• Title/Summary/Keyword: Electronic parameters

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Assessment of Set-up Accuracy in Tangential Breast Treatment Using Electronic Portal Imaging Device (EPID 영상을 이용한 유방암 접선조사의 정확성 평가)

  • Lee, Byung-Koo;Kang, Soo-Man
    • Journal of radiological science and technology
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    • v.35 no.3
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    • pp.249-254
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    • 2012
  • The aim of this study was to investigate the setup accuracy for tangential breast treatment patients using electronic portal image and 2-D reconstruction image Twenty two patients undergoing tangential breast treatment. To explore the setup accuracy, distances between chosen landmarks were taken as reference parameters. The difference between measured reference parameters on simulation films and electronic portal images (EPIs) was calculated as the setup error. A total of 22 simulation films and 110 EPIs were evaluated. In the tangential fields, the calculated reference parameters were the central lung distance (CLD), central soft-tissue distance (CSTD), and above lung distance (ALD), below lung distance (BLD). In the medial tangential field, the average difference values for these parameters were 1.0, -6.4, -2.1 and 2.0, respectively; and the ${\sigma}$ values were 1.5, 2.3, 4.1 and 1.1, respectively. In the lateral tangential field, the average difference values for these parameters were -1.5, -4.3, -2.7 and -1.3, respectively; and the ${\sigma}$ values were 3.3, 2.1, 2.9 and 2.5, respectively. CLD, CSTD, ALD and BLD in the tangential fields are easily identifiable and are helpful for detecting setup errors using EPIs in patients undergoing tangential breast radiotherapy treatment.

Exploring precise deposition and influence mechanism for micro-scale serpentine structure fiber

  • Wang, Han;Ou, Weicheng;Zhong, Huiyu;He, Jingfan;Wang, Zuyong;Cai, Nian;Chen, XinDu;Xue, Zengxi;Liao, Jianxiang;Zhan, Daohua;Yao, Jingsong;Wu, Peixuan
    • Advances in nano research
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    • v.12 no.2
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    • pp.151-165
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    • 2022
  • Micro-scale serpentine structure fibers are widely used as flexible sensor in the manufacturing of micro-nano flexible electronic devices because of their outstanding non-linear mechanical properties and organizational flexibility. The use of melt electrowriting (MEW) technology, combined with the axial bending effect of the Taylor cone jet in the process, can achieve the micro-scale serpentine structure fibers. Due to the interference of the process parameters, it is still challenging to achieve the precise deposition of micro-scale and high-consistency serpentine structure fibers. In this paper, the micro-scale serpentine structure fiber is produced by MEW combined with axial bending effect. Based on the controlled deposition of MEW, applied voltage, collector speed, nozzle height and nozzle diameter are adjusted to achieve the precise deposition of micro-scale serpentine structure fibers with different morphologies in a single motion dimension. Finally, the influence mechanism of the above four parameters on the precise deposition of micro-scale serpentine fibers is explored.

Indirect Adaptive Fuzzy Observer Design

  • Yang, Jong-Kun;Hyun, Chang-Ho;Kim, Jae-Hun;Kim, Eun-Tai;Park, Mi-Gnon
    • Proceedings of the Korean Institute of Intelligent Systems Conference
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    • 2004.10a
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    • pp.192-196
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    • 2004
  • This paper proposes an alternative observation scheme, T-S fuzzy model based indirect adaptive fuzzy observer. Nonlinear systems are represented by fuzzy models since fuzzy logic systems are universal approximators. In order to estimate the unmeasurable states of a given nonlinear system, T-S fuzzy modeling method is applied to get the dynamics of an observation system. T-S fuzzy system uses the linear combination of the input state variables and the modeling applications of them to various kinds of nonlinear systems can be found. The adaptive fuzzy scheme estimates the parameters comprising the fuzzy model representing the observation system. The proposed indirect adaptive fuzzy observer based on T-S fuzzy model can cope with not only unknown states but also unknown parameters. In the process of deriving adaptive law, the Lyapunov theory and Lipchitz condition are used. To show the performance of the proposed observation method, it is applied to an inverted pendulum on a cart.

