• 한국소음진동공학회논문집
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• 제14권2호
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• pp.128-135
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• 2004

Generally, heavy electronic products undergo many different types of shocks in transportation from a manufacturer to customers. Cushioning package is used to protect electronic products from severe shock environments. Since the mass distribution of heavy electronic products is usually unbalanced and complex. it is very difficult to design a cushioning package with having high performance by considering only the equivalent stiffness of that. Therefore, when designing the cushioning package for a heavy electronic product, it is necessary to optimize its shape in order to maximize the cushioning performance. In this study, it is focused on designing an optimal shape of cushioning package for a large refrigerator and an efficient design method is suggested by using a dynamic finite element analysis. As the results of this study the optimal shape of cushioning package, which has high cushioning performance and minimized volume, was obtained through the mechanical drop analysis and a optimization process. Through free drop tests of refrigerators, it was identified that the cushioning performance of the cushioning package was improved up by 25% and the its own volume was reduced by 22 ％.

• Journal of Mechanical Science and Technology
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• 제14권2호
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• pp.251-258
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• 2000

Thermal deformation in an electronic package due to thermal strain mismatch is investigated. The warpage and the in-plane deformation of the package after encapsulation is analyzed using the laminated plate theory. An exact solution for the thermal deformation of an electronic package with circular shape is derived. Theoretical results are presented on the effects of the layer geometries and material properties on the thermal deformation. Several applications of the exact solution to electronic packaging product development are illustrated. The applications include lead on chip package, encapsulated chip on board and chip on substrate.

• 센서학회지
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• 제31권1호
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• pp.36-40
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• 2022

High-power devices, such as LEDs and radars, inevitably generate a large amount of heat, which is the main cause of shortening lifespan, deterioration in performance, and failure of electronic devices. The embedded IC process can be a solution; however, when applied to large-area substrates (larger than 8 in), there is a limit owing to the difficulty in the process after wafer thinning. In this study, an 8-in wafer-level high-power electronic package based on the embedded IC process was implemented with temporary bonding and debonding technology using double-sided thermal release tape. Good heat-dissipation characteristics were demonstrated both theoretically and experimentally. These findings will advance the commercialization of high-power electronic packaging.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2003년도 추계학술대회논문집
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• pp.677-683
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• 2003

Generally, heavy electronic products undergo many different types of shocks in transporting from a manufacturer to customers. Cushioning package materials are used to protect electronic products from severe shock environments. Since the mass distributions of heavy electronic products are usually unbalanced and complex, it is very difficult to design a cushioning package with haying high performance by considering only the equivalent stiffness of that. Therefore, when designing the cushioning material for a heavy electronic product, it is necessary to optimize its shape in order to maximize the cushioning performance. In this study, it is focused on designing an optimal shape of cushioning material for a large-sized refrigerator and an efficient design method is suggested by using a dynamic finite element analysis. As the results of this study, the optimal shape of cushioning material, which has high cushioning performance and minimized volume, was obtained from the drop analysis and a optimization process. From free drop tests of a refrigerator, it was identified that the cushioning performance of the optimal package were improved up to 16 % and the volume of it was reduced in a range of 22 %.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1673-1678
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• 2007

The use of flip-chip type electronic package offers numerous advantages such as reduced thickness, improved environmental compatibility, and downed cost. Despite numerous benefits, flip-chip type packages bare several reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycles attributed to gradual delamination growth through chip and adhesive film interface induced by CTE mismatch driven shear and peel stresses. The electronic package in use is heated continuously by itself. When the crack at a weak site of the electronic package occurs, thermal deformationon the chip side is changed. Therefore, we can measure these micro deformations by using Moire interferometry and find out the crack length.

• 마이크로전자및패키징학회지
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• 제20권3호
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• pp.75-80
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• 2013

전자패키징 기술의 발전에 따라 패키지의 소형화는 집적화에 따른 열 소산 면적 감소로 인하여 패키지의 온도 상승을 초래한다. 온도 상승은 소자의 성능을 저해하여, 시스템 고장을 발생을 유발시키며 수명을 단축시킨다. 본 연구에서는 마이크로 패턴과 세미 임베디드 구조를 결합하여 열 소산을 극대화 시킬 수 있는 새로운 구조를 제안하여 열특성을 평가하였다. 제안 구조의 열특성 평가 결과, 기존 구조에 비하여 최대 온도는 $20^{\circ}C$낮았으며, 범프의 최대 응력은 20%이상 감소하여 제안 구조의 유효성을 확인하였다.

• 마이크로전자및패키징학회지
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• 제19권1호
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• pp.1-7
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• 2012

Reliability technology has been expected to grow rapidly for new types of electronic equipments. We have selected several reliability issues in electronic package to be reviewed. This paper will provide a view of the current state of technological progress in reliability of electronic package in Japan, and will discuss future prospects for the technology.

• 한국정보처리학회논문지
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• 제7권9호
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• pp.2783-2796
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• 2000

전자상거래 시스템에서 패키지 상품의 구매가 이루어지기 위해서는 패키지 상품을 구성하는 상품들이 구비되어 있어야 할뿐만 아니라 충분한 수량이 확보되어 있어야만 구매자의 요구가 있을 때 이를 실시간으로 처리할 수 있게 된다. 그리고 다수의 사용자가 동시에 가상쇼핑몰에 접근하여 패키지 상품을 구매하고자 할 때에도 상품에 대한 동시성 제어가 효율적으로 이루어져야만 한다. 본 논문에서는 고정형 패키지와 맞춤형 패키지상품 구매 시 상품선택과 구매가 효율적으로 이루어지도록 하기 위해서 모든 상품에 대한 실 수량과 판매가능 수량정보를 유지토록 함으로써 구매자의 요구를 실시간으로 처리할 수 있도록 하였고, 트랜잭션의 처리율이 향상되도록 하였다. 그리고 트랜잭션의 동시성 제어를 효율적으로 하기 위해서 잠금을 기반으로 한 동시성제어 알고리즘을 제시하였다.

• 한국전기전자재료학회논문지
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• 제29권2호
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• pp.79-83
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• 2016

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• 한국전자거래학회지
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• 제15권4호
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• pp.33-47
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• 2010

웹기록물은 공공기관의 업무활동이나 전자상거래에 대한 법적증거로 활용될 수 있기 때문에 보존할 가치가 있는 정보이지만 웹기록물의 특징 중 하나인 '휘발성'으로 인해 소실되고 있다. 따라서 이렇게 사라지는 웹기록물을 장기보존하기 위한 장기보존포맷이 정의되어야 한다. 웹기록물은 전자기록물의 일종이기 때문에 전자기록물 장기보존포맷에 보존할 수 있어야 한다. 하지만 현재 표준으로 제시된 포맷은 웹기록물의 특성을 고려하지 않고 정의되었기 때문에 웹기록물을 보존할 수 없다. 본 논문에서는 표면/심층 웹기록물 문서보존포맷으로 연구된 KoDeWeb/KoSurWeb과 전자기록물 장기보존포맷을 분석하고, 이를 바탕으로 웹기록물을 보존할 수 있는 확장된 전자기록물 장기보존포맷을 정의하였다. 정의된 포맷을 활용하면 웹기록물도 전자기록물들과 같이 보존되어 활용될 수 있고, 전자 상거래에 관련된 공공기관의 웹기록물을 보존함으로써 전자 상거래에 대한 법적 증거로서 활용될 수 있다.