• Journal of the Korean Society of Industry Convergence
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• v.26 no.3
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• pp.463-470
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• 2023

In this study, an electronic parts assembly training system using Leap Motion was developed in consideration of the processes actually operated in the assembly process of electronic products. Based on Leap Motion and Oculus VR equipment, the system was developed to transfer user's hand movement data in real time and convert it into hand movement in virtual space so that electronic parts assembly simulation can be performed step by step. Through this, it was confirmed that the user can obtain an experience similar to the actual electronic parts assembly work, prevent errors that may occur during the assembly process, and improve proficiency. It is expected that this thesis will provide directions for the quality improvement and development of various education and training programs for virtual reality-based manufacturing processes.

• Journal of Korean Society of Archives and Records Management
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• v.12 no.1
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• pp.141-165
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• 2012

Since 'the National Assembly Electronic Document System' was introduced in September 2004, the amount of electronic records production in the Nation Assembly has been on a rapid increase. The number of electronic records which 'the National Assembly Records Management System' took over until September 2011 is '240,000', 72% of the total transferred records. However, the National Assembly's electronic records management has a number of serious problems concerning electronic records long-term management and preservation. In the context, this study aims at discussing alternative strategies for effective management and preservation of the Nation Assembly electronic records. In the theoretical aspect, it reviews 'parliament records' definition and management trend. As a case study, it explores the present state of 'the National Assembly Records Management System' ranging from legal aspects to technical aspects. Based on these researches the study critically analyzes the Nation Assembly's electronic records management in comparison with overseas cases. As a result it provides alternative plans of four major areas, including law, management body, management object and technical system, to improve the National Assembly's electronic records management.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1063-1068
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• 2004

A numerical study is performed to predict the effect of operating conditions on the thermal response of electronic assemblies during infrared reflow soldering. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated, and the predictions illustrate the detailed thermal responses. Parametric study is performed to determine the thermal response of electronic assemblies to various conditions such as conveyor speed, exhaust velocity, and component emissivity. The predictions of the detailed electronic assembly thermal response can be used in selecting the oven operating conditions to ensure proper soldering and minimization of thermally-induced electronic assembly stresses.

• Korean Journal of Materials Research
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• v.24 no.10
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• pp.509-514
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• 2014

We demonstrate a simple and effective method to accurately position silicon nanowires (Si NWs) at desirable locations using drop-casting of Si NW inks; this process is suitable for applications in nanoelectronics or nanophotonics. Si NWs were assembled into a lithographically patterned sacrificial photoresist (PR) template by means of capillary interactions at the solution interface. In this process, we varied the type of solvent of the SiNW-containing solution to investigate different assembly behaviors of Si NWs in different solvents. It was found that the assembly of Si NWs was strongly dependent on the surface energy of the solvents, which leads to different evaporation modes of the Si NW solution. After Si NW assembly, the PR template was cleanly removed by thermal decomposition or chemical dissolution and the Si NWs were transferred onto the underlying substrate, preserving its position without any damage. This method enables the precise control necessary to produce highly integrated NW assemblies on all length scales since assembly template is easily fabricated with top-down lithography and removed in a simple process after bottom-up drop-casting of NWs.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.22 no.50
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• pp.209-219
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• 1999

This paper presents an efficient operational technique of material feeding process, trainning for multi-operations, machine conditions, and role of foreman and material-supplying man, for constructing the flexible assembly cells in the domestic electronic industries. And an practical method for computing the number of economical cells is also presented by the cost-effective model that compares the additional assembly machine requirement with the four reductive effects including WIP/finished goods inventory, the troubles in the assembly line, the opportunity loss for small order quantity, and amounts of production management due to the introduction of cell line. An case study is introduced in for a domestic electronic assembly line at the end.

