• Asia pacific journal of information systems
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• v.22 no.1
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• pp.29-52
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• 2012

Consumers differ in the way they make a purchase. An audio mania would willingly make a bold, yet serious, decision to buy a top-of-the-line home theater system, while he is not interested in replacing his two-decade-old shabby car. On the contrary, an automobile enthusiast wouldn't mind spending forty thousand dollars to buy a new Jaguar convertible, yet cares little about his junky component system. It is product involvement that helps us explain such differences among individuals in the purchase style. Product involvement refers to the extent to which a product is perceived to be important to a consumer (Zaichkowsky, 2001). Product involvement is an important factor that strongly influences consumer's purchase decision-making process, and thus has been of prime interest to consumer behavior researchers. Furthermore, researchers found that involvement is closely related to perceived risk (Dholakia, 2001). While abundant research exists addressing how product involvement relates to overall perceived risk, little attention has been paid to the relationship between involvement and different types of perceived risk in an electronic commerce setting. Given that perceived risk can be a substantial barrier to the online purchase (Jarvenpaa, 2000), research addressing such an issue will offer useful implications on what specific types of perceived risk an online firm should focus on mitigating if it is to increase sales to a fullest potential. Meanwhile, past research has focused on such consumer responses as information search and dissemination as a consequence of involvement, neglecting other behavioral responses like online merchant selection. For one example, will a consumer seriously considering the purchase of a pricey Guzzi bag perceive a great degree of risk associated with online buying and therefore choose to buy it from a digital storefront rather than from an online marketplace to mitigate risk? Will a consumer require greater trust on the part of the online merchant when the perceived risk of online buying is rather high? We intend to find answers to these research questions through an empirical study. This paper explores the impact of enduring product involvement and perceived risks on required trust level, and further on online merchant choice. For the purpose of the research, five types or components of perceived risk are taken into consideration, including financial, performance, delivery, psychological, and social risks. A research model has been built around the constructs under consideration, and 12 hypotheses have been developed based on the research model to examine the relationships between enduring involvement and five components of perceived risk, between five components of perceived risk and required trust level, between enduring involvement and required trust level, and finally between required trust level and preference toward an e-tailer. To attain our research objectives, we conducted an empirical analysis consisting of two phases of data collection: a pilot test and main survey. The pilot test was conducted using 25 college students to ensure that the questionnaire items are clear and straightforward. Then the main survey was conducted using 295 college students at a major university for nine days between December 13, 2010 and December 21, 2010. The measures employed to test the model included eight constructs: (1) enduring involvement, (2) financial risk, (3) performance risk, (4) delivery risk, (5) psychological risk, (6) social risk, (7) required trust level, (8) preference toward an e-tailer. The statistical package, SPSS 17.0, was used to test the internal consistency among the items within the individual measures. Based on the Cronbach's ${\alpha}$ coefficients of the individual measure, the reliability of all the variables is supported. Meanwhile, the Amos 18.0 package was employed to perform a confirmatory factor analysis designed to assess the unidimensionality of the measures. The goodness of fit for the measurement model was satisfied. Unidimensionality was tested using convergent, discriminant, and nomological validity. The statistical evidences proved that the three types of validity were all satisfied. Now the structured equation modeling technique was used to analyze the individual paths along the relationships among the research constructs. The results indicated that enduring involvement has significant positive relationships with all the five components of perceived risk, while only performance risk is significantly related to trust level required by consumers for purchase. It can be inferred from the findings that product performance problems are mostly likely to occur when a merchant behaves in an opportunistic manner. Positive relationships were also found between involvement and required trust level and between required trust level and online merchant choice. Enduring involvement is concerned with the pleasure a consumer derives from a product class and/or with the desire for knowledge for the product class, and thus is likely to motivate the consumer to look for ways of mitigating perceived risk by requiring a higher level of trust on the part of the online merchant. Likewise, a consumer requiring a high level of trust on the merchant will choose a digital storefront rather than an e-marketplace, since a digital storefront is believed to be trustworthier than an e-marketplace, as it fulfills orders by itself rather than acting as an intermediary. The findings of the present research provide both academic and practical implications. The first academic implication is that enduring product involvement is a strong motivator of consumer responses, especially the selection of a merchant, in the context of electronic shopping. Secondly, academicians are advised to pay attention to the finding that an individual component or type of perceived risk can be used as an important research construct, since it would allow one to pinpoint the specific types of risk that are influenced by antecedents or that influence consequents. Meanwhile, our research provides implications useful for online merchants (both online storefronts and e-marketplaces). Merchants may develop strategies to attract consumers by managing perceived performance risk involved in purchase decisions, since it was found to have significant positive relationship with the level of trust required by a consumer on the part of the merchant. One way to manage performance risk would be to thoroughly examine the product before shipping to ensure that it has no deficiencies or flaws. Secondly, digital storefronts are advised to focus on symbolic goods (e.g., cars, cell phones, fashion outfits, and handbags) in which consumers are relatively more involved than others, whereas e- marketplaces should put their emphasis on non-symbolic goods (e.g., drinks, books, MP3 players, and bike accessories).

