• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.59-64
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• 2014

Transfer is the critical issue of producing high-quality and scalable graphene electronic devices. However, conventional transfer processes require the removal of an underlying metal layer by wet etching process, which induces significant economic and environmental problems. We propose the etching-free mechanical releasing of graphene using polymer adhesives. A fracture mechanics approach was introduced to understand the releasing mechanism and ensure highyield process. It is shown that the thickness of adhesive and target substrate affect the transferability of graphene. Based on experimental and fracture mechanics simulation results, we further observed that compliant adhesives can reduce the adhesive stress during the transfer, which also enhances the success probability of graphene transfer.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.23-29
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• 2014

Less power consumption, lower cost, smaller size and more functionality are the increasing demands for consumer electronic devices. The three dimensional(3-D) TSV packaging technology is the potential solution to meet this requirement because it can supply short vertical interconnects and high input/output(I/O) counts. Cu(Copper) has usually been chosen to fill the TSV because of its high conductivity, low cost and good compatibility with the multilayer interconnects process. However, the CTE mismatch and Cu ion drift under thermal stress can raise reliability issues. This study discribe the thermal stress reliability trend for successful implementation of 3-D packaging.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.35-43
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• 2017

The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.47 no.2
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• pp.50-54
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• 2010

Soft recovery (SR) quasi-resonant converter (QRC) including a Folding snubber network (FSN) is introduced. It is obtained by combining normal quasi-resonant converter with folding snubber network of which the surrounding components are composed of passive devices only (diodes and capacitors). The reverse recovery loss of the main rectifier diode is eliminated by this method utilizing quasi resonance with Folding snubber network. By realizing soft switching condition, the proposed converter has PWM capability with high efficiency and is suitable for high output current and high power DC to DC converter application.

• Journal of the Korean Society for Railway
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• v.8 no.3
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• pp.260-266
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• 2005

The deterioration of a shunting locomotive was characterized for the lifetime assessment. The locomotive has been used for shunting works in steel making processes, and in this investigation, various types of technical evaluation methods for the locomotive parts were employed to assess the current deterioration status and to provide important clue for lifetime prediction. Unlike other rolling stocks in railway applications, the diesel shunting locomotive is composed of major components such as diesel engine, transmission, gear box, brake system, electronic devices, etc., which cover more than 70 percent of the total price of the locomotive. Therefore, in this paper, each part of major components in the diesel locomotive was analyzed in terms of the degree of deterioration. The lift-cycle-cost (LCC) analysis was performed based on the maintenance and repair history as compared with economical cost to provide the cost-effective prediction, i.e., to assess either repair for reuse or putting the locomotive out of service based on cost-effective calculation.

• Proceedings of the KSR Conference
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• 2007.05a
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• pp.730-734
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• 2007

National projects on renewable energy and new energy are driven more actively than ever in many countries for the exhaustion of fossil fuel energy from the turn of the century. Such activities began to spread out in railway industry with centering around west European countries. Electric energy is generated on the hybrid vehicle itself, which contributes to reduction of the cost for construction of the infrastructure required for the supply of electric power. Hybrid tram is mainly composed of propulsion system to control electric energy, automatic guidance system to control steering and operation, and central vehicle unit to control and monitor major electronic devices. Generation and supply of electric power are made by the combination of engine generator and battery, or fuel cell and super capacitor.

• Proceedings of the Optical Society of Korea Conference
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• 2000.02a
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• pp.224-225
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• 2000

Transparent and hard materials such as sapphire are used for many industrial applications as optical windows, hard materials on mechanical contact against abrasion, and substrate materials for opto-electronic semiconductor devices such as blue LED and blue LD etc. The materials should be cut along the proper shapes possible to be used for each application. In case of blue LED, the blue LED wafer should be cut to thousands of blue LED pieces at the final stage of the manufacturing process. The process of cutting the wafer is usually divided into two steps. The wafer is scribed along the proper shapes in the first step. It is inserted between transparent flexible sheets for easy handling. And then, it is broken and split in the next step. Harder materials such as diamonds are usually used to scribe the wafer, while it has a problem of low depth of scribing and abrasion of the harder material itself. The low depth of scribing can induce failure in breaking the wafer along the scribed line. It was also known that the expensive diamond tip should be replaced frequently for the abrasion. (omitted)

• Journal of Sensor Science and Technology
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• v.20 no.3
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• pp.187-192
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• 2011

Abrasive blaster is similar to sand blaster, and effectively removes hard and brittle materials. Exiting abrasive blaster has applied to rough working such as deburring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro abrasive blaster was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro blaster in MEMS process of glass and succeed in domestically producing complete micro blaster. Diameter of hole and width of line in this etching is 100 ${\mu}m$ ~ 1000 ${\mu}m$. Experimental results showed good performance in micro channel and hole in glass wafer. Therefore, this micro blaster could be effectively applied to the micro machining of semiconductor, micro PCR chip.

• Journal of Sensor Science and Technology
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• v.17 no.1
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• pp.35-40
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• 2008

Low power bridge type micro gas sensors were fabricated by micro machining technology with TMAH (Tetra Methyl Ammonium Hydroxide) solution. The sensing devices with different heater materials such as metal and poly-silicon were obtained using CMOS (Complementary Metal Oxide Semiconductor) compatible process. The tellurium films as a sensing layer were deposited on the micro machined substrate using shadow silicon mask. The low power micro gas sensors showed high sensitivity to NO with high speed. The pure tellurium film used micro gas sensor showed good sensitivity than transition metal (Pt, Ti) used tellurium film.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2000.06a
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• pp.206-211
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• 2000

Demands on a quiet environment is increasing because of noisiness and annoyance due to the extended use of noisy electronic device. Determination of sound power levels of noise sources using sound pressure in a reverberation room is usually a relevant method for devices with comparatively large volume or unevenly distributed source position. This study aims to observe the contents of ISO 3741 and analyze its changes in the revised standard ISO 3741-1999. And also aims to assess the revised ISO 1999 its effectiveness and limitations with an actual application to measure the sound power level of a refrigerator.