• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2001년도 춘계학술대회 논문집
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• pp.217-220
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• 2001

In the shearing process the burr or rollover must be minimized in order to improve the quality of product. The burr size can be minimized by control of several process parameters. But removal of all burrs are impossible. Most mechanical type deburring methods (vibrating bowls, rotating barrels, shot blasting, for example.) will remove large burrs, other methods use chemical (electro-chemical deburring) or heat (thermal energy deburring). The electro-chemical deburring process removes burrs by the deplating method. Electro-chemical deburring equipment is requires a small capital investment than other methods(mechanical or thermal methods). Electro-chemical deburring method need to many parameters for control such as a time, voltage and concentration of electrolyte. In this paper shows relations of these parameters by experiment.

• 센서학회지
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• 제13권1호
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• pp.72-77
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• 2004

In this paper, we fabricated an apparatus of the electro-chemical discharge drilling for boring narrow through-hole into a glass. In the electrolyte, electro-chemical discharge creates high temperature condition by the electro-discharge energy. Therefore, glass are removed by the accelerated chemical reaction with glasses and chemicals in the high temperature condition. For optimization of the electro-chemical discharge drilling, the process condition was studied experimentally as a function of the electrolyte concentration, supply voltage and process time. The optimum condition was from DC25V to DC30V of applied voltage, 35 wt% NaOH solution.

• 한국염색가공학회:학술대회논문집
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• 한국염색가공학회 2008년도 제39차 학술발표회
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• pp.117-118
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• 2008

The main objectives of this study are develop an Electro-Chemical process for dyeing wastewater treatment. In this work, We are investigated to optimization of electro-chemical process condition such as pH, additives(NaCl), reaction time, current density. As a result, About 89% of color(influent 452.5 ptco. unit) was removed by Electro-Chemical process using type C $SnO_2$ electrode. This results are promising potential for dyeing wastewater treatment.

• 한국정밀공학회지
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• 제17권2호
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• pp.89-96
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• 2000

This paper describes the characteristic of die finishing to obtain smooth surface using electro-chemical grinding after cutting process. Electro-chemical grinding is possible under lower load and tool wear comparing with those in the mechanical grinding. Conventionally, if the metal bonding material of the grinding wheel is directly t contacted with workpiece, the current is circulated without electrolytic phenomena. Sometimes, electrical discharge is occurred between tool and workpiece. To cope with this problem, the metal-resin bonded pellet was used in this study. This pellet is composed of optimal volume of metal and resin powders and its characteristics are changable with the each volume of powders. Finally, high efficient die finishing is realized using metal resin bonded pellet in electro-chemical grinding.

• Advances in nano research
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• 제9권3호
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• pp.173-181
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• 2020

Adsorption and heterogeneous electro-Fenton process using iron-loaded ZSM-5 nano-zeolite were investigated for the removal of Tetracycline (TC) from wastewater. The nano-zeolite was synthesized hydrothermally and modified through impregnation. The zeolite was characterized by XRD, FT-IR, FE-SEM, N₂ adsorption-desorption, and NH₃-TPD techniques. The equilibrium data were best represented by the Freundlich isotherm. The pseudo-second-order kinetic model was the most accurate model for the adsorption of TC on the modified nano-zeolite. The effect of parameters such as pH of solution and current density were investigated for the heterogeneous electro-Fenton process. The results showed that the current density of 150 mA and pH of 3 led to the highest TC removal (90.35%) at 50 min. The nano-zeolite showed the appropriate reusability. Furthermore, the developed kinetic model was in good agreement with the removal data of TC through the electro-Fenton process.

• 한국전기전자재료학회논문지
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• 제20권3호
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• pp.213-217
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• 2007

Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing(CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical polishing(ECMP) or electro-chemical mechanical planarization was introduced to solve the technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

• Korean Chemical Engineering Research
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• 제54권3호
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• pp.340-349
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• 2016

본 연구에서는 정유산업의 유지 및 보수기간에 배출되는 고농도폐수의 COD (Chemical Oxygen Demand)를 효과적으로 제거하기 위해 전기산화공법을 적용하였다. 우선 산업에서 배출되는 실제 폐수를 처리하기 위하여 BDD전극을 개발하고, 개발된 전극을 이용하여 전류밀도, pH, 전해질농도, 반응시간 등과 같은 다양한 운전조건하에 실험을 진행하였다. 둘째, 이러한 실험결과를 이용하여 전기분해의 kinetic parameter를 산출한 후에, 이를 토대로 전기산화 처리설비를 수학적으로 모델링 하였다. 마지막으로, 기존에 정상운전 조건 시 사용하던 저 농도 폐수를 처리하는 공정의 유입조건에 맞추기 위하여 전기산화 처리설비의 설계 및 운전의 다양한 변수들을 최적화함으로써 보다 효율적인 폐수 전처리 시스템을 개발하였다. 본 연구를 통해 개발된 모델의 결정계수($R^2$)는 0.982로 상당히 작은 오차범위를 보여줌으로써 모델의 높은 정확도를 입증하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1994년도 춘계학술대회 논문집
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• pp.38-41
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• 1994

The method of passivation for protecting the $Hg_{1-x}Cd_{x}$Te surface is important device fabrication process. Because the surface components are highly reactive leading to its chemical and electrical instability. Especially. the material of detecting for infrared radiation, of which composition is x=0.2 or 0.3, is narrow bandgap semi- conductor. The narrow bandgap semi conductors are largely governed by the properties of the semiconductor surface. The narrow bandgap semi-conductors are largely governed by the properties of the semiconductor surface. The electro-chemical processing of $Hg_{1-x}Cd_{x}$Te allows rigorous control of the surface chemistry and provides an in-suit monitor of surface reaction. So electro-chemical reduction at specific potential can be selectively eliminated the undesirable species on the surface and mainpulated to reproducibly attain the desired stoichiometry. This method shows to assess the quality of chemically treated good $Hg_{1-x}Cd_{x}$Te surface.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1052-1058
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• 2003

The possibility of micro/nano machining through electro-chemical process is discussed in this research. Electro-chemical dissolution region is localized within 1 ${\mu}m$ by applying ultra short pulses with tens of nanosecond duration. The effects of voltage, pulse duration, and pulse frequency on the localization distance are investigated. Localization distance can be manipulated by controlling the voltage and pulse duration, and various hole shapes are produced including stepped holes and taper free hole. High quality micro-hole with 8 ${\mu}m$ diameter with 20 ${\mu}m$ depth and micro-groove with 9 ${\mu}m$ width with 10 ${\mu}m$ depth are machined on 304 stainless steel.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.78-78
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• 2007

In semiconductor devices, Cu has been used for the formation of multilevel metal interconnects by the damascene technique. Also lower dielectric constant materials is needed for the below 65 nm technology node. However, the low-k materials has porous structure and they can be easily damaged by high down pressure during conventional CMP. Also, Cu surface are vulnerable to have surface scratches by abrasive particles in CMP slurry. In order to overcome these technical difficulties in CMP, electro-chemical mechanical planarization (ECMP) has been introduced. ECMP uses abrasive free electrolyte, soft pad and low down-force. Especially, electrolyte is an important process factor in ECMP. The purpose of this study was to characterize KOH and $KNO_3$ based electrolytes on electro-chemical mechanical. planarization. Also, the effect of additives such as an organic acid and oxidizer on ECMP behavior was investigated. The removal rate and static etch rate were measured to evaluate the effect of electro chemical reaction.