• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.1294-1298
• /
• 2005

In this study, combined micro press and surface finishing process are proposed to fabricate the micro nozzle array on a stainless steel sheet metal. In micro hole punching process the burr occurs inevitably, but the burr must be minimized in order to improve the quality and accuracy of the product. For this reason, subsequent magnetic field-assisted finishing technique is applied to remove the burr which exists around the nozzles for ink-jet printer head and proved to be a feasible for deburring by experiment. The deburring characteristics of sheet metals were investigated changing with polishing time and magnetic abrasive size. After the deburring, the burr size has remarkably reduced and roundness of the hole also has improved.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.79-80
• /
• 2007

Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing (CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical planarization/polishing (ECMP) or electro-chemical mechanical planarization was introduced to solve the. technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.163-163
• /
• 2008

반도체 소자가 고집적화 되고 고속화를 필요로 하게 됨에 따라, 기존에 사용되었던 알루미늄이나 텅스텐보다 낮은 전기저항, 높은 electro-migration resistance으로 미세한 금속배선 처리가 가능한 Cu가 주목받게 되었다. 하지만 과잉 디싱 현상과 에로젼을 유도하여 메탈라인 브리징과 단락을 초래할 있고 Cu의 단락인 islands를 남김으로서 표면 결함을 제거하는데 효과적이지 못다는 단점을 가지고 있었다. 특히 평탄화 공정시 높은 압력으로 인하여 Cu막의 하부인 ILD막의 다공성의 low-k 물질의 손상을 초래 할 수 있는 문제점을 해결하기 위하여 기존의 CMP에 전기화학을 결합시킴으로서 낮은 하력에서의 Cu 평탄화를 달성 할 수 있는 기존의 CMP 기술에 전기화학을 접목한 새로운 개념의 ECMP (electrochemical-mechanical polishing) 기술이 생겨나게 되었다. 따라서 본 논문에서는 최적화된 ECMP 공정을 위하여 I-V곡선과 CV법을 이용하여 active. passive. trans-passive 영역의 전기화학적 특징을 알아보았고. Cu막의 표면 형상을 알아보기 위해 Scanning Electron Microscopy (SEM) 측정과 Energy Dispersive Spectroscopy (EDS) 분석을 통해 금속 화학적 조성을 조사하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2006.05a
• /
• pp.481-482
• /
• 2006

Chemical-mechanical polishing, the dominant technology for LSI planarization, is trending to play an important function in micro-electro mechanical systems (MEMS). However, MEMS CMP process has a couple of different characteristics in comparison to LSI device CMP since the feature size of MEMS is bigger than that of LSI devices. Preliminary CMP tests are performed to understand material removal rate (MRR) with blanket wafer under a couple of polishing pressure and velocity. Based on the blanket CMP data, this paper focuses on the consumable approach to enhance MEMS CMP by the adjustment of slurry and pad. As a mechanical tool, newly developed microstructured (MS) pad is applied to compare with conventional pad (IC 1400-k Nitta-Haas), which is fabricated by micro melding method of polyurethane. To understand the CMP characteristics in real time, in-situ friction force monitoring system was used. Finally, the topography change of poly-si MEMS structures is compared according to the pattern density, size and shape as polishing time goes on.

• Journal of the Korean institute of surface engineering
• /
• v.42 no.1
• /
• pp.53-57
• /
• 2009

Recovery of heavy-metallic component from a waste solution of factory was undertaken by the solar cell electricity. The solution was obtained from an electrolytic etching process of 316L stainless steel. The electrolysis of the solution for recovery of heavy metallic components was made with platinum plated titanium mesh anode and copper plate cathode. Analysis for the solution and electro-winned materials were made by EDS, XRD and SEM. Iron, chromium, and sulfur components were recovered on the cathode from the solution. Result of EDS analysis for the electro-winned materials revealed that some metal oxide were contained in the recovered material. The recovered materials were expected to have metallic form only by the electrolysis, but metal compounds were contained because of weak solar cell power. Nickel and manganese component in the solution doesn't recovered by this electrolysis process, but they made a sludge with phosphoric acid in the solution.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2008.11a
• /
• pp.129-131
• /
• 2008

태양전지에서 발생되는 전력을 이용하여 중금속 성분이 함유된 공장 폐수에서 중금속 성분을 전착 회수하는 내용의 연구 및 장치를 개발하였다. 공장 폐수는 316L강을 전해연마한 후 배출되는 용액을 사용하였으며, 양극은 백금도금된 티타늄망을, 음극은 순수 동판을 사용하여 전해에 의해 중금속 성분을 전착시켰다. 전해액 및 전착 금속에 대한 분석도 이루어졌다.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
• /
• 2003.05a
• /
• pp.116-119
• /
• 2003