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Indirect Adaptive Fuzzy Observer Design

  • Yang, Jong-Kun;Hyun, Chang-Ho;Kim, Jae-Hun;Kim, Eun-Tai;Park, Mignon
    • Journal of the Korean Institute of Intelligent Systems
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    • v.14 no.7
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    • pp.927-933
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    • 2004
  • This paper proposes an alternative observation scheme, T-S fuzzy model based indirect adaptive fuzzy observer. Nonlinear systems are represented by fuzzy models since fuzzy logic systems are universal approximators. In order to estimate the unmeasurable states of a given nonlinear system, T-S fuzzy modeling method is applied to get the dynamics of an observation system. T-S fuzzy system uses the linear combination of the input state variables and the modeling applications of them to various kinds of nonlinear systems can be found. The adaptive fuzzy scheme estimates the parameters comprising the fuzzy model representing the observation system. The proposed indirect adaptive fuzzy observer based on T-S fuzzy model can cope with not only unknown states but also unknown parameters. In the process of deriving adaptive law, the Lyapunov theory and Lipchitz condition are used. To show the performance of the proposed observation method, it is applied to an inverted pendulum on a cart.

3차원 포아송방정식을 이용한 FinFET의 해석학적 포텐셜모델

  • Han, Ji-Hyung;Jung, Hak-Kee;Jung, Dong-Soo;Lee, Jong-In;Kwon, Oh-Shin
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2008.10a
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    • pp.579-582
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    • 2008
  • Three dimensional(3D) Poisson's equation is used to calculate the potential variation in the channel to analyze subthreshold current and short channel effect(SCE). The analytical model has been presented to lessen calculating time and understand the relationship of parameters. The accuracy of this model has been verified by the data from 3D numerical device simulator and variation for dimension and process parameters has been explained. The model has been developed to obtain channel potential of FinFET according to channel doping and to calculate subthreshold current and threshold voltage.

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Comparison of Optical Characteristics between CCFL and EEFL in Direct-type Backlight Unit

  • Han, Jeong-Min;Han, Jin-Woo;Seo, Dae-Shik
    • Transactions on Electrical and Electronic Materials
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    • v.8 no.6
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    • pp.268-273
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    • 2007
  • In this study, It was studied about the luminance characteristics of 17 inch direct-type back light using EEFL(external electrode fluorescent lamp) and CCFL(cold cathode fluorescent lamp). The EEFL has a long life time because the electrode is installed outside of lamp. And it is produced in lower price than conventional CCFL. Moreover, it does not need process of installing internal electrode. However, the EEFL technology has several problems such as difficulty of designing driving inverter and preventing this phenomenon along the skin of lamps. We suggested two types of backlight unit for LCD TV application using the EEFL and the CCFL. We found optimized optical design parameters. We set the optical variation parameters such as lamp height, lamp distance, total thickness, and angles of inner walls. We achieved 7580 nits of center luminance, 82% of luminance uniformity by using 20 lamps of the EEFL and 7297 nits of center luminance, 78% of luminance uniformity by using 16 lamps of the CCFL.

Estimation of Transferred Power from a Noise Source to an IC with Forwarded Power Characteristics

  • Pu, Bo;Kim, Taeho;Kim, SungJun;Kim, Jong-Hyeon;Kim, SoYoung;Nah, Wansoo
    • Journal of electromagnetic engineering and science
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    • v.13 no.4
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    • pp.233-239
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    • 2013
  • This paper proposes an accurate approach for predicting transferred power from a noise source to integrated circuits based on the characteristics of the power transfer network. A power delivery trace on a package and a printed circuit board are designed to transmit power from an external source to integrated circuits. The power is demonstrated between an injection terminal on the edge of the printed circuit board and integrated circuits, and the power transfer function of the power distribution network is derived. A two-tier calibration is applied to the test, and scattering parameters of the network are measured for the calculation of the power transfer function. After testing to obtain the indispensable parameters, the real received and tolerable power of the integrated circuits can be easily achieved. Our proposed estimation method is an enhancement of the existing the International Electrotechnical Commission standard for precise prediction of the electromagnetic immunity of integrated circuits.

