• Title/Summary/Keyword: Electrical uniformity

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A Study of yield method including artificial lighting uniformity ration in interior space (실내공간에서의 인공조면 균제도 산출방법에 대한 일고찰)

  • 김현지;안옥희
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.13 no.2
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    • pp.7-11
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    • 1999
  • In this paper, the result of study in artificial lighting uniformity ratio yield Irethod subjtrt to lecture room are reported. It is desirable that the aWication of equation $\circled1 U=Ei/Ex\times100$ cannot be used to the rrean value in place to be efftrtive of light and darkness. And it is desirable that the awlication of equatioo $\circled2 U=Ei/Ea\times100$ or equation $\circled3 U=(Ea-Ei)/Ea\times100$ be used to the rrean Value equality illumination conditioos. Also, requiring preparation of judgarent standard, uniformity ratio equation agree with actual circumstances in this country. It must be considerai intensity of illumination and specificity of space in established standard.andard.

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The Study on the Non-Uniformity of PECVD SiO2 Deposition by the Plasma Diagnostics (플라즈마 진단에 의한 PECVD SiO2 증착의 불균일성 원인 연구)

  • Ham, Yong-Hyun;Kwon, Kwang-Ho;Lee, Hyun-Woo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.2
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    • pp.89-94
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    • 2011
  • The cause of the thickness non-uniformity in the large area deposition of $SiO_2$ films by PECVD(Plasma Enhanced Chemical Vapor Deposition) was investigated by the plasma diagnostics. The spatial distribution of the plasma species in the chamber was obtained with DLP(Double Langmuir Probe) and the new-designed probe-type QMS(Quadrupole Mass Spectrometer). From the relationship between the spatial distribution of the plasma species and the depositing rate of the $SiO_2$ films, it was conformed that the non-uniform deposition of $SiO_2$ films was related with the spatial distribution of the oxygen radical density and electron temperature.

Chemical Mechanical Polishing Characteristics of CdTe Thin Films for Application to Large-area Thin Film Solar Cell (대면적 박막 태양전지 적용을 위한 CdTe 박막의 화학적기계적연마 공정 특성)

  • Yang, Jung-Tae;Shin, Sang-Hun;Lee, Woo-Sun
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.58 no.6
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    • pp.1146-1150
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    • 2009
  • Cadmium telluride (CdTe) is one of the most attractive photovoltaic materials due to its low cost, high efficiency and stable performance in physical, optical and electronic properties. Few researches on the influences of uniform surface on the photovoltaic characteristics in large-area CdTe solar cell were not reported. As the preceding study of the effects of thickness-uniformity on the photovoltaic characteristics for the large-area CdTe thin film solar cell, chemical mechanical polishing (CMP) process was investigated for an enhancement of thickness-uniformity. Removal rate of CdTe thin film was 3160 nm/min of the maximum value at the 200 $gf/cm^2$ of down force (pressure) and 60 rpm of table speed (velocity). The removal rate of CdTe thin film was more affected by the down force than the table speed which is the two main factors directly influencing on the removal rate in CMP process. RMS roughness and peak-to-valley roughness of CdTe thin film after CMP process were improved to 96.68% and 85.55%, respectively. The optimum process condition was estimated by 100 $gf/cm^2$ of down force and 60 rpm of table speed with the consideration of good removal uniformity about 5.0% as well as excellent surface roughness for the large-area CdTe solar cell.

Thin layer(Overcoat) for TFT-LCD color filter (LCD용 컬러필터 보호막)

  • Kim, Myeong-Koo;Park, Joo-Hyeon;Lim, Young-Taek
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.11a
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    • pp.273-273
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    • 2006
  • Over the past years, a large number of acrylate polymers have been developed and the overcoat thin layer containing acrylate polymers have been used for TFT-LCD color filter. As forming thin layer using acrylate polymers, the existing acrylate polymers have some problems such as low hardness by low Tg temperature, coating uniformity and solubility in organic solvent. To solve these problems, we synthesized new polymer(Scheme.), containing olefin monomer, which has high Tg temperature, good coating uniformity and good solubility in organic solvent. The overcoat thin layer containing new polymer resulted in good coating uniformity, stain, spot, scratch, heat resistance, DOP(Degree Of Planarization) on RGB glass, transparency, hardness, adhesion, anti-chemicals(anti-acid, anti-base, anti-organic solvent), insulation and anti-humidity. Scheme. The structure of new polymer X = Olefin monomer contains ketone, ester, hydroxy, ether, halogen, nitrile, alkoxy, phenyl functional group $R_1$ and $R_2$= H or $CH_3$. Ratio=0<[1/(1+m+n)]<0.7,0.1[$\leq$[n/(1+m+n)]<0.5.

