• 정보저장시스템학회논문집
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• 제1권2호
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• pp.127-131
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• 2005

We report a nanometer scale mark formation using a $PtO_x$ thin film or a TbFeCo rare-earth transition metal film and the mechanism. The multi-layer samples($ZnS-SiO_2/PtOx/ZNS-SiO_2,\;ZnS-SiO_2/TbFeCo/ZnS-SiO_2$) were prepared with a magnetron sputtering method on a polycarbonate or a glass substrate. By laser irradiation of approximately a few nanoseconds, nanometer scale marks were fabricated. During the fabrication process, the thin films were thermally reacted or inter-diffused during the laser irradiation. 75 nm bubble marks in the PtOx multi-layer sample by an approximately 4-ns laser irradiation. Inside the bubble mark, Pt particles with a few nanometer sizes are distributed. The $50{\sim}100$ nm bubble marks in the TbFeCo multi-layer sample by a few nanosecond laser irradiations. We will report the detail structure of the samples, the bubble mark formation process and the mechanism.

• 대한전자공학회논문지SD
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• 제38권6호
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• pp.383-389
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• 2001

본 논문에서는 밀리미터파 대역에서 응용 가능한 AIGaAs/InGaAs PHEMT를 제작하고 특성을 분석하였다. 제작에 사용된 PHEMT 웨이퍼는 ATLAS 시뮬레이터를 이용하여 DC 및 RF 특성을 최적화 하였다. 게이트 길이가 0.35 ㎛이고 서로 다른 게이트 폭과 게이트 핑거 수를 갖는 PHEMT를 전자빔 노광장치를 이용하여 제작하였다. 제작된 소자의 게이트 길이와 핑거수에 따른 RF 특성변화를 측정 분석하였다. 게이트 핑거 수가 2개인 PHEMT의 DC 특성으로 1.2 V의 무릎 전압, -1.5 V의 핀치-오프 전압, 275 ㎃/㎜의 드레인 전류 밀도 및 260.17 ㎳/㎜의 최대 전달컨덕턴스를 얻었다. 또한 RF 특성으로 35 ㎓에서 3.6 ㏈의 S/sub 21/ 이득, 11.15 ㏈의 MAG와 약 45 ㎓의 전류 이득 차단 주파수 그리고 약 100 ㎓의 최대 공진주파수를 얻었다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제4권2호
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• pp.117-123
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• 2004

A 30 nm $In_{0.7}GaAs$ High Electron Mobility Transistor (HEMT) with triple-gate has been successfully fabricated using the $SiO_2/SiN_x$ sidewall process and BCB planarization. The sidewall gate process was used to obtain finer lines, and the width of the initial line could be lessened to half by this process. To fill the Schottky metal effectively to a narrow gate line after applying the developed sidewall process, the sputtered tungsten (W) metal was utilized instead of conventional e-beam evaporated metal. To reduce the parasitic capacitance through dielectric layers and the gate metal resistance ($R_g$), the etchedback BCB with a low dielectric constant was used as the supporting layer of a wide gate head, which also offered extremely low Rg of 1.7 Ohm for a total gate width ($W_g$) of 2x100m. The fabricated 30nm $In_{0.7}GaAs$ HEMTs showed $V_{th}$of -0.4V, $G_{m,max}$ of 1.7S/mm, and $f_T$ of 421GHz. These results indicate that InGaAs nano-HEMT with excellent device performance could be successfully fabricated through a reproducible and damage-free sidewall process without the aid of state-of-the-art lithography equipment. We also believe that the developed process will be directly applicable to the fabrication of deep sub-50nm InGaAs HEMTs if the initial line length can be reduced to below 50nm order.

• 대한전자공학회논문지SD
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• 제39권1호
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• pp.18-24
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• 2002

본 논문에서는 서로 다른 dose를 갖는 이중 노광 방법을 사용한 전자빔 묘화 방법을 이용하여 0.2 ㎛의 wide-head T-게이트를 갖는 PHEMT를 제작하였다. 0.2 ㎛의 게이트 길이와 1.3 ㎛의 게이트 머리의 크기를 갖는 wide-head T-게이트를 형성하기 위하여 PMMA/P(MMA-MAA)/PMMA의 3층 레지스트 구조를 사용하였다. 0.2 ㎛의 게이트 길이와 80 ㎛의 단위 게이트 폭 및 4개의 게이트 핑거를 갖는 PHEMT의 DC 특성으로 323 ㎃/㎜의 드레인 전류 밀도 및 232 mS/㎜의 최대 전달 컨덕턴스를 얻었다. 또한 동일한 소자의 RF 특성으로 40 ㎓에서 2.91 ㏈의 S/sub 21/ 이득과 11.42 ㏈의 MAG를 얻었으며, 전 이득 차단 주파수와 최대 공진 주파수는 각각 63 ㎓와 150 ㎓였다.

