• Title/Summary/Keyword: Electronic Board

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전자상거래 분쟁해결제도의 개선방안에 관한 연구

  • Kim, Seok-Cheol
    • Journal of Arbitration Studies
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    • v.10 no.1
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    • pp.68-90
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    • 2000
  • This paper disscusses about the e-commerce and the various types of e-commerce disputes. Through empirical examination on the dispute consiliation system and by comparative analysis it is derived out of the weakness of current system and finally some suggestions for improvement. First, it is recommended that the more sophisticated knowledge concerning e-commerce should be proliferated through the existing institutions. For example, disputes for B2C could be managed by the consiliation system of consumer dispute consiliation in Consumer Protecion Board of Korea, while B2B by the arbitration system of the Korean Commercial Arbitraion Board. Second, the role of Korea Institute for Electronic Commerce established for the purpose of consiliation of e-commerce disputes is much emphasized. For successful achievement, it is necessarily required to reinforce the related laws, systems, institutions and human resources. Finally, it is also suggested that the the Korean Commercial Arbitraion Board and Consummer Protection Board of Korea fully cover consiliation and arbitration, while Korea Institute for Electronic Commerce activates its proper role of consulting and ad hoc arbitration by using electronic information. The paper points out the last one as the most desired practice.

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A Study on the Test Strategy of the Mounted Devices on the Electronic Circuit Board (부품이 실장된 아날로그 회로 보오드의 검사 전략에 대한 연구)

  • Ko, Yun-Seok;Choi, Byung-Kun
    • Proceedings of the KIEE Conference
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    • 2001.07d
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    • pp.2196-2198
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    • 2001
  • Because the circuit board has the structure connected by circuit patterns, the work to test whether the analog devices or circuits such as resisters, capacitors, inductors, diodes, etc. on the tested board is goof or not is very difficult. This paper proposes the test method of identifing the faulted devices or faulted circuit on the circuit board using guarding circuit. The guarding method is the techniqus measuring accurately the value of the devices by separating the electronic devices to be tested from around it. Finally, the availability and accuracy of the proposed test method is verified by applying the technique to a test electronic circuit.

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The Fabrication and Characterization of Embedded Switch Chip in Board for WiFi Application (WiFi용 스위치 칩 내장형 기판 기술에 관한 연구)

  • Park, Se-Hoon;Ryu, Jong-In;Kim, Jun-Chul;Youn, Je-Hyun;Kang, Nam-Kee;Park, Jong-Chul
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.3
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    • pp.53-58
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    • 2008
  • In this study, we fabricated embedded IC (Double Pole Double throw switch chip) polymer substrate and evaluate it for 2.4 GHz WiFi application. The switch chips were laminated using FR4 and ABF(Ajinomoto build up film) as dielectric layer. The embedded DPDT chip substrate were interconnected by laser via and Cu pattern plating process. DSC(Differenntial Scanning Calorimetry) analysis and SEM image was employed to calculate the amount of curing and examine surface roughness for optimization of chip embedding process. ABF showed maximum peel strength with Cu layer when the procuring was $80\sim90%$ completed and DPDT chip was laminated in a polymer substrate without void. An embedded chip substrate and wire-bonded chip on substrate were designed and fabricated. The characteristics of two modules were measured by s-parameters (S11; return loss and S21; insertion loss). Insertion loss is less than 0.55 dB in two presented embedded chip board and wire-bonded chip board. Return loss of an embedded chip board is better than 25 dB up to 6 GHz frequency range, whereas return loss of wire-bonding chip board is worse than 20 dB above 2.4 GHz frequency.

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Effect of Test Board on Insertion Loss of GHz Multilayer LC-Filter (GHz용 적층 LC필터의 삽입손실에 대한 Test Board의 영향)

  • Chun, Myoung-Pyo;Cho, Jung-Ho;Kim, Byung-Ik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.11a
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    • pp.173-175
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    • 2005
  • The effects of PCB Board on the filter characteristics such as insertion loss and transmission characteristics were investigated for the measurement of 5GHz LC filter. Insertion loss measured with PCB Board of Teflon is 0.3 dB lower in comparion with FR-4. The filter characteristics measured in the passband were different from the calculated results. In comparison with the calculated value, the measured value shows that center frequency is 20MHz lower, passband is narrower and insertion loss is larger. The difference of Insertion loss between Teflon and FR-4 increases with increasing measurement frequency.

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Thermal Stress Analysis for the Printed Circuit Board of Electronic Packages (전자장비 회로기판의 열응력해석)

  • Kwon Y. J.;Kim J. A.
    • Korean Journal of Computational Design and Engineering
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    • v.9 no.4
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    • pp.416-424
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    • 2004
  • In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

Implemention of ID-CZP pattern for system verification through FPGA board (FPGA board를 통한 시스템 검증용 1D-CZP 패턴의 구현)

  • Park, Jung-Hwan;Jang, Won-Woo;Lee, Sung-Mok;Kim, Joo-Hyun;Kang, Bong-Soon
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2007.10a
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    • pp.131-134
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    • 2007
  • In this paper, we propose the 1D-CZP pattern for FPGA verification. The algorithm that was implemented by Verilog-HDL on FPGA board is verified before the chip is producted. Input through the external sensor might not be enough to verify the algorithm on FPGA board. Hence, both external input and internal input can lead the verification of the algorithm. This paper suggests the hardware implementation of compact 1D-CZP pattern that has the random input. It is useful to analyze the characteristics of the filter frequencies and organized as ROM Table which is efficient to Modulus operation.

