• Journal of Sensor Science and Technology
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• v.6 no.1
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• pp.6-15
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• 1997

This paper presents the multi-objective optimal design of thermopile sensor having beam or membrane structure. The thermopile sensor is composed of $Si_{3}N_{4}/SiO_{2}$ dielectric membrane, Al-polysilicon thermocouples and $RuO_{2}$ thin film for black body. The sensing method is based on the Seebeck effect which is originated from the temperature difference of the two positions, black body and silicon rim. The objective functions of the presented design are sensitivity, detectivity and thermal time constant. The modelling of the sensor is proposed including the package. The multi-objective optimization technique is applied to the design of the sensor not only inspecting the modelling equation but also simulating mathematical programming method. Especially, fuzzy optimization technique is adapted to get the optimal solution which enables the designer to reach the more practical solution. The design constraint of the voltage output originated from the change of the environmental temperature is included for practical use.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.1
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• pp.103-111
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• 2016

This paper presents an adaptive variable weights tuning system for an integrated chassis control with electronic stability control (ESC) and active front steering (AFS) for lateral stability enhancement. After calculating the control yaw moment needed to stabilize a vehicle with a controller design method, it is distributed into the tire forces generated by ESC and AFS using weighted pseudo-inverse-based control allocation (WPCA). On a low friction road, lateral stability can deteriorate due to high vehicle speed. To cope with the problem, adaptive tuning rules on variable weights of the WPCA are proposed. To check the effectiveness of the proposed method, a simulation was performed on the vehicle simulation package, CarSim.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.11
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• pp.1081-1090
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• 2013

In this paper, a C-band 10 W power amplifier with internally matched input and output matching circuit is designed and fabricated. The used power transistor for the power amplifier is GaAs pHEMT bare-chip. The wire bonding analysis considering the size of the capacitor and the position of transistor pad improves the accurate design. The matching circuit design with the package effect using EM simulation is performed. To reduce the unsymmetry of IMD3 in 2-tone measurement due to the memory effect, the bias circuit minimizing the memory effect is proposed and employed. The measured $P_{1dB}$, power gain, and power added efficiency are 39.8~40.4 dBm, 9.7~10.4 dB, and 33.4~38.0 %, respectively. Adopting the proposed bias circuit, the difference between the upper and lower IMD3 is less than 0.76 dB.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.192-192
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• 2009

We have successfully demonstrated the inkjet printing process to fabricate $Al_2O_3$ thick films without a high temperature sintering process. A single solvent system had a coffee ring pattern after printing of $Al_2O_3$ dot, line and area. In order to fabricate the smooth surface of $Al_2O_3$ thick film, we have introduced a co-solvent system which has nano-sized $Al_2O_3$ powders in the mixture of Ethylene glycol monomethyl ester and Di propylene glycol methyl ether. This co-solvent system approached a uniform and dense deposition of $Al_2O_3$ powders on the substrate. The packing density of inkjet-printed $Al_2O_3$ films is more than 70% which is very high compared to the value obtained from the films synthesized by other conventional methods such as casting processes. The characterization of the inkjet-printed $Al_2O_3$ films has been implemented to investigate its thickness and roughness. Also the dielectric loss of the films has been measured to understand the feasibility of its application to 3D integration package substrate.

• Journal of Global Scholars of Marketing Science
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• v.12
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• pp.59-75
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• 2003

In order for electronic commerce to be successful, it must have a theoretical framework that considers the characteristics of the internet user who are consumers in the cyber space and impacts their purchase intentions. We were able to obtain participation of 350 people from across the country using 316 responses(34 responses removed), we derived statistics by means of SPSS/PC version 10.0 and AMOS 4.0 statistics package. We found that, the higher the degree of skill and the sense of challenge, the level of involvement and perceived service quality increased. And the degree of skill has a negative influence on awareness of perceived risk than the sense of challenge. Perceived service quality, perceived risk and involvement has a influence on purchase intentions.

• The Journal of the Korea institute of electronic communication sciences
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• v.15 no.5
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• pp.827-834
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• 2020

In this paper, a third-order harmonic mixer is designed using frequency multiplier theory for the microwave airborne radar. Unlike the basic mixer design method, the gate bias voltage, at which the third-harmonic component of the Local frequency (LO) is the maximum, is selected using a frequency multiplier theory to maximize the third-harmonic mixing component at the intermediate frequency (IF). The proposed harmonic mixer was designed and manufactured using a commercial GaAs MESFET device in a plastic package, and it was possible to improve the high conversion loss, circuit complexity, high cost, and manufacturing complexity of the existing microwave mixer. The harmonic mixer using the proposed design method has a -8 ~ -10 dB conversion loss by pumping 11.5 GHz LO with a +5 dBm level when operating from 33.0 GHz to 36.0 GHz and the 1-dB gain compression point (P1dB) of 0 dBm.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.6
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• pp.481-486
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• 2010

