• Title/Summary/Keyword: Electronic Components

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Analysis of the Nursing Practice in a Medical ICU Based on an Electronic Nursing Record (간호기록을 이용한 중환자실 간호업무 조사연구)

  • Song, Kyung-Ja
    • Journal of Korean Academy of Nursing
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    • v.37 no.6
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    • pp.883-890
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    • 2007
  • Purpose: The purpose of this study was to identify the entity of critical care nursing practices through analyzing nursing statements described by electronic nursing records in a MICU. Methods: 176,459 nursing statements of 188 patients during a 6 month-stay were analyzed statement by statement according to the nursing process(nursing phenomena, nursing diagnosis, & nursing activity) and 21 nursing components of Saba's Clinical Care Classification. Results: Among 176,459 single statements, the statements of nursing activity ranked first in number. The contents of the statements were analyzed and categorized by main themes. Among 489 categorized themes, the number of themes of nursing phenomena statements was the highest. When analyzed by Saba's clinical Care Classification, the nursing statements mainly included a physiological component. Among 21 components, the respiratory component ranked in the first position in nursing phenomena, nursing diagnosis and nursing activity. The extra statements not included in the 21 components were 9,294(15.1%) in nursing phenomena and 21,949(22.7%) in nursing activity. Most are statements related to tests and the doctor. Conclusion: The entity of MICU nursing practice expressed by electronic nursing records was mainly focused on physiological components and more precisely on respiratory components.

Phase transformation and magnetic properties of $Ni_xFe_{100-x}$ thin films deposited by a co-sputtering (동시 스퍼터링법으로 제조된 $Ni_xFe_{100-x}$ 박막의 상변화와 자기적 특성)

  • Kang, Dae-Sik;Song, Jong-Han;Nam, Joong-Hee;Cho, Jeong-Ho;Chun, Myoung-Pyo
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.19 no.6
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    • pp.282-287
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    • 2009
  • $Ni_xFe_{100-x}$ films with a thickness of about 100nm were deposited on Si(100) substrates at room temperature by a DC magnetron co-sputtering using Fe and Ni targets. Compositional, structural, electrical and magnetic properties of the films were investigated. $Ni_{67}Fe_{33}$, $Ni_{55}Fe_{45}$, $Ni_{50}Fe_{50}$, $Ni_{45}Fe_{55}$, $Ni_{40}Fe_{60}$ films are obtained by increasing the sputtering power of the Fe target. The films of x < 55 have BCC structure and show the phase transformation after annealing at the range of $300{\sim}450^{\circ}C$ for 2 h. On the other hand, the films of x < 50 have the mixed crystalline phases of BCC and FCC after the annealing treatment. The saturation magnetization was decreased initially by the phase transformation effect but then increased again after annealing at $450^{\circ}C$ due to the grain growth and crystallization of BCC phases.

Phase transformation and magnetic properties of NiFe thin films on Si(100) wafer and SiO2/Si(100) substrate by co-sputtering (Si(100) wafer와 SiO2/Si(100) 기판에 동시 스퍼터링법으로 증착된 NiFe 합금 박막의 상변화 및 자기적 특성)

  • Kang, Dae-Sik;Song, Jong-Han;Nam, Joong-Hee;Cho, Jeong-Ho;Chun, Myoung-Pyo
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.20 no.5
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    • pp.216-220
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    • 2010
  • Ni-Fe alloys have various applications such as thin film inductor, thin film transformer, magnetic head's shield case, etc. Magnetic properties of Ni-Fe thin films depend on the process parameters such as thickness, contents, deposition rate, substrates, etc. In this study, NiFe films with a thickness of about 150nm were deposited on Si(100) wafer and $SiO_2$/Si(100) substrate at room temperature by a DC magnetron co-sputtering using Fe and Ni targets. Their phase formation and magnetic properties as a function of annealing temperature were investigated with XRD, FE-SEM and VSM. The assputtered films have BCC structure. With increasing annealing temperature, NiFe thin film for $SiO_2$/Si(100) substrate transformed completely from BCC to FCC phase above $500^{\circ}C$, but some BCC phase remained above $500^{\circ}C$ on Si(100) wafer. For samples annealed at $450^{\circ}C$, squareness ratio of NiFe thin film shows peak value and its saturation magnetization is around 0.0118 emu, which means that the optimum annealing temperature of NiFe thin film seems to be $450^{\circ}C$. The saturation magnetization of films decreased rapidly above the annealing temperature of $500^{\circ}C$ due to phase transformation from BCC to FCC phase.

Harmonic Effects and Consideration in Power Converter and Component (전력변환장치의 고조파 영향 및 연구동향)

  • Cho Sung-Joon;Kim Tae-Wan;Woo Myung-Ho;Seo Kwang-Duk
    • Proceedings of the KIPE Conference
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    • 2001.07a
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    • pp.467-470
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    • 2001
  • Power electronic converters generate the harmonic voltage and current, and these harmonics have the harmful effects on the various components. For example, passive components such as capacitor and inductor, transformer, motor and other components are mainly affected in the power electronic system. Thus, the design and manufacturing of the power converters, which have the harmonic-free or mitigation strategies, are required. In particular, the lifetime and durability of these components are main requirement for enhancing the overall stability of the system. So, in this paper, the harmonics-related problems to the neighbouring components and mitigation research trends are presented.