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Prototype System Of The Electronic Bulletin Board Integrated Management System

  • Abe, Michiko;Sato, Kiwamu;Ogasawara, Naohito;Nunokawa, Hiroshi;Noguchi, Shoichi
    • Proceedings of the Korean Society for Emotion and Sensibility Conference
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    • 2002.05a
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    • pp.39-43
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    • 2002
  • Various electronic bulletin board systems (BBS) exist on the Internet. A user has to use two or more BBS. Because his/her interests may not be restricted to only one subject and BBS satisfying his/her interests may not be restricted to only one also. Furthermore, in each BBS, two or more subjects are parallel discussed while the newest contribution is always carried out. Therefore, when a user tries to keep on perusing about a specific subject, it is necessary for the user to remember in which BBS the subject exists and in the past what article of the subject was read. In this paper, we are aiming to construct an electronic bulletin board integrated management system. In this system, a user is able to use two or more BBS just like one BBS. In this paper, we present a framework of the electronic bulletin board integrated management system and implementation of a prototype system.

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A Study on Settlement System of Disputes in Electronic Commerce (전자거래 분쟁해결 제도에 관한 소고 - 분쟁해결기관을 중심으로 -)

  • 강이수
    • Journal of Arbitration Studies
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    • v.13 no.2
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    • pp.69-102
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    • 2004
  • This paper discusses about the e-commerce and the various types of e-commerce disputes. Through empirical examination on the dispute consideration system and by comparative analysis it is derived out of the weakness of current system and finally some suggestions for improvement. First, it is recommended that the more sophisticated knowledge concerning e-commerce should be proliferated through the existing institutions. For example, disputes for B2C could be managed by the consideration system of consumer dispute consideration in Consumer Protection Board of Korea, while B2B by the arbitration system of the Korean Commercial Arbitration Board. Second, the role of Korea Institute for Electronic Commerce established for the purpose of consideration of e-commerce disputes is much emphasized. For successful achievement, it is necessarily required to reinforce the related laws, systems, institutions and human resources. Finally, it is also suggested that the Korean Commercial Arbitration Board and Consumer Protection Board of Korea fully cover consideration and arbitration, while Korea Institute for Electronic Commerce activates its proper role of consulting and ad hoc arbitration by using electronic information. This study results are how to minimize the disputes and the method of dispute settlement. Therefore, a role of arbitration proposed and emphasized. To protect the dispute in advance, it's suggested to revise rules timely following on technical changes, and emphasized that the dispute has to lead to arbitration settlement not for consuming unnecessary time and finance for enterprises and consumers.

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Thick Film Resistance Paste for Improving Reliability and TCR Properties of Embedded Resistor Board (내장형 저항 기판의 신뢰성과 TCR 개선을 위한 후막 저항 페이스트에 관한 연구)

  • Lee, S.M.;Yoo, M.J.;Park, S.D.;Kang, N.K.;Nam, S.
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.1
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    • pp.27-31
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    • 2008
  • Due to the increasing need for miniaturization of electronic device, embedded resistor technology using thick film resistance paste to embed resistors currently mounted on the board thus effectively reducing board size, is being extensively researched. In this research, thick film resistor paste having $0.35{\sim}4k{\Omega}/sq$ range of resistivity were fabricated using mixtures of carbon black and epoxy resin. In order to adjust the TCR (temperature coefficient resistivity), TCR modifiers such as Ni-Cr alloy, $SiO_2$ powder were added and were able to improve on TCR value with $100ppm/^{\circ}C$. Finally embedded resistor board using thick film resistance paste were fabricated. Stable resistivity value and reliability results were achieved.

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A Study on the Effect of Using an Electronic Board in a Mathematics Classroom (수학수업에서 저비용으로 구성된 전자칠판의 활용효과에 대한 연구)

  • Park, Woong-Seo;ChoiKoh, Sang-Sook
    • Journal of the Korean School Mathematics Society
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    • v.14 no.1
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    • pp.1-29
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    • 2011
  • In this study, we designed and constructed a very low-cost electronic board in order to test its efficiency in the classroom as well as provide an easy-to-follow model for front-line teachers to re-create and utilize for their own academic use. For our sample size, we tested 143 high school first grade students. In mathematical achievement, we found meaningful improvement in both genders but we did not find any meaningful gender differences. In the mathematical disposition test, we also found some meaningful changes in curiosity and flexibility in both genders but did not find any meaningful gender differences either. Based on this study, we propose using our low-cost electronic board system, which is easy to make and effective in mathematical achievement, instead of recently promoted high-cost electronic board systems.

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