본 연구에서는 LCD 공정에 사용되는 ball spacer를 전해 연마(Electro-Polishing, EP) 처리된 스테인리스(stainless)관 내부에서 마찰대전으로 하전시켜 하전량을 측정하는 하전 메커니즘과 하전 특성을 관찰하였다. Ball spacer의 농도를 일정하게 하고, 유입하는 공기의 유량을 201pm, 301pm으로 변화시키면서 실험하였다. 유입되는 공기의 유량은 일정하게 하여 ball spacer의 농도를 분진공급장치(dust feeder)를 통해 변화시키면서 하전수를 측정하였다. 이 때 측정결과는 EP 처리된 스테인리스관에 유입되는 공기의 유량이 증가했을 때, 하전이 더 많이 되는 것을 보여주었다. 또한 일정한 공기의 유량에서 주입되는 ball spacer의 농도가 증가했을 때 입자당 하전수가 증가하였다.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.3 no.3
• /
• pp.52-57
• /
• 2004

Many kinds of gases, such as erosion gas, dilution gas, and toxic gas have been used in manufacturing process of LCD at semiconductor. In order to increase accumulation rate of manufacturing process, high degree of purity in these gases and minimized metalllic dust are required. All wetted stainless steel surface must be 316L electro-polished with $0254{\mu}m$ in average. Based on the AES analysis, Cr/Fe 11 and $Cr_2O_3$ thickness $25{\AA}$ are measured Molybdenum and silicon contaminants which is characteristic of stainless steel and oxygen were found on the surface.

• Journal of the Korean institute of surface engineering
• /
• v.45 no.6
• /
• pp.248-256
• /
• 2012

A Pd-based hydrogen membranes for hydrogen purification and separation need high hydrogen perm-selectivity. The surface roughness of the support is important to coat the pinholes free and thin-film membrane over it. Also, The pinholes drastically decreased the hydrogen perm-selectivity of the Pd-based composite membrane. In order to remove the pinholes, we introduced various surface pre-treatment such as alumina powder packing, nickel electro-plating and micro-polishing pre-treatment. Especially, the micro-polishing pretreatment was very effective in roughness leveling off the surface of the porous nickel support, and it almost completely plugged the pores. Fine Ni particles filled surface pinholes with could form open structure at the interface of Pd alloy coating and Ni support by their diffusion to the membrane and resintering. In this study, a $4{\mu}m$ surface pore-free Pd-Cu-Ni ternary alloy membrane on a porous nickel substrate was successfully prepared by micro-polishing, high temperature sputtering and Cu-reflow process. And $H_2$ permeation and $N_2$ leak tests showed that the Pd-Cu-Ni ternary alloy hydrogen membrane achieved both high permeability of $13.2ml{\cdot}cm^{-2}{\cdot}min^{-1}{\cdot}atm^{-1}$ permation flux and infinite selectivity.

• International Journal of Precision Engineering and Manufacturing
• /
• v.8 no.2
• /
• pp.38-43
• /
• 2007

This paper describes ultrasonically assisted grinding used to obtain a glossy surface quickly and precisely. High-quality surfaces are required for plastic injection molding dies used in the production of plastic parts such as dials for cellular phones. Traditionally, in order to finish the dies, manual polishing by a skilled worker has been required after the machining processes, such as electro discharge machining (EDM), which leaves an affected layer, and milling, which leaves tooling marks. However, manual polishing causes detrimental geometrical deviations of the die and consumes several days to finish a die surface. Therefore, a machining process for finishing dies without manual polishing to improve the surface roughness and form accuracy would be extremely valuable. In this study, a 3D positioning machine equipped with an ultrasonic spindle was used to conduct grinding experiments. An electroplated diamond tool was used for these experiments. Generally, diamond tools cannot grind steel because of excessive wear as a result of carbon atoms diffusing into bulk steel and chips. However, ultrasonically assisted grinding can achieve a fine surface (roughness Rz of $0.4{\mu}m$) on die steel without severe tool wear. The final aim of this study is to realize mirror surface grinding for injection molding dies without manual polishing. To do this, it is necessary to fabricate an electroplated diamond tool with high form accuracy and low run-out. This paper describes a tool-making method for high precision grinding and the grinding performance of a self-electroplated tool. The ground surface textures, tool performance and tool life were investigated A ground surface roughness Rz of 0.14 um was achieved Our results show that the spindle speed, feed rate and cross feed affected the surface texture. One tool could finish $5000mm^2$ of die steel surface without any deterioration of the ground surface roughness.