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.79-84
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• 2016

A flexible electronic device deformed by external force causes the failure of a semiconductor die. Even without failure, the repeated elastic deformation changes carrier mobility in the channel and increases resistivity in the interconnection, which causes malfunction of the integrated circuits. Therefore it is desirable that a semiconductor die be placed on a neutral line where the mechanical stress is zero. In the present study, we investigated the effects of design factors on the position of neutral line by finite element analysis (FEA), and expected the possible failure behavior in a flexible face-down packaging system assuming flip-chip bonding of a silicon die. The thickness and material of the flexible substrate and the thickness of a silicon die were considered as design factors. The thickness of a flexible substrate was the most important factor for controlling the position of the neutral line. A three-dimensional FEA result showed that the von Mises stress higher than yield stress would be applied to copper bumps between a silicon die and a flexible substrate. Finally, we suggested a designing strategy for reducing the stress of a silicon die and copper bumps of a flexible face-down packaging system.

• Journal of Engineering Education Research
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• v.10 no.2
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• pp.19-43
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• 2007

The Korean Society for Engineering Education (KSEE) was founded in 1994, and the Journal of Engineering Education Research has published since 1998. The purpose of the study was to analyze the research methodologies and contents for all 126 papers which were published from 1998 to 2005. A statistical package SPSS(ver. 15.0) was used to analyze the coding data of all papers. The research contents were as follows: (1) A classification of the number of papers published according to year and researcher features (gender, institution, major field, number of authors, etc) was performed, (2) The analysis of research methodologies and contents of the papers published was performed, (3) Strategies to improve the quality of the journal were suggested by discussion from the analysis results. The results showed that the development research method was used most frequently, most papers were mode by major scholars of electrical and electronic engineering and scholars of Yonsei University made the most papers. In order to use the survey research method, the sampling methods were mainly used by total number, purposive, convenience, stratified sampling method, etc, questionnaire was used of 89.5%, descriptive statistics of frequency/% was used of 50%. To conduct the experimental research method, the models of nonequivalent groups posttest-only design and one-group pretest-posttest design were adopted, respectively. Finally, research strategies and new direction for improving the engineering education journal's papers at the section of discussion and suggestion were suggested.

• Journal of Sasang Constitutional Medicine
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• v.15 no.3
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• pp.124-138
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• 2003

