• Title/Summary/Keyword: Electronic package

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Optimal Design for Cushioning Package of a Heavy Electronic Product Using Mechanical Drop Analysis (낙하충격해석을 통한 대형 전자제품의 완충포장재 최적설계)

  • 금대현;김원진;김성대;박상후
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.14 no.2
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    • pp.128-135
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    • 2004
  • Generally, heavy electronic products undergo many different types of shocks in transportation from a manufacturer to customers. Cushioning package is used to protect electronic products from severe shock environments. Since the mass distribution of heavy electronic products is usually unbalanced and complex. it is very difficult to design a cushioning package with having high performance by considering only the equivalent stiffness of that. Therefore, when designing the cushioning package for a heavy electronic product, it is necessary to optimize its shape in order to maximize the cushioning performance. In this study, it is focused on designing an optimal shape of cushioning package for a large refrigerator and an efficient design method is suggested by using a dynamic finite element analysis. As the results of this study the optimal shape of cushioning package, which has high cushioning performance and minimized volume, was obtained through the mechanical drop analysis and a optimization process. Through free drop tests of refrigerators, it was identified that the cushioning performance of the cushioning package was improved up by 25% and the its own volume was reduced by 22 %.

Evaluation of Thermal Deformation in Electronic Packages

  • Beom, Hyeon-Gyu;Jeong, Kyoung-Moon
    • Journal of Mechanical Science and Technology
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    • v.14 no.2
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    • pp.251-258
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    • 2000
  • Thermal deformation in an electronic package due to thermal strain mismatch is investigated. The warpage and the in-plane deformation of the package after encapsulation is analyzed using the laminated plate theory. An exact solution for the thermal deformation of an electronic package with circular shape is derived. Theoretical results are presented on the effects of the layer geometries and material properties on the thermal deformation. Several applications of the exact solution to electronic packaging product development are illustrated. The applications include lead on chip package, encapsulated chip on board and chip on substrate.

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Large Area Wafer-Level High-Power Electronic Package Using Temporary Bonding and Debonding with Double-Sided Thermal Release Tape (양면 열박리 테이프 기반 임시 접합 공정을 이용한 대면적 웨이퍼 레벨 고출력 전자패키지)

  • Hwang, Yong-Sik;Kang, Il-Suk;Lee, Ga-Won
    • Journal of Sensor Science and Technology
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    • v.31 no.1
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    • pp.36-40
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    • 2022
  • High-power devices, such as LEDs and radars, inevitably generate a large amount of heat, which is the main cause of shortening lifespan, deterioration in performance, and failure of electronic devices. The embedded IC process can be a solution; however, when applied to large-area substrates (larger than 8 in), there is a limit owing to the difficulty in the process after wafer thinning. In this study, an 8-in wafer-level high-power electronic package based on the embedded IC process was implemented with temporary bonding and debonding technology using double-sided thermal release tape. Good heat-dissipation characteristics were demonstrated both theoretically and experimentally. These findings will advance the commercialization of high-power electronic packaging.

Optimal Design for Cushioning Package of a Heavy Electronic Product using Mechanical Drop Analysis (낙하충격해석을 통한 대형 전자제품의 완충포장재 최적설계)

  • 금대현;김원진;김성대;박상후
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2003.11a
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    • pp.677-683
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    • 2003
  • Generally, heavy electronic products undergo many different types of shocks in transporting from a manufacturer to customers. Cushioning package materials are used to protect electronic products from severe shock environments. Since the mass distributions of heavy electronic products are usually unbalanced and complex, it is very difficult to design a cushioning package with haying high performance by considering only the equivalent stiffness of that. Therefore, when designing the cushioning material for a heavy electronic product, it is necessary to optimize its shape in order to maximize the cushioning performance. In this study, it is focused on designing an optimal shape of cushioning material for a large-sized refrigerator and an efficient design method is suggested by using a dynamic finite element analysis. As the results of this study, the optimal shape of cushioning material, which has high cushioning performance and minimized volume, was obtained from the drop analysis and a optimization process. From free drop tests of a refrigerator, it was identified that the cushioning performance of the optimal package were improved up to 16 % and the volume of it was reduced in a range of 22 %.

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Effect analysis of thermal-mechanical behavior on fatigue crack of flip-chip electronic package (플립 칩 전자 패키지의 피로 균열이 미치는 열적 기계적 거동 분석)

  • Park, Jin-Hyoung;Lee, Soon-Bok
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1673-1678
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    • 2007
  • The use of flip-chip type electronic package offers numerous advantages such as reduced thickness, improved environmental compatibility, and downed cost. Despite numerous benefits, flip-chip type packages bare several reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycles attributed to gradual delamination growth through chip and adhesive film interface induced by CTE mismatch driven shear and peel stresses. The electronic package in use is heated continuously by itself. When the crack at a weak site of the electronic package occurs, thermal deformationon the chip side is changed. Therefore, we can measure these micro deformations by using Moire interferometry and find out the crack length.

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A Study on the Optimization of Heat Dissipation in Flip-chip Package (플립칩 패키지의 열소산 최적화 연구)

  • Park, Chul Gyun;Lee, Tae Ho;Lee, Tae Kyoung;Jeong, Myung Yung
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.3
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    • pp.75-80
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    • 2013
  • According to advance of electronic packaging technology, electronic package becomes smaller. Miniaturization of package causes the temperature rise of package. This can degrade life of electronic device and generate the failure of electronic system. In this study, we proposed a new semi-embedded structure with micro pattern for maximizing heat dissipation. A proposed structure showed the characteristics which have maximum temperature lower than $20^{\circ}C$ compared with conventional structure. And also, in view of thermal stress and strain, our structure showed a remarkably low value compared with other ones. We expect that the new structure proposed in this work can be applied to an flip-chip package of the future.

Introduction of Reliability Test Technology for Electronics Package (전자패키지 신뢰성 평가기술의 개요)

  • Tanaka, Hirokazu;Kim, Keun-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.1
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    • pp.1-7
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    • 2012
  • Reliability technology has been expected to grow rapidly for new types of electronic equipments. We have selected several reliability issues in electronic package to be reviewed. This paper will provide a view of the current state of technological progress in reliability of electronic package in Japan, and will discuss future prospects for the technology.

Study on Thermal Characteristics of Smart LED Driver ICs Package (일체형 스마트 LED Driver ICs 패키지의 열 특성 분석)

  • Kang, Ey Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.2
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    • pp.79-83
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    • 2016
  • This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

Extension of the Long-term Archival Information Package for Electronic Records to Accommodate Web Records (웹기록물 보존을 위한 전자기록물 장기보존포맷 확장 설계)

  • Park, Boung-Joo;Cha, Seung-Jun;Lee, Kyu-Chul
    • The Journal of Society for e-Business Studies
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    • v.15 no.4
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    • pp.33-47
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    • 2010
  • Web records is valuable information to preserve, because it can be used as a legal evidence about business or e-commerce of a public institution, but it is easily disappeared because of its volatile characteristic. Therefore, archival information package should be defined for long-term preservation. Web records can be stored in the archival information package for electronic records, because web records is a kind of electronic records. However, the NEO(NARS Encapsulation Object), the archival information package for electronic records in Korea, can't able to store web records, because it was developed without consideration of the characteristic of web records. In this paper, we define extended NEO based on the analysis of KoSurWeb and KoDeWeb, that archival information package for document of surface and deep web as well as the NEO. Web records can be preserved and utilized along with electronic records by using the extended NEO. Also it can be used for record and legal evudence by archiving web records of public institution about e-commerce.