• 한국생산제조학회지
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• 제20권1호
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• pp.81-85
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• 2011

Recently, the electronic parts are to be thinner plate, smaller size, light weight material and CPU, HDD and DRAM in all the parts have been produced on the basis of the high speed and greater capacity. Also, conventional goods have replaced a LED (Light-Emitting Diode) in lighting products so; such industry devices need to have cooling. To maximize all the performance on the heat-radiated products, the area of heat-radiated parts is required to be cooled for keeping the life time extension and performance of product up. Existing cooling systems are using radiant heat plate of aluminum, brass by extrusion molding, heat pipe or hydro-cooling system for cooling. There is a limitation for bringing the light weight of product, cost reduction, molding of the cooling system. So it is proposed that an alternative way was made for bringing to the cooling system. EP (Engineering Plastic) of low-cost ABS (Acrylonitrile butadiene styrene Resin) and PC (Polycarbonate) was coated with brass and the coating made the radiated heat go up. The performance of radiant heat plate is the similar to the existing part. We have studied experimentally on the radiated heat plate for the light-weight, molding improvement and low-cost. From now on, we are going to develop the way to replace the exiting plate with exterior surface of product as a cooling system.

• 한국전자통신학회논문지
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• 제9권12호
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• pp.1435-1440
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• 2014

본 논문에서는 13.2W급 COB LED의 공랭식 방열을 위해 열전소자를 이용하여 열적 특성을 분석하였다. 기존 방식과의 방열 성능을 비교 분석하기 위하여 Heat Sink를 설계 및 제작 하였고 실험은 100분간 COB LED를 구동시켜 접촉식 온도계를 통하여 온도 분포를 측정하였다. 접합부의 온도 측정 결과 열전소자를 사용하지 않는 방식에서는 약 $75^{\circ}C$로 나타났고, 열전소자에 0.8A의 전류를 인가하여 구동하였을 때 $57^{\circ}C$로 열 응집현상이 가장 심한 COB LED 접합부분의 열은 기존의 방식보다 약 31% 감소됨을 확인하였다.

• 한국지능시스템학회논문지
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• 제25권2호
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• pp.161-167
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• 2015

본 논문에서는 응축수를 활용하는 새로운 열전 냉각장치를 소개하고 이 냉각장치에 대한 전기적 등가회로 모델을 제안한다. 소개된 냉각장치는 수집된 응축수를 히트싱크로 분무함으로써 응축수를 처리함과 동시에 냉각 효율을 향상시킬 수 있다. 기존의 열전 냉각장치에 대한 회로 모델과 열전소자-응축수 간의 열교환 방정식을 결합함으로써 소개된 냉각장치의 전기적 등가회로 모델을 유도한다. 유도된 모델의 파라미터는 별도의 실험을 통한 데이터 측정 없이 열전소자의 데이터시트 정보만으로 결정되기 때문에 소개된 냉각장치의 제어기를 설계하는 단계에서 해당 모델이 유용하게 사용될 수 있다. 제안된 모델의 타당성을 모의실험을 통해 확인하고 기존의 열전 냉각장치와 성능을 비교함으로써 응축수를 활용한 열전 냉각장치의 우수성 또한 검증한다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.259-260
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• 2006

This study was progressed to value of Bi2212 tubes uniformity depend on cooling conditions. The tube from 150 mm in length, 30 mm in O.D., 20 mm in I.D., 5 mm in thickness was combined with electrodes by 3 sections. The tube from 60, 70 mm in length, 30, 50 mm in O.D., 20.4, 40.4 mm in I.D., 4.8 mm in thickness was in controled of cooling rate by a heat exchanger. Bi2212 tubes were fabricated by Centrifugal Forming Process (CFP) and they were annealed at $840^{\circ}C$ for 80 h in oxygen atmosphere. The tube from 150 mm in length was analyzed by EFDLab of NIKA to show cooling rate and temperature distributions. When the tube was cooled for 100s, the temperature distributions was $663^{\circ}C$ in the middle, $500{\sim}647^{\circ}C$ in inlet, $598{\sim}647^{\circ}C$ in the other side. Electric characteristics from $I_c$ was 450 A in the middle, 650 A in inlet, 600 A in the other side. Electric characteristics by a heat exchanger showed the more fast cooling rate, the more high $I_c$.

