Browse > Article
http://dx.doi.org/10.3795/KSME-B.2005.29.1.016

Cooling Characteristics of a Strip Fin Heat Sink  

Park. Cheol-Woo (경북대학교 기계공학부)
Kim. Hyun-Woo (안동정보대학 컴퓨터응용기계과)
Jang .Chung-Sun (경북대학교 대학원 기계공학부)
Riu. Kap-Jong (경북대학교 기계공학부)
Publication Information
Transactions of the Korean Society of Mechanical Engineers B / v.29, no.1, 2005 , pp. 16-26 More about this Journal
Abstract
Air-cooled heat sinks are employed in many electronic cooling applications since they provide significant heat transfer enhancement and operational flexibility. Strip-shaped fin heat sink is of interest and needs to be investigated as general cooling products for more applicability. The purposes of this study are to evaluate heat sink performance without bypass flow condition and to determine optimal heat sink geometries. The results show that the decreasing rate of thermal resistance of a heat sink decreases with increasing inlet air velocity, and the increasing rate of pressure drop increases with increasing inlet air velocity, but is not affected by input power. The increasing rate of optimal longitudinal fin spacing is larger than that of transverse fin spacing. The strip fin heat sink tested in this study showed better cooling performance compared to that of other plate fin type.matism. 2004; 50(11): 3504-3515.
Keywords
Heat Sink; Hear Transfer Enhancement; Strip-Shaped Fin; Thermal Resistance;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 Shaukatullah, H., Storr, R. W., Hansen, J. B. and Gaynes, A. M., 1996, 'Design and Optimization of Pin Fin Heat Sinks for Low Velocity Applications,' IEEE Trans. on Components, Packaging, and Manufacturing Technology-Part A, Vol. 19, No. 5, pp. 486-494   DOI   ScienceOn
2 Sara, O. N., 2003, 'Performance Analysis of Rectangular Ducts with Staggered Square Pin Fins,' Energy Conversion and Management, Vol. 44, No. 11, pp. 1787-1803   DOI   ScienceOn
3 Lee, S., 1995, 'Optimum Design and Selection of Heat Sinks,' IEEE Trans. on Component, Packaging and Manufacturing Technologies, Part A, Vol. 18, No.4, pp. 812-817   DOI   ScienceOn
4 Biber, C. R. and Belady, C. L., 1997, 'Pressure Drop Prediction for Heat Sinks: What is the Best Method,' Trans. ASME Proc. of the Advances in Electronic Packaging, Vol. 2, pp. 1829-1835
5 Copeland, D., 2000, 'Optimization of Parallel Plate Heatsinks for Forced Convection,' 16th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 266-272   DOI
6 Kang, H. S., 2001, 'Optimization of a 3-D Theramally Asymmetric Rectangular Fin,' KSME International Journal, Vol. 15, No. 11, pp. 1541-1547
7 Kays, W. M. and London, A. L., 1964, Compact Heat Exchangers, MsGraw-Hill Co., New York
8 Bar-Cohen, A., 1997, 'Air-Cooled Heat Sinks-Trends and Future Directions,' Proc. Advances in Electronic Packaging, Vol. 2, pp. 1827-1828
9 Jonsson, H. and Palm, B., 2000, 'Thermal and Hydraulic Behavior of Plate Fin and Strip Fin Heat Sinks Under Varying Bypass Conditions,' IEEE Trans. on Component and Packaging Technologies, Vol. 23, No.1, pp. 47-54   DOI   ScienceOn
10 Dally, J. W., 1990, Packaging of Electronic System A Mechanical Engineering Approach, McGraw-Hill, Inc., New York
11 Wood, A. S., Tupholme, G. E., Bhatti, M. I. H. and Heggs, P. J., 1995, 'Steady-State Heat Transfer Through Extended Plane Surfaces,' Int. Communications in Heat and Mass Transfer, Vol. 22, No.1, pp. 99-109   DOI   ScienceOn
12 Kadle, D. S. and Sparrow, E. M., 1986, 'Numerical and Experimental Study of Turbulent Heat Transfer and Fluid Flow in Longitudinal Fin Arrays,' Trans. ASME J. of Heat Transfer, Vol. 108, pp. 16-23   DOI
13 Cho, Y. J., Choi, C. H., Kim, J. J. and Lee, J. H., 2001, 'Optimum Design of Microchannel Heat Sinks,' Trans. of the KSME B, Vol. 25, No. 1, pp. 117-123   과학기술학회마을
14 Moffat, R. J., 1988, 'Describing the Uncertainties in Experimental Results,' Experimental Thermal and Fluid Science, Vol. 1, pp. 3-17   DOI   ScienceOn
15 Jonsson, H. and Moshfegh, B., 2001, 'Modeling of the Thermal and Hydraulic Performance of Plate Fin, Strip Fin, and Pin Fin Heat Sinks - Influence of Flow Bypass,' IEEE Trans. on Component and Packaging Technologies, Vol. 24, No.2, pp. 142-149   DOI   ScienceOn
16 Behm, J. and Huttunen, J., 2001, 'Heat Spreading and Conduction in Compressed Heat Sinks,' 10th Int. Flotherm User Conference, pp. 1-38
17 Yovanovich, M. M., 1994, 'Heat Transfer in Electronic Packaging,' 10th Int. Heat Transfer Conference, Vol. 1, pp. 93-104
18 Ledezma, G., Morega, A. M. and Bejan, A., 1996, 'Optimal Spacing Between Pin Fins With Impinging Flow,' Trans. ASME J. of Heat Transfer, Vol. 118, pp. 570-577   DOI   ScienceOn