• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 하계종합학술대회 논문집
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• pp.385-388
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• 1999

A new frequency-variant equivalent circuit model of power/ground plane is presented. The equivalent circuit is modeled with grid cells. The circuit parameters of each cell were extracted by using Fasthenry. To verify the developed circuit model, its s-parameters are compared with the measured s-parameters 〔2〕 and the full-wave simulation-based s-parameters. Consequently, it is shown that our frequency-variant equivalent circuit model can accurately predict imperfect ground effects under the high frequency operation of electronic package.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2006년도 하계종합학술대회
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• pp.487-488
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• 2006

In this paper, we analyzed the FBGA packages operating in high speeds and high frequency rates for DRAM. Using 3D simulations, we could extract s-parameters of packages. We realize that the proposed FBGA package does not operate properly at 3Gbps bacause the FBGA package have delta-I noise($V_{{\Delta}I-peak}$) of 132.0mV and crosstalk of 300mV, which is 25% of the operating clock level.

• 한국산학기술학회논문지
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• 제12권3호
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• pp.1479-1487
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• 2011

모바일 IT기기 등의 전자부품 분야에서 다기능, 고용량 메모리를 가능하게 하는 패키지의 중요성이 점차 증대되고 있다. 이러한 목적으로 여러개의 칩을 하나의 패키지에 실장하여 다기능, 고용량을 구현하는 Multi Chip Package(MCP)가 활용되고 있다. 이러한 MCP에서 칩과 칩간 접합 혹은 칩과 지지부재(substrate)간 접합을 구현하기위해 에폭시계 필름형 접착제가 사용되고 있다. 에폭시, 아민, 머캡탄, 아이소시아네이트 등의 유기 반응기를 가진 실란커플링제를 적용하여 에폭시계 필름형 접착제에 대한 점착성과 신뢰성을 확인하였다. 결과로부터 에폭시계 반응기를 가진 실란커플링제를 적용한 시료의 점착성과 필특성이 가장 뛰어났으며, 내습 테스트에서 계면파괴가 억제되어 가장 좋은 신뢰성을 나타내었다.

• 한국전자파학회논문지
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• 제18권5호
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• pp.563-568
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• 2007

본 논문에서 제안된 패키지 안테나는 900 MHz RFID 대역에 적용하기 위하여 미엔더 라인과 단락 핀을 부설하고 LTCC(Low Temperature Cofired Ceramic) 층의 공동 내부에 RFID BGA(Ball Grid Array) 칩을 장착하였다. BGA 칩과 안테나 사이에 발생되는 커플링과 혼신을 감소시키기 위한 격리 특성을 확보하기 위하여 접지면과 비아 펜스를 부설하여 Faraday Cage를 구현하였다. 제안된 안테나는 낮은 주파수 대역에서 패키지 단계의 안테나 구현에 관점을 두었다. 제안된 안테나의 크기는 $13mm{\times}9mm{\times}3.51mm$이며, 측정된 안테나의 공진 주파수는 0.893 GHz, 임피던스 대역폭은 9 MHz, 최대 방사 이득은 -2.36 dBi를 나타내었다.

• 월간포장계
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• 통권135호
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• pp.80-85
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• 2004

• Corrosion Science and Technology
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• 제6권6호
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.

• 한국전기전자재료학회논문지
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• 제16권12S호
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• pp.1237-1241
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• 2003

In this paper, we report a novel RF-MEMS packaging technology with lightweight, small size, and short electric path length. To achieve this goal, we used the ultra thin silicon substrate as a packaging substrate. The via holes lot vortical feed-through were fabricated on the thin silicon wafer by wet chemical processing. Then, via holes were filled and micro-bumps were fabricated by electroplating. The packaged RF device has a reflection loss under 22 〔㏈〕 and a insertion loss of -0.04∼-0.08 〔㏈〕. These measurements show that we could package the RF device without loss and interference by using the vertical feed-through. Specially, with the ultra thin silicon wafer we can realize of a device package that has low-cost, lightweight and small size. Also, we can extend a 3-D packaging structure by stacking assembled thin packages.

• 한국전기전자재료학회논문지
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• 제23권12호
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• pp.973-977
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• 2010

The temperature of junction in LED affects the life time and performance. however, the measurement of junction temperature in module is very difficult. In this paper, to measure the junction temperature in LED module, optical and electrical properties is measured in single package in temperature from 25 [$^{\circ}C$] to 85 [$^{\circ}C$], and then junction temperature can is estimated in module with measuring the average voltage of single package. As results, the junction temperature of single package is measured the temperature of 61.2 [$^{\circ}C$] in ambient temperature, also, the junction temperature of LED module is measured the temperature of 72.5 [$^{\circ}C$] in ambient temperature.

• 한국전기전자재료학회논문지
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• 제26권4호
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• pp.330-334
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• 2013

We developed a package of remote phosphor structure having blue LED chips and phosphors physically separated, and the characteristics were evaluated according to different classifications of phosphor coatings. Remote phosphor was produced by screen printing coating on glass substrate with phosphor content rated paste and heat treatment. After mounting Remote phosphor, which has been classified according to number of coatings, on top of blue LED chips, luminous flux, luminous efficacy, CCT and CRI were measured. The measurement results showed the most suitable characteristics of white LED package as a general light source when the content rate of phosphor in Remote phosphor was 80 wt.% with 3 layers of coatings and thickness over $12{\mu}m$.

• 마이크로전자및패키징학회지
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• 제15권1호
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• pp.39-44
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• 2008

In this paper, fully embedded 2.4GHz WLAN band pass filter (BPF) was investigated into a multi-layered organic packaging substrate using high Q spiral stacked inductors and high Dk MIM capacitors for low cost RF System on Package (SOP) applications. The proposed 2.4GHz WLAN BPF was designed by modifying chebyshev second order filter circuit topology. It was comprised of two parallel LC resonators for obtaining two transmission zeros. It was designed by using 2D circuit and 3D EM simulators for finding out optimal geometries and verifying their applicability. It exhibited an insertion loss of max -1.7dB and return loss of min -l7dB. The two transmission zeros were observed at 1.85 and 6.7GHz, respectively. In the low frequency band of $1.8GHz{\sim}1.9GHz$, the stop band suppression of min -23dB was achieved. In the high frequency band of $4.1GHz{\sim}5.4GHz$, the stop band suppression of min -l8dB was obtained. It was the first embedded and the smallest one of the filters formed into the organic packaging substrate. It has a size of $2.2{\times}1.8{\times}0.77mm^3$.