Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Introduction of Reliability Test Technology for Electronics Package

전자패키지 신뢰성 평가기술의 개요

  • Received : 2012.03.05
  • Accepted : 2012.03.09
  • Published : 2012.03.31
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Abstract

Reliability technology has been expected to grow rapidly for new types of electronic equipments. We have selected several reliability issues in electronic package to be reviewed. This paper will provide a view of the current state of technological progress in reliability of electronic package in Japan, and will discuss future prospects for the technology.

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References

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