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Failure Mechanism of Bendable Embedded Electronic Module Under Various Environment Conditions (Bendable 임베디드 전자모듈의 손상 메커니즘)

  • Jo, Yun-Seong;Kim, A Young;Hong, Won Sik
    • Journal of Welding and Joining
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    • v.31 no.5
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    • pp.59-63
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    • 2013
  • A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

Piezoelectric properties of PSNZT ceramics with Mn electronic valence (PSNZT계 세라믹스에서 Mn전자가 변화에 따른 압전 특성)

  • Suk, Jong-Min;Lee, Moon-Seok;Lee, Yong-Hyun;Hur, Geun;Choi, Chal-Hee;Lee, Young-Hwan;Cho, Jeong-Ho;Kim, Byung-Ik;Ko, Tae-Gyung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.11a
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    • pp.171-172
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    • 2005
  • PSNZT계 압전 세라믹스는 압전 특성을 개량하고, 여러 가지 응용 분야의 요구를 만족할 특성을 얻기 위해 Mn을 포함하는 첨가물에 관한 연구를 하였다. Mn을 포함하는 산화물은 기계적 품질계수($Q_m$)를 높이는 강화제로 널리 활용되고 있으며, $Mn^{4+}$를 갖는 $MnO_2$가 가장 많이 사용되고 있다. 산화물에서 Mn 전자가는 여러 상태 인데, 이런 전자가의 변화가 압전 특성에 미치는 영향을 조사하였다. Mn 전자가에 따라서 소결체의 미세구조는 $MnCO_3$$Mn_3O_4$경우 입자크기가 10${\mu}m$정도였으며, $Mn_2O_3$$MnO_2$의 입자크기는 $1\sim5{\mu}m$정도로 불규칙하였다. 전반적으로 소결체는 밀도가 $7.75g/cm^2$이상이었고, 치밀하였다. $MnCO_3$경우 전기기계 결합계수는 56%이고, $MnO_2$경우 기계적 품질계수는 2000이상이었다.

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Development of Reliability Simulator for Electronic Components (전자부품 통합 신뢰성 Simulator 개발)

  • Kim, Wan-Doo;Lee, Seung-Woo;Han, Seung-Woo;Osterman, Michael
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1749-1753
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    • 2007
  • The reliability, that is Long-Term Quality, require an approaching different from Short-Term Quality which is used before. As the electronic components are able to be easily normalized on the reliability testing, various testing standards are used. In this study, we proposed two reliability simulator that is PoF(Physics of Failure)-based and failure rate models-based. PoF-based simulator is introduced based on CalceEP program that is created by University of Maryland. This simulator can be modified by user interface of properties and PoF models and operated on stand alone system. Failure rate models-based simulator introduced according to analyzing reliability prediction documents. Also, unified database including failure data models is built from existing MIL-HDBK-217F N2, PRISM, and Bellcore, and web-based simulator is developed. The developed reliability simulator will service of the PoF model, properties, failure rate model accumulated and its data by web and internet.

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Industrial Feature of Rare Metals in Electronic Components (전자부품산업에서의 희소금속의 산업적 특징)

  • Kim, Taek-Soo;Lee, Min-Ha;Kim, Bum-Sung;Choi, Han-Shin;Kim, Yong-Hwan;Lee, Hyo-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.2
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    • pp.1-9
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    • 2011
  • Rare metals, called as vitamins of industry, are defined as the elements which are very few in the earth and are difficult to extract from ores. The requirements for total amounts of rare metals have increased as the global economics grows and the function of electronic components varies considerably. The rare metals have been maldistributed to America, CIS(Commonwealth of Independent States), China, Australia, Canada as about 80% of total natural resources, which also lead to unequal materials flow or distribution. Therefore, it was needed to investigate the feature of rare metals in terms of industry as well as technology. We could identify the industrial issues associated with the supply of critical rare elements in electronic components.

Study for Inspection Method of Electronic Components Using 3-D X-ray Imaging Technology (3차원 X-ray 영상 기법을 이용한 전자부품 검사 기술 연구)

  • Sim, Hyeok-Hun;Park, Gi-Nam;Kim, Jong-Hyeong;Park, Hui-Jae
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.16 no.5
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    • pp.157-161
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    • 2007
  • There are technological changes to reduce the size and weight of electronic components and to accommodate multi-functions in them. To meet this trend, more complicated technological processes are required. To maintain the processes, more accurate inspection systems are also necessary. Therefore, new inspection methods are needed, which is differ from conventional inspection methods such as electrical test methods ICT(In-Circuit Test), FCT(Function Test) and visual test using optical equipments. One of the possible approaches is non-destructive test using X-ray. In this paper, an inspection method using X-ray is developed and applied to inspection of soldering state and internal defects of electronic components.

Analysis of Chemical and Morphological Changes of Phenol Formaldehyde-based Photoresist Surface caused by O2 Plasma

  • Shutov, D.A.;Kang, Seung-Youl;Baek, Kyu-Ha;Suh, Kyung-Soo;Min, Nam-Ki;Kwon, Kwang-Ho
    • Transactions on Electrical and Electronic Materials
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    • v.8 no.5
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    • pp.211-214
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    • 2007
  • Chemical and morphological changes of phenol formaldehyde-based photoresist after $O_2$ radiofrequency(RF) plasma treatment depending on exposure time and source power were investigated. It was found that etch rate of photoresist sharply increased after discharge turn on and reached a limit with increase in plasma exposure time. Contact angle measurements and X-ray photoelectron spectroscopy(XPS) analysis showed that the surface chemical structure become nearly constant after 15 sec of the treatment. Atomic force microprobe(AFM) measurements were shown that surface roughness was increased with plasma exposure time.