• 전기전자학회논문지
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• 제17권1호
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• pp.71-76
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• 2013

본 연구에서는 AlGaN/GaN HEMT (High electron mobility transistor)를 제작하고 채널폭의 감소에 따른 특성의 변화를 고찰하였다. AlGaN/GaN 이종접합구조 기반의 기판 위에 채널의 길이는 $1{\mu}m$, 채널 폭은 각각 $0.5{\sim}9{\mu}m$가 되도록 전자선 리소그라피 방법으로 트랜지스터를 제작하였다. 게이트를 형성하지 않은 상태에서 채널의 면저항을 측정한 결과 sub-${\mu}m$ 크기로 채널폭이 작아짐에 따라 채널의 면저항이 급격히 증가하였으며, 트랜지스터의 문턱전압은 $1.6{\mu}m$와 $9{\mu}m$의 채널폭에서 -2.85 V 이었으며 $0.9{\mu}m$의 채널폭에서 50 mV의 변화, $0.5{\mu}m$에서는 350 mV로 더욱 큰 변화를 보였다. 트랜스컨덕턴스는 250 mS/mm 내외의 값으로부터 sub-${\mu}m$ 채널에서 150 mS/mm로 채널폭에 따라 감소하였다. 또한, 게이트의 역방향 누설전류는 채널폭에 따라 감소하였으나 sub-${\mu}m$ 크기에서는 감소가 둔화되었는데 채널폭이 작아짐에 따라 나타는 이와 같은 일련의 현상들은 AlGaN 층의 strain 감소로 인한 압전분극 감소가 원인이 되는 것으로 사료된다.

• 한국진공학회지
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• 제20권5호
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• pp.339-344
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• 2011

C-plane 사파이어 기판 위에 펄스 레이저 증착법으로 증착시킨 n-type ZnO 박막에 대한 Ti/Au 금속의 Ohmic 접합특성을 TLM (transfer length method) 패턴 전극을 통하여 연구하였다. 여기서, Ti와 Au 금속박막은 전자빔 증착기와 열 증착기로 각각 35 nm와 90 nm 두께로 증착하였으며, TLM패턴은 광 리소그래피 법으로 면적이 $100{\times}100{\mu}m^2$인 전극패턴을 6~61 ${\mu}m$ 간격으로 형성하였다. Ti/Au 금속박막과 ZnO 반도체 사이의 전기적인 성질을 개선하고 응력과 계면 결함을 감소시키기 위해, 산소 가스 분위기로 $100{\sim}500^{\circ}C$ 온도에서 각각 1분간 급속열처리를 하였다. $300^{\circ}C$의 온도에서 열처리한 시료에서 $1.1{\times}10^{-4}{\Omega}{\cdot}cm^2$의 가장 낮은 비저항 값을 보였는데, 이것은 열처리 동안 티타늄 산화막 형성과정에서 ZnO 박막 표면 근처에 산소빈자리가 형성됨으로써 나타나는 전자농도의 증가가 주된 원인으로 고려되었다.

• 한국전기전자재료학회논문지
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• 제33권2호
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• pp.99-104
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• 2020

In this study, we fabricated a metamorphic high-electron-mobility transistor (mHEMT) device with a T-type gate structure for the implementation of W-band monolithic microwave integrated circuits (MMICs) and investigated its characteristics. To fabricate the mHEMT device, a recess process for etching of its Schottky layer was applied before gate metal deposition, and an e-beam lithography using a triple photoresist film for the T-gate structure was employed. We measured DC and RF characteristics of the fabricated device to verify the characteristics that can be used in W-band MMIC design. The mHEMT device exhibited DC characteristics such as a drain current density of 747 mA/mm, maximum transconductance of 1.354 S/mm, and pinch-off voltage of -0.42 V. Concerning the frequency characteristics, the device showed a cutoff frequency of 215 GHz and maximum oscillation frequency of 260 GHz, which provide sufficient performance for W-band MMIC design and fabrication. In addition, active and passive modeling was performed and its accuracy was evaluated by comparing the measured results. The developed mHEMT and device models could be used for the fabrication of W-band MMICs.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.348-348
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• 2011

Carbon nanotube (CNT) field effect transistors and sensors use CNT as a current channel, of which the resistance varies with the gate voltage or upon molecule adsorption. Since the performance of CNT devices depends very much on the CNT/metal contact resistance, the CNT/electrode contact must be stable and the contact resistance must be small. Depending on the geometry of CNT/electrode contact, it can be categorized into the end-contact, embedded-contact (top-contact), and side-contact (bottom-contact). Because of difficulties in the sample preparation, the end-contact CNT device is seldom practiced. The embedded-contact in which CNT is embedded inside the electrode is desirable due to its rigidness and the low contact resistance. Fabrication of this structure is complicated, however, because each CNT has to be located under a high-resolution microscope and then the electrode is patterned by electron beam lithography. The side-contact is done by depositing CNT electrophoretically or by precipitating on the patterned electrode. Although this contact is fragile and the contact resistance is relatively high, the side-contact by far has been widely practiced because of its simple fabrication process. Here we introduce a simple method to embed CNT inside the electrode while taking advantage of the bottom-contact process. The idea is to utilize a eutectic material as an electrode, which melts at low temperature so that CNT is not damaged while annealing to melt the electrode to embed CNT. The lowering of CNT/Au contact resistance upon annealing at mild temperature has been reported, but the electrode in these studies did not melt and CNT laid on the surface of electrode even after annealing. In our experiment, we used a eutectic Au/Al film that melts at 250$^{\circ}C$. After depositing CNT on the electrode made of an Au/Al thin film, we annealed the sample at 250$^{\circ}C$ in air to induce eutectic melting. As a result, Au-Al alloy grains formed, under which the CNT was embedded to produce a rigid and low resistance contact. The embedded CNT contact was as strong as to tolerate the ultrasonic agitation for 90 s and the current-voltage measurement indicated that the contact resistance was lowered by a factor of 4. By performing standard fabrication process on this CNT-deposited substrate to add another pair of electrodes bridged by CNT in perpendicular direction, we could fabricate a CNT cross junction. Finally, we could conclude that the eutectic alloy electrode is valid for CNT sensors by examine the detection of Au ion which is spontaneously reduced to CNT surface. The device sustatined strong washing process and maintained its detection ability.