• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.3
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• pp.320-330
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• 2012

In this paper, we investigate the power integrity of grid structures for power and ground distribution on printed circuit board (PCB). We propose the 2D transmission line method (TLM)-based model for efficient frequency-dependent impedance characterization and PCB-package-integrated circuit (IC) co-simulation. The model includes an equivalent circuit model of fringing capacitance and probing ports. The accuracy of the proposed grid model is verified with test structure measurements and 3D electromagnetic (EM) simulations. If the grid structures replace the plane structures in PCBs, they should provide effective shielding of the electromagnetic interference in mobile systems. An analytical model to predict the shielding effectiveness (SE) of the grid structures is proposed and verified with EM simulations.

• Proceedings of the Korean Vacuum Society Conference
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• 2004.02a
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• pp.99-99
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• 2004

• Polymer(Korea)
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• v.25 no.3
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• pp.367-374
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• 2001

The electromagnetic interference (EMI) shielding effectiveness (SE) of poly(vinylidene fluoride) (PVDF) composites was investigated using carbon nanofiber fillers prepared by catalytic chemical vapor deposition of various carbon-containing gases over Ni and Ni-Cu catalysts. The electrical conductivity of carbon nanofiber which was regarded as the key property of filler for the application of EMI shielding ranged from 4.2 to 22.4 S/cm at a pressure of 10000 psi. The electrical conductivity of carbon nanofiber/PVDF composites ranged from 0.22 to 2.46 S/cm and the EMI SE of those was in the range of 2∼13 dB. The electrical conductivity of carbon nanofibers increased with the increase in heat treatment temperature and time, while the electrical conductivity of the composites increased rapidly at the initial heat treatment and then approached a certain value with the further increase of heat treatment. The SE of the composites showed a maximum at the medium heat treatment and was proportional to the electrical conductivity of the composites. It was concluded that the specific surface area of carbon nanofibers decreased with the continual heat treatment and the specific surface area of filler was an important factor for the SE of the composites.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.1-10
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• 2021

Recently, electronic components are becoming smaller and highly integrated. As a result, electromagnetic interference (EMI) and heat generation problems must be solved simultaneously with a small area and thickness. Graphene composites and graphite composites are lightweight materials that can simultaneously solve EMI shielding and heat dissipation problems with excellent electrical and thermal conductivity. With the recent development of synthetic technology and composite manufacturing technology, the research to application of their composites is increasing. In this paper, we reviewed the latest researches on composite films of graphene and graphite for EMI shielding and heat dissipation.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.111-118
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• 2023

MXene, a two-dimensional transition metal carbide or nitride, has recently attracted much attention as a lightweight and flexible electromagnetic shielding material due to its high electrical conductivity, good mechanical strength and thermal stability. In particular, the Ti-based MXene, Ti₃C₂T_x and Ti₂CT_x are reported to have the best electrical conductivity and electromagnetic shielding properties in the vast MXene family. Therefore, in this study, Ti₃C₂T_x and Ti₂CT_x films were prepared by vacuum filtration using Ti₃C₂T_x and Ti₂CT_x dispersions synthesized by interlayer metal etching and centrifugation of Ti₃AlC₂ and Ti₂AlC. The electrical conductivity and electromagnetic shielding efficiency of the films were measured after heat treatment at high temperature. Then, X-ray diffraction and photoelectron spectroscopy were performed to analyze the structural changes of Ti₃C₂T_x and Ti₂CT_x films after heat treatment and their effects on electromagnetic shielding. Based on the results of this study, we propose an optimal structure for an ultra-thin, lightweight, and high performance MXene-based electromagnetic shielding film for future applications in small and wearable electronics.

• Journal of the Korean Ceramic Society
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• v.37 no.4
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• pp.345-353
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• 2000