Interpolation based Single-path Sub-pixel Convolution for Super-Resolution Multi-Scale Networks

  • Alao, Honnang;Kim, Jin-Sung;Kim, Tae Sung;Oh, Juhyen;Lee, Kyujoong
    • Journal of Multimedia Information System
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    • v.8 no.4
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    • pp.203-210
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    • 2021
  • Deep leaning convolutional neural networks (CNN) have successfully been applied to image super-resolution (SR). Despite their great performances, SR techniques tend to focus on a certain upscale factor when training a particular model. Algorithms for single model multi-scale networks can easily be constructed if images are upscaled prior to input, but sub-pixel convolution upsampling works differently for each scale factor. Recent SR methods employ multi-scale and multi-path learning as a solution. However, this causes unshared parameters and unbalanced parameter distribution across various scale factors. We present a multi-scale single-path upsample module as a solution by exploiting the advantages of sub-pixel convolution and interpolation algorithms. The proposed model employs sub-pixel convolution for the highest scale factor among the learning upscale factors, and then utilize 1-dimension interpolation, compressing the learned features on the channel axis to match the desired output image size. Experiments are performed for the single-path upsample module, and compared to the multi-path upsample module. Based on the experimental results, the proposed algorithm reduces the upsample module's parameters by 24% and presents slightly to better performance compared to the previous algorithm.

Extraction of Extrinsic Circuit Parameters of HEMT by Minimizing Residual Errors (잔차 오차 최소에 의한 HEMT의 외인성 파라미터 추출)

  • Jeon, Man-Young
    • The Journal of the Korea institute of electronic communication sciences
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    • v.9 no.8
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    • pp.853-859
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    • 2014
  • This study presents a technique for extracting all the extrinsic parameters of HEMTs by minimizing the residual errors between a pinch-off cold-FET's gate and drain pad de-embedded Z-parameters and its modeled Z-parameters calculated by the cold-FET's remaining parameters. The presented technique allows us to successfully extract the remaining extrinsic parameter values as well as the gate and drain pad capacitance value without the additional fabrications of the gate and drain dummy pad.

Sensitivity Analysis of the 217PlusTM Component Models for Reliability Prediction of Electronic Systems (전자 시스템 신뢰도 예측을 위한 217PlusTM 부품모형의 민감도 분석)

  • Jeon, Tae-Bo
    • Journal of Korean Society for Quality Management
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    • v.39 no.4
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    • pp.507-515
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    • 2011
  • MIL-HDBK-217 has played a pivotal role in reliability prediction of electronic equipments for more than 30 years. Recently, RIAC developed a new methodology $217Plus^{TM}$which officially replaces MIL-HDBK-217. Sensitivity analysis of the 217Plus component models to various parameters has been performed and meaningful observations have been drawn in this study. We first briefly reviewed the $217Plus^{TM}$ methodolog and compared it with the conventional model, MIL-HDBK-217. We then performed sensitivity analysis $217Plus^{TM}$ component models to various parameters. Based on the six parameters and an orthogonal array selected, we have performed indepth analyses concerning parameter effects on the model. Our result indicates that, among various parameters, operating temperature and temperature rise during operation have the most significant impacts on the life of a component, and thus a design robust to high temperature is the most importantly required. Next, year of manufacture, duty cycle, and voltage stress are weaker but may be significant when they are in heavy load conditions. Although our study is restricted to a specific type of diodes, the results are still valid to other cases. The results in this study not only figure out the behavior of the predicted failure rate as a function of parameters but provide meaningful guidelines for practical applications.