• Journal of Advanced Marine Engineering and Technology
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• 제35권8호
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• pp.994-1000
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• 2011

본 논문은 압전소자의 주기적인 발진운동을 탄성 변환하여 유체유동을 유발하는 압전소자 팬의 수치해석 모델에 대한 연구이다. LED 모듈 등의 고밀도 열이 발생하는 소형 전자장치의 냉각에 적용이 가능한 압전소자 냉각팬의 성능 향상을 위해 CFD 도구를 이용하였다. 본 논문의 결과는 압전소자의 길이 5cm와 방열판의 길이 3cm라는 비율이 효과적이었다. 이는 기하학적으로 비슷한 형태를 가지고 다른치수를 가지는 모델에서 기초적인 설계를 하는데 도움이 될 것이다.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2009년도 하계학술발표대회 논문집
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• pp.1385-1390
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• 2009

In this study the purpose is development of passive cooling system for telecommunication cabinet used by latent heat material. This cooling system is not required for electronic power. It was tested for the performance of the telecommunication combined latent heat material with $48^{\circ}C$ of phase changed temperature and heat pipe. At $45^{\circ}C$ of outside temperature, when heater power was 1,000 W and 1,500 W, the inside temperature of the cabinet was $55^{\circ}C$ and $62^{\circ}C$. This system was showed better performance than the other systems.

• 한국세라믹학회지
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• 제54권2호
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• pp.75-85
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• 2017

Thermoelectric is a key technology for energy harvesting and solid-state cooling by direct thermal-to-electric energy conversion (or vice versa); however, the relatively low efficiency has limited thermoelectric systems to niche applications such as space power generation and small-scale or high-density cooling. To expand into larger scale power generation and cooling applications such as ATEG (automotive thermoelectric generators) and HVAC (heating, ventilation, and air conditioning), high-performance bulk thermoelectric materials and their low-cost processing are essential prerequisites. Recently, the performance of commercial thermoelectric materials including $Bi_2Te_3$-, PbTe-, skutterudite-, and half-Heusler-based compounds has been significantly improved through non-equilibrium processing technologies for defect engineering. This review summarizes material design approaches for the formation of multi-dimensional and multi-scale defect structures that can be used to manipulate both the electronic and thermal transport properties, and our recent progress in the synthesis of conventional thermoelectric materials with defect structures is described.

• 대한기계학회논문집B
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• 제29권1호
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• pp.16-26
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• 2005

Air-cooled heat sinks are employed in many electronic cooling applications since they provide significant heat transfer enhancement and operational flexibility. Strip-shaped fin heat sink is of interest and needs to be investigated as general cooling products for more applicability. The purposes of this study are to evaluate heat sink performance without bypass flow condition and to determine optimal heat sink geometries. The results show that the decreasing rate of thermal resistance of a heat sink decreases with increasing inlet air velocity, and the increasing rate of pressure drop increases with increasing inlet air velocity, but is not affected by input power. The increasing rate of optimal longitudinal fin spacing is larger than that of transverse fin spacing. The strip fin heat sink tested in this study showed better cooling performance compared to that of other plate fin type.matism. 2004; 50(11): 3504-3515.

• Journal of Advanced Marine Engineering and Technology
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• 제36권1호
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• pp.64-71
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• 2012

An efficient cooling system is an essential part of the electronic packaging such as a high-luminance LED lighting. A special technology, Pulsating Heat Pipe (PHP), can be applied to improve cooling of a sealed, explosion-proof LED light fixture. In this paper, the characteristics of the pulsating heat pipes in the imposed thermal boundary conditions of LED lightings were experimentally investigated and a PHP device that works free of alignment angle was investigated for cooling of explosion-proof LED lights. Five working fluids of ethanol, FC-72, R-123, water, and acetone were chosen for comparison. The experimental pulsating heat pipe was made of copper tubes of internal diameter of 2.1 mm, 26 turns. A variable heat source of electric heater and an array of cooling fins were attached to the pulsating heat pipe. For the alignment of the heating part at bottom, an optimum charging ratio (liquid fluid volume to total volume) was about 50% for most of the fluids and water showed the highest heat transfer performance. For the alignment of the heating part on top, however, only R-123 worked in an un-looped construction. This unique advantage of R-123 is attributed to its high vapor pressure gradient. Applying these findings, a cooling device for an explosion-proof type of LED light rated 30 W was constructed and tested successfully.

• 한국응용과학기술학회지
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• 제31권3호
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• pp.402-407
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• 2014

Herein, we describe the effect of the cooling-off condition of a solution-processed 6,13-bis(triisopropylsilylethynyl)-pentacene (TIPS-pentacene) film on its molecular distribution and the resultant electrical properties. Since the solvent in a TIPS-pentacene droplet gradually evaporates from the rim to the center exhibiting a radial form of solute, for a quenched case, domains of the TIPS-pentacene film are aboriginally spread showing original features of radial shape due to suppressed molecular rearrangement during the momentary cooling period. For the slowly cooled case, however, TIPS-pentacene molecules are randomly rearranged during the long cooling period. As a result, in the lopsided electrodes structure proposed in this work, the charge transport generates more effectively under the case for radial distribution induced by the quenching technique. It was found that the molecular redistribution during the cooling-period plays an important role on the magnitude of the mobility in a solution-processed organic transistor. This work provides at least a scientific basis between the molecular distribution and electrical properties in solution-processed organic devices.