Carbon nanofibers were prepared from the decomposition of various carbon-containing gases over pure Ni, pure Fe and their alloys with Cu. They yields, properties, and structure of carbon nanofibers obtained from the various reaction conditions were analyzed. Type of reacting gas, reaction temperature and catalyst composition were changed as the reaction variable. With Ni-Cu catalysts, the maximum yields of carbon nanofibers were obtained at temperatures between 550 and 650$^{\circ}C$ according to the reacting gas mixtures of C2H2-H2, C2H4-H2 and C3H8-H2, and the surface areas of the carbon nanofibers produced were 20∼350㎡/g. In the case of CO-H2 mixture, the rapid deposition of carbon nanofibers occurred with Fe-Cu catalyst and the maximum yield were obtained around 550$^{\circ}C$ with the range of surface areas of 140∼170㎡/g. The electrical resistivity of carbon nanofiber regarded as the key property of filler for the application of electromagnetic interference shielding was very sensitive to the type of reactant gas and the catalyst composition ranging 0.07∼1.5Ωcm at a pressure of 10000 psi, and the resistivity of carbon nanofibers produced over pure nickel catalyst were lower than those over alloy catalysts. SEM observation showed that the carbon nanofibers produced had the diameters ranging 20∼300 nm and the straight structure of carbon nanofibers changed into the twisted or helical conformation by the variation of reacting gas and catalyst composition.

• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.11-20
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• 2020

With the widespread use of high-performance electronics and mobile communications, electromagnetic interference (EMI) shielding has become crucial for protection against malfunctioning of electronic equipment and harmful effects to human health. In addition, smart sensor technologies will be rapidly developed in untact (non-contact) environments and personal healthcare fields. Herein, we introduce our recently developed technologies for flexible multifunctional EMI shielding, and highly sensitive wearable pressure-strain and humidity sensors realized using low-dimensional nanomaterials.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.2
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• pp.293-298
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• 2001

EB-NMP free standing film is manufactured from NMP solution of polyaniline(emeraldine base EB). Also ES(emeraldine salt EB . HCl) film is manufactured by doping of EB-NMP film with 1 mole HCI aqueous solution. And EB-mixture films containing conductor(carbon black, graphite, Ag etc.) are prepared, In this study, electromagnetic interference shielding efficiency(EMI SE) of ES free standing film ($\sigma$=5 S/cm, t=0.14mm) is 23~25 dB in the frequency range of 10 MHz~1 GHz. ES-mixture(carbon black, graphite, Ag etc.) films, polyaniline film doped camphorsulfonic acid(CSA) show higher EMI SE(30~34 dB, 36~42 dB, 44~52 dB, 34~43 dB) property than that of ES free standing film, respectively.

• Journal of the Korean institute of surface engineering
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• v.48 no.4
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• pp.149-157
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• 2015

We investigated the effects of the fabric structure or the kinds of plated metals on the electromagnetic interference shielding effectiveness (EMI SE) by means of electroless plating on polyester fabric. We found that the weight of deposited metal, EMI SE, and flexibility of the conductive fabric for EMI shield is affected by morphology of fabric and structure of fiber. The EMI SE of conductive fabric plated Ni/Cu/Ni by electroless plating method on draw textured yarn (DTY) polyester was in the practically useful range of above 70 dB over a wide frequency range of 10 MHz to 1.0 GHz at the surface resistivity of $0.05{\Omega}/{\square}$. Au or Ag plated conductive fabric by immersion plating method is not able to provide for a good EMI SE.

• Advances in aircraft and spacecraft science
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• v.4 no.6
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• pp.729-744
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• 2017

This investigation highlights rationale of electrically conductive nano adhesives for its essential application for Electromagnetic Interference (EMI) Shielding in satellites and Lightning Strike Protection in aircrafts. Carbon Nano Fibres (CNF) were functionalized by electroless process using Tollen's reagent and by Plasma Enhanced Chemical Vapour Deposition (PECVD) process by depositing silver on CNF. Different weight percentage of CNF and silver coated CNF were reinforced into the epoxy resin hardener system. Scanning Electron Microscopy (SEM) micrographs clearly show the presence of CNF in the epoxy matrix, thus giving enough evidence to show that dispersion is uniform. Transmission Electron Microscopy (TEM) studies reveal that there is uniform deposition of silver on CNF resulting in significant improvement in interfacial adhesion with epoxy matrix. There is a considerable increase in thermal stability of the conductive nano adhesive demonstrated by Differential Scanning Calorimetry (DSC) and Thermogravimetric Analysis (TGA). Four probe conductivity meters clearly shows a substantial increase in the electrical conductivity of silver coated CNF-epoxy composite compared to non-coated CNF-epoxy composite. Tensile test results clearly show that there is a significant increase in the tensile strength of silver coated CNF-composites compared to non-coated CNF-epoxy composites. Consequently, this technology is highly desirable for satellites and EMI Shielding and will open a new dimension in space research.