ENIG (electroless Ni immersion gold) is one of surface finishing which has been most widely used in fine pitch SMT (surface mount technology) and BGA (ball grid array) packaging process. The reliability for package bondability is mainly affected by interfacial reaction between solder and surface finishing. Since the behavior of IMC (intermetallic compound), or the interfacial reaction between Ni and solder, affects to some product reliabilities such as solderability and bondability, understanding behavior of IMC should be important issue. Thus, we studied the properties of ENIG with P contents (9 wt% and 13 wt%), where the P contents is one of main factors in formation of IMC layer. The effect of P content was discussed using the results obtained from FE-SEM(field-emission scanning electron microscope), EPMA(electron probe micro analyzer), EDS(energy dispersive spectroscopy) and Dual-FIB(focused ion beam). Especially, we observed needle type irregular IMC layer with decreasing Ni contents under high P contents (13 wt%). Also, we found how IMC layer affects to bondability with forming continuous Kirkendall voids and thick P-rich layer.

• The Journal of the Korea institute of electronic communication sciences
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• v.5 no.6
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• pp.602-612
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• 2010

In this paper, we propose an object-oriented modeling technique using UML(Unified Modeling Language) for accessibility of user and efficiency of facilities under Web-based integrated manufacturing management system application. For this, we first collect user requirements and related technology of integrated manufacturing system, and then design proposed system considering business flow and various essential design part(class, component, package, use case, and etc) to reduce system risk as well as communicate peacefully between developers in system redevelopments. Additionally, we develop database of manufacturing master code, check management, repair management and error management for proposed systems. Finally, we design and implement our three main modules; manufacturing check module, manufacturing repair module, manufacturing error module under Web-based environments with JSP language.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.185.2-185.2
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• 2014

We have studied the atomic and electronic structure of graphene nanoribbons (GNRs) on a hexagonal boron nitride (h-BN) sheet with intercalated atoms using first-principles calculations. The h-BN sheet is an insulator with the band gap about 6 eV and then it may a good candidate as a supporting dielectric substrate for graphene-based nanodevices. Especially, the h-BN sheet has the similar bond structure as graphene with a slightly longer lattice constant. For the computation, we use the Vienna ab initio simulation package (VASP). The generalized gradient approximation (GGA) in the form of the PBE-type parameterization is employed. The ions are described via the projector augmented wave potentials, and the cutoff energy for the plane-wave basis is set to 400 eV. To include weak van der Waals (vdW) interactions, we adopt the Grimme's DFT-D2 vdW correction based on a semi-empirical GGA-type theory. Our calculations reveal that the localized states appear at the zigzag edge of the GNR on the h-BN sheet due to the flat band of the zigzag edge at the Fermi level and the localized states rapidly decay into the bulk. The open-edged graphene with a large corrugation allows some space between graphene and h-BN sheet. Therefore, atoms or molecules can be intercalated between them. We have considered various types of atoms for intercalation. The atoms are initially placed at the edge of the GNR or inserted in between GNR and h-BN sheet to find the effect of intercalated atoms on the atomic and electronic structure of graphene. We find that the impurity atoms at the edge of GNR are more stable than in between GNR and h-BN sheet for all cases considered. The nickel atom has the lowest energy difference of ~0.2 eV, which means that it is relatively easy to intercalate the Ni atom in this structure. Finally, the magnetic properties of intercalated atoms between GNR and h-BN sheet are investigated.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.158-158
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• 2012

A new kind of organic-inorganic hybrid polymer, poly(tetraphenyl)silole siloxane (PSS), was invented and synthesized for realization of its unique charge trap properties. The organic portions consisting of (tetraphenyl)silole rings are responsible for electron trapping owing to their low-lying LUMO, while the Si-O-Si inorganic linkages of high HOMO-LUMO gap provide the intrachain energy barrier for controlling electron transport. Such an alternation of the organic and inorganic moieties in a polymer may give an interesting quantum well electronic structure in a molecule. The PSS thin film was fabricated by spin-coating of the PSS solution in THF organic solvent onto Si-wafer substrates and curing. The electron trapping of the PSS thin films was confirmed by the capacitance-voltage (C-V) measurements performed within the metal-insulator-semiconductor (MIS) device structure. And the quantum well electronic structure of the PSS thin film, which was thought to be the origin of the electron trapping, was investigated by a combination of theoretical and experimental methods: density functional theory (DFT) calculations in Gaussian03 package and spectroscopic techniques such as near edge X-ray absorption fine structure spectroscopy (NEXAFS) and photoemission spectroscopy (PES). The electron trapping properties of the PSS thin film of quantum well structure are closely related to intra- and inter-polymer chain electron transports. Among them, the intra-chain electron transport was theoretically studied using the Atomistix Toolkit (ATK) software based on the non-equilibrium Green's function (NEGF) method in conjunction with the DFT.