Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 1998.11a
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- Pages.21-24
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- 1998
A study on ZrN layer as a diffusion barrier between Cu and Si
Cu와 Si 사이에서 확산방지막으로 사용하기 위한 ZrN 층의 연구
Abstract
The properties of ZrN layer deposited by Sputtering system have been investigated in the application of diffusion barrier layer to copper. ZrN layer exhibited a excellent barrier property up to