber sensor to discriminate surface model which imitaties the surface roughness of material is proposed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 추계학술대회 논문집
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• pp.319-322
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• 1998

Many researchers make efforts to develop an effective material with anti-degradation property. Specially, the porcelain type insulator is required exchanging to polymer insulator acceding to the environmental consideration In this paper, we have developed the estimation system using the PD testing. The approach of PD has been very successful applied to the various practical insulator.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 추계학술대회 논문집
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• pp.21-24
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• 1998

The properties of ZrN layer deposited by Sputtering system have been investigated in the application of diffusion barrier layer to copper. ZrN layer exhibited a excellent barrier property up to $700^{\circ}$ and higher resistivity. If an excess $O_2$is protected during the process of ZrN deposition, ZrN layer will be possible to use a diffusion barrier layer to copper.

• Journal of information and communication convergence engineering
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• 제7권2호
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• pp.219-222
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• 2009

An efficient interpolation FIR filter structure for high-density and low-power electronic devices is proposed. The proposed structure is based on polyphase decomposition property and look-up table method. By computer-aided design simulations, it is shown that the use of the proposed method can result in reduction in the number of gates by 54% and can reduce power consumption by 9%.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1989년도 춘계학술대회 논문집
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• pp.52-55
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• 1989

The properties of sintered Ag-SnO$_2$contacts which contain the second oxide were investigated with hardeness, workability, electrical conductivity and are erosion. Ag-SnO$_2$contacts containing ZnO or Bi$_2$O$_3$have most excellent workability and arc erosion endurance.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1993년도 춘계학술대회 논문집
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• pp.52-54
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• 1993

A new type of semiconductor fuse-link with fuse elements deposited on ceramic substrate introduced. The construction and aging property of this fuse-link, as well as the test circuitry built especially for the development of this fuse-link explained below.

• 한국전자통신학회논문지
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• 제6권1호
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• pp.1-6
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• 2011

본 연구는 재난안전 무선통신망 구축 활용을 위한 사업 중단으로 재난 관련 기관들의 무선통신망 미확보 및 장비노후화에 따라 인명 및 재산피해가 확산될 우려가 증대되고 있는 시점에서 연구 하에 예방책을 제시하고자 한다.

• 세라미스트
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• 제21권2호
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• pp.83-88
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• 2018

There is close relation between the heat generation and the performance of electronic device. The durability and efficiency of the device are degraded due to heat generation. It is necessary to release the generated heat from an electronic device. Based on demands of the printed circuit board (PCB) manufacturing, the robust and reliable plating technique of PCB is necessary. In this study, we review various methods for improving the heat sink property. These methods were considered to enhance the adhesion between ceramic substrate as heat sink and metal layer as electrode.