Objectives : To evaluate the properness and effectiveness of the question categories concerning 'sasang constitutional characteristics of mind', used in Iksan Wonkwang Oriental Medicine. Methods : We statistically analyzed data from those 1335 patients focussing on 'relative discrimination ability' to sasang constructions and 'response ratio'. Patients included in this research are only those who had been well treated in Iksan Wonkwang Oriental Medicine during the Period of three years from 2000 to 2002. The data are obtained through the electronic chart developed by Kim Jong-Yeal, and analyzed using the statistical Package SPSS. Results: In total characteristics of mind, the question category of 'timid' has high discriminating power and effectiveness to Soeum type, more in women than men, and especially with an age of 21 or more; The category of 'hasty-tempered' to Soyang type in women with all ages and men with ages 21-40; The category of 'broad-minded' to Taeum type with ages 41 or more; The category of 'timid and broad-minded' to Soyang type, and especially high to women with ages 41 or more. Question categories concerning response type in anger were estimated to have different response patterns to sasang constructions only for ages 21 or more by $X^2$2 test. The question category of 'bear and last long' has high discriminating power and effectiveness to Soeum type, more in men than women, and increasingly to ages; The category of 'impatient and disarmed quickly' to Soyang type in both women and men, especially with ages 21 or more; The category of 'impatient' to Soyang type women or with ages 21 or more. Other categories have low discriminating power or low effectiveness. Concernig expression type of one's thought, the question category of 'straightly' has high discriminating power and effectiveness to Soyang type, more in wemen than men, and especially to ages 21 or more; The category of 'tender' to Soeum type, in women or with ages 40 or less; The category of 'indirectly' to Taeum type in men or with ages 41 or more; The category of 'straightly and stuborn' to Soyang type with ages 41 or more; The category of 'indirectly and tender' to Soeum with with ages 20 or less; The category of 'not express and tender' to Soeum type with ages 41 or more; Conclusions : Question categories concerning total characteristics of mind, response type in anger and expression type of one's thought, are partially discriminating and effective to specific constitution according to sex and ages, and some categories are more discriminating and effective when they are composited. But generally, the discriminating power of Taeum constitution group and group with ages 20 or less was too low, so it is necessary to develope question categories for those groups.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.43-50
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• 2014

By the trends of electronic package to be smaller, thinner and more integrative, the reliability of interconnection between Si chip and printed circuit board is required. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder joints with different the thicknesses of electroless Ni-P deposit. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. The high speed shear energy of SAC405 solder joint with $1{\mu}m$ Ni-P deposit was found to be lower without $HNO_3$ vapor, compared to those of over $3{\mu}m$ Ni-P deposit. This could be due to the edge of solder resist in $1{\mu}m$ Ni-P deposit, which provides a fracture location for the weakened shear energy of solder joints and brittle fracture in high speed shear test. With $HNO_3$ vapor, the brittle fracture mode in high speed shear test decreased with increasing the thickness of Ni-P deposit. Then the roughness (Ra) of Ni-P deposits decreased with increasing its thickness. Thus, this gives the evidence that the decrease in roughness of Ni-P deposit for Eelectroless Ni/ Electroless Pd/ Immersion Au (ENEPIG) surface play a critical role for improving the robustness of SAC405 solder joint.

• Journal of Technologic Dentistry
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• v.25 no.1
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• pp.173-185
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• 2003

This study mainly intends to determine the factors for which dental technicians are satisfied with their jobs and how much the resulting job transfer rate is and thus to identify the correlation between them. For these purpose, 200 subjects were sampled out of dental technicians in Seoul and Incheon, and the survey was performed from July 19, 2002 to August 15 (for 25 days) with self-administered questionnaire. Out of all collected questionnaires, 131 pieces(65.5%) were addressed for this study. As for the tools for this study, the structured questionnaire was used with its proven reliability and feasibility, and the contents of questionnaire consisted of 32 questions on the basis of related references. The contents of questionnaire were categorized into 3 sections: General attribute of subjects; Factors for which dental technicians are satisfied with their jobs; and their intention of job transfer. The questionnaire consisted of total 32 questions which included general attribute of subjects(10 questions), factors of their satisfaction with jobs(17 questions) and intention of job transfer(5 questions). The data analysis was processed by computerized system with SPSS(Statistical Package for Social Sciences). Statistical analysis techniques included frequency, percentage, T-test, F-test analysis and regression analysis. As a result of those analyses, the conclusion can be summarized as follows: 1. As a result of analyzing the factors for which the subjects were satisfied with their jobs, it was found that there were significant differences in career and job title out of question items(P<0.001). It was also shown that the factors of subjects' satisfaction averaged 3.43, which was considerably higher value than I expected. It was found that job and management factors were major job satisfaction factors. 2. As a result of analyzing the intention of subjects to decide their job transfer, it was found that there were significant differences in job title and marital status out of question items(P<0.001). It was shown that the total average of the intention of their job transfer amounted to 3.06. It was shown that dental technicians have relatively higher intention of job transfer from their current work place. 3. It was found that there was inverse correlation between the factors of subjects' satisfaction with their jobs and their intention of job transfer(r=-0.490, P<0.05). Likewise, it was also found that there was inverse correlation mostly between the evaluation value for each independent variable region in term of each factor of job satisfaction and the value for the intention of job transfer. In view of these correlations, it was concluded that higher job satisfaction likely led to lower job transfer. 4. As a result of regression analysis so as to determine the influences of job satisfaction factors on the intention of job transfer, it was found that the highest influential factor was management factor. And it was shown that the test values of model were statistically significant and its explanatory power amounted to 54.6%.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.11
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• pp.21-30
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• 1998