• Journal of Welding and Joining
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• v.21 no.6
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• pp.46-54
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• 2003

The thermal response of electronic assemblies during forced convection-infrared reflow soldering is studied. Soldering for attaching electronic components to printed circuit boards is performed in a process oven that is equipped with porous panel heaters, through which air is injected in order to dampen temperature fluctuations in the oven which can be established by thermal buoyancy forces. Forced convection-infrared reflow soldering process with air injection is simulated using a 2-dimensional numerical model. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated. Parametric study is also performed to study the effects of various conditions such as conveyor speed, blowing velocity, and electronic assembly emissivity on the thermal response of electronic assemblies. The results of this study can be used in the process oven design and selecting the oven operating conditions to ensure proper solder melting and solidification.

• Journal of the Korea Society of Computer and Information
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• v.24 no.6
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• pp.125-133
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• 2019

This study aimed to investigate the political system related to the Electronic Government Law by analyzing the process of the common initiative of the law. To achieve the goal, this study applied the method of social analysis and sugessted the proper role of the assembly for realizing the electronic government and its control. The data were gathered from the bill information service of the national assembly. Netminer 4.0 was used for refining and analyzing data. The results are as follows. First, by analyzing three centrality(degree, betweenness, and eigenvector) of assembly member, the network effect of the powered party and reelected members were revealed as strong in the network. Second, through the component analysis, 5 sub-network has shown in total. The sub-networks showed two distinctive difference between two big parties. By the difference, members in two parties showed different characteristics in constituting communities and the effect of the powered party revealed as strong and clear. Based on the result, this study demonstrated the necessity of social solidarity rather than solipsism in committing common initiative. And a chronological research is need to anlayze $18^{th}$ and $19^{th}$ assembly to verify the effect of the powered party in prospect study.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.543-548
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• 2000

In this study, an interactive programming method for robot in electronic part assembly task is proposed. Many of industrial robots are still taught and programmed by a teach pendant. The robot is guided by a human operator to the desired application locations. These motions are recorded and are later edited, within the robotic language using in the robot controller, and play back repetitively to perform robot task. This conventional teaching method is time-consuming and somewhat dangerous. In the proposed method, the operator teaches the desired locations on the image acquired through CCD camera mounted on the robot hand. The robotic language program is automatically generated and downloaded to the robot controller. This teaching process is implemented through an off-line programming software. The OLP is developed for an robotic assembly system used in this study. In order to transform the location on image coordinates into robot coordinates, a calibration process is established. The proposed teaching method is implemented and evaluated on an assembly system for soldering electronic parts on a circuit board. A six-axis articulated robot executes assembly task according to the off-line teaching in the system.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.6
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• pp.496-500
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• 2003

Molecular self-assembled of surfactant viologen are of recent interest because they can from functional electrodes as well as micellar assemblies, which can be profitably utilized for display devices, photoelectrochemical studies and electrocatalysis as electron acceptor or electron mediator. Fromherz et al studied the self-assembly of thiol and disulfide derivatives of viologens bearing long n-alkyl chains on Au electrode surface[1]. The electrochemical behavior of self-assembled viologen monolayer has been investigated with QCM, which has been known as nano-gram order mass detector. The self-assembly process of viologen was monitored using resonant frequency(ΔF) and resonant resistance(R). The redox process of viologen was observed with resonant frequency(ΔF).

• Transactions on Electrical and Electronic Materials
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• v.13 no.3
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• pp.129-135
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• 2012

A number of surface mount technology (SMT) process variables including land design are considered for minimizing tombstone defect in flexible printed circuit assembly in high volume manufacturing. As SMT chip components have been reduced over the past years with their weights in milligrams, the torque that once helped self-centering of chips, gears to tombstone defects. In this paper, we have investigated the correlation of the assembly process variables with respect to the tombstone defect by employing statistically designed experiment. After the statistical analysis is performed, we have setup hypotheses for the root causes of tombstone defect and derived main effects and interactions of the process parameters affecting the hypothesis. Based on the designed experiments, statistical analysis was performed to investigate significant process variable for the purpose of process control in flexible printed circuit manufacturing area. Finally, we provide beneficial suggestions for find-pitch PCB design, screen printing process, chip-mounting process, and reflow process to minimize the tombstone defects.