In this paper, a digital current control system using a FPGA(Field Programmable Gate Array) was implemented, and the system was applied to an induction motor widely used as an industrial driving machine. The FPGA designed by VHDL(VHSIC Hardware Description Language) consists of a PWM(Pulse Width Modulation) generation block, a PWM protection block, a speed measuring block, a watch dog timer block, an interrupt control block, a decoder logic block, a wait control block and digital input and output blocks respectively. Dedicated clock inputs on the FPGA were used for high-speed execution, and an up-down counter and a latch block were designed in parallel, in order that the triangle wave could be operated at 40 MHz clock. When triangle wave is compared with many registers respectively, gate delay occurs from excessive fan-outs. To reduce the delay, two triangle wave registers were implemented in parallel. Amplitude and frequency of the triangle wave, and dead time of PWM could be changed by software. This FPGA was synthesized by pASIC 2SpDE and Synplify-Lite synthesis tool of Quick Logic company. The final simulation for worst cases was successfully performed under a Verilog HDL simulation environment. And the FPGA programmed for an 84 pin PLCC package was applied to digital current control system for 3-phase induction motor. The digital current control system of the 3 phase induction motor was configured using the DSP(TMS320C31-40 MHz), FPGA, A/D converter and Hall CT etc., and experimental results showed the effectiveness of the digital current control system.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.11
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• pp.695-700
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• 2018

This paper presents the development of compact and lightweight broadband power amplifier module using HMIC (Hybrid Microwave Integrated Circuit) technology that could be high-density integration for many non-packaged microwave components into the small area of a high dielectric constant printed circuit board, such as a ceramic substrate, also using the special design and fabrication schemes for the structure of minimized electromagnetic interference to obtain the homogeneous electrical performance at the wideband frequency. The results confirmed that the small signal gain has a gain flatness of ${\pm}1.5dB$ within the range of 32 to 36 dB. In addition, the output power satisfied more than 30 dBm. The noise figure was measured within 7 dB, and OIP3 (Output Third Order Intercept Point) was more than 39 dBm. The fabricated broadband power amplifier satisfied the target specification required to electrically drive the high power amplifiers of jamming generators for electronic warfare, so the actual applicability to the system was verified. Future studies will be aimed at designing other similar microwave power amplifiers in the future.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.19-27
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• 2003

Surface finishes of PCB laminates are important in the solder joint reliability of flip chip package because the types and thicknesses of intermetallic compound(IMC), and compositions and hardness of solders are affected by them. In this study, effects of surface finishes of PCB on the low cycle fatigue resistance of Sn-based lead-free solders; Sn-3.5Ag, Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag-XBi(X=2.5, 7.5) and Sn-0.7Cu were investigated for the Cu and Au/Ni surface finish treatments. Displacement controlled room temperature lap shear fatigue tests showed that fatigue resistance of Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag and Sn-0.7Cu alloys were more or less the same each other but much better than that of Bi containing alloys regardless of the surface finish layer used. In general, solder joints on the Au/Ni finish showed better fatigue resistance than those on the Cu finish. Cross-sectional fractography revealed microcracks nucleation inside of the interfacial IMC near the solder mask edge, more frequently on the Cu than the Au/Ni surface finish. Macro cracks followed the solder/IMC interface in the Bi containing alloys, while they propagated in the solder matrix in other alloys. It was ascribed to the Bi segregation at the solder/IMC interface and the solid solution hardening effect of Bi in the $\beta-Sn$ matrix.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.226-226
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• 2008

지난 10여년 동안 Sn-3.0Ag-0.5(wt%)Cu 합금은 대표 무연솔더 조성으로 다양한 전자제품의 실장 및 접합에 적용되어 왔으며, 그 신뢰성 역시 충분히 검증된 바 있다. 그러나 최근 Ag 가격의 급격한 상승과 솔더 접합부의 내 충격 신뢰성을 보다 향상시키고자 하는 업계의 동향은 Ag의 함량이 낮은 무연솔더 조성의 적용 확대를 유도하고 있다. 이에 따라 본 연구자들은 저 Ag 함유 무연슬더로 Sn-1.2Ag-0.5Cu-0.4In 조성을 제안한 바 있는데, 이는 Sn-3.0Ag-0.5Cu 조성 이상의 solderability를 가지면서도 그 금속원료 가격이 약 20% 가량 저렴한 특징을 가진다. 또한 열 싸이클링 (cycling) 테스트를 통한 슬더 조인트의 신뢰성을 평가한 결과, Sn-3.0Ag-0.5Cu에 크게 뒤떨어지지 않는 양호한 특성이 관찰되었다. 따라서 본 연구에서는 열 싸이클링 테스트와 더불어 최근 그 중요성이 지속적으로 커지고 있는 내 충격 신뢰성 평가 시험을 실시하여 개발된 4원계 무연솔더 조성의 기계적 특성을 기존 무연솔더 조성과 비교, 분석해 보았다. 각 솔더 조성은 솔더 볼 형태로 제조되어 CSP(Chip Scale Package) 상에 범핑 (bumping)되었으며, CSP를 PCB(Printed Circuit Board) 상에 실장하는 공정에서도 Sn-3.0Ag-0.5Cu 및 Sn-1.2Ag-0.5Cu-0.4In의 두 종류의 솔더 페이스트가 사용되었다. 본 연구에서의 내 충격 신뢰성 시험에는 자체 제작한 rod drop 시험기를 사용하였는데, 고정된 CSP 실장 board의 후면 부위를 일정한 높이에서 추를 반복적으로 자유 낙하시켜 급격한 충격을 주는 방식으로 실험을 실시하였다. 이 때 추의 무게는 30g, 낙하 높이는 10cm 였으며, 추의 낙하 시 측정된 board 의 휨 변위량은 약 0.7mm로 측정되었다. 사용된 CSP와 PCB 는 모두 daisy chain 방식으로 연결되어 있기 때문에 저항측정기를 사용한 간단한 실시간 저항 측정 방법으로 시험 이력에 따른 파단부의 발생 시점과 대략의 위치를 손쉽게 확인할 수 있었다. 솔더 조인트의 파단 기준 저항값으로 $1000\Omega$을 설정하였으며. 각 조건 당 5 개 이상의 샘플에 대해 평가를 실시한 후 그 평균값을 조사하였다. 시험 결과 제안된 Sn-1.2Ag-0.5Cu-0.4In 조성은 대표적인 저 Ag 함유 조성인 Sn-1.0Ag-0.5Cu에 비해서는 떨어지는 내 충격 신뢰성을 나타내었지만, 우수한 연성에 기인하여 Sn-3.0Ag-0.5Cu 조성에 비해서는 약 2 배 이상 우수한 신뢰성이 관찰되었다. 또한 CSP의 실장 시 Sn-3.0Ag-0.5Cu보다 Sn-1.2Ag-0.5Cu-0.4In 조성 솔더 페이스트를 적용한 경우에서 보다 우수한 내 충격 신뢰성을 나타내어 기본적으로 개발된 Sn-1.2Ag-0.5Cu-0.4In 솔더 페이스트가 Sn-3.0Ag-0.5Cu 조성의 기존 솔더 페이스트 보다 내 충격 신뢰성이 우수함을 검증할 수 있었다. 각 조성의 솔더 조인트를 $150^{\circ}C$ 에서 500시간 aging한 후 실시한 내 충격 신뢰성 평가에서는 모든 조성에서 그 신뢰성이 급감하는 경항을 나타내었으나, Sn-1.2Ag-0.5Cu-0.4In가 Sn-l.0Ag-0.5Cu보다도 그 상대적인 신뢰성이 우수한 것으로 관찰되었다. 이와 같이 aging 후 실시하는 충격시험은 가장 실제적인 상황과 유사한 조건이므로 상기의 실험 결과는 매우 고무적이었으며, 이에 대한 보다 면밀한 분석이 요청되었다. 마지막으로 파면 및 미세조직 관찰을 통하여 각 조성에서의 충격 파단 특성을 비교, 분석해 보았다.