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A Study on the Within Wafer Non-uniformity of Oxide Film in CMP (CMP 패드 강성에 따른 산화막 불균일성(WIWNU)에 관한 연구)

  • Park, Ki-Hyun;Jung, Jae-Woo;Park, Boum-Young;Seo, Heon-Deok;Lee, Hyun-Seop;Jeong, Hae-Do
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.6
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    • pp.521-526
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    • 2005
  • Within wafer non-uniformity(WIWNU) improves as the stiffness of pad decrease. We designed the pad groove to study of pad stiffness on WIWNU in Chemical mechanical polishing(CMP) and measured the pad stiffness according to groove width. The groove influences effective pad stiffness although original mechanical properties of pad are unchanged by grooving. Also, it affects the flow of slurry that has an effect on the lubrication regime and polishing results. An Increase of the apparent contact area of pad by groove width results in decrease of effective pad stiffness. WIWNU and profile of removal tate improved as effective pad stiffness decreased. Because grooving the pad reduce its effective stiffness and it makes slurry distribution to be uniform. Futhermore, it ensures that pad conforms to wafer-scale flatness variability. By grooving the top pad, it is possible to reduce its stiffness and hence reduce WIWNU and edge effect.

A Prediction Method of Temperature Distribution on the Wafer in a Rapid Thermal Process System with Multipoint Sensing (고속 열처리 시스템에서 웨이퍼 상의 다중점 계측에 의한 온도 분포 추정 기법 연구)

  • Sim, Yeong-Tae;Lee, Seok-Ju;Min, Byeong-Jo;Jo, Yeong-Jo;Kim, Hak-Bae
    • The Transactions of the Korean Institute of Electrical Engineers D
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    • v.49 no.2
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    • pp.62-67
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    • 2000
  • The uniformity of temperature on a wafer is one of the most important parameters to control the RTP (Rapid Thermal Process) with proper input signals. Since it is impossible to achieve the uniformity of temperature without exact estimation of temperature at all points on the wafer, the difficulty of understanding internal dynamics and structural complexities of the RTP is a primary obstacle to accurately measure the distributed temperatures on the wafer. Furthermore, it is also hard to accomplish desirable estimation because only few pyrometers have been commonly available in the general equipments. In the paper, a thermal model based on the chamber geometry of the AST SHS200 RTP system is developed to effectively control the thermal uniformity on the wafer. First of all, the estimation method of one-point measurement is developed, which is properly extended to the case of multi-point measurements. This thermal model is validated through certain simulation and experiments. The work can be usefully contributed to building a run-by-run or a real-time controls of the RTP.

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The Fabrication of Megasonic Agitated Module(MAM) for the Improved Characteristics of Wet Etching

  • Park, Tae-Gyu;Yang, Sang-Sik;Han, Dong-Chul
    • Journal of Electrical Engineering and Technology
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    • v.3 no.2
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    • pp.271-275
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    • 2008
  • The MAM(Megasonic Agitated Module) has been fabricated for improving the characteristics of wet etching. The characteristics of the MAM are investigated during the wet etching with and without megasonic agitation in this paper. The adoption of the MAM has improved the characteristics of wet etching, such as the etch rate, etch uniformity, and surface roughness. Especially, the etching uniformity on the entire wafer was less than ${\pm}1%$ in both cases of Si and glass. Generally, the initial root-mean-square roughness($R_{rms}$) of the single crystal silicon was 0.23nm. Roughnesses of 566nm and 66nm have been achieved with magnetic stirring and ultrasonic agitation, respectively, by some researchers. In this paper, the roughness of the etched Si surface is less than 60 nm. Wet etching of silicon with megasonic agitation can maintain nearly the original surface roughness during etching. The results verified that megasonic agitation is an effective way to improve etching characteristics of the etch rate, etch uniformity, and surface roughness and that the developed micromachining system is suitable for the fabrication of devices with complex structures.

The Development of a High Efficiency Luminaires Reflector for Tunnel Lighting (터널용 고효율 조명기구 반사판의 개발)

  • Kim, Gi-Hoon;Hwang, Jae-San;Yun, Mee-Rim;Kim, Hoon
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.15 no.2
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    • pp.1-6
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    • 2001
  • Tunnel lighting in Korea has the problems of unsatisfactory illuminance uniformity which obstructs driver's vision, a flicker phenomenon on wall of tunnel, a heavy glare, low efficiency of luminaires, low utilization factor, and high energy consumption. We developed a high efficiency luminaire reflector for tunnel lighting which removes these problems. Developed luminaire saves energy and improves lighting environment by increasing 10% of luminaire efficiency. It can reduce installation cost by decreasing the number of luminaires, while average illuminance of 200[lx], overall uniformity of 0.4, longitudinal uniformity of 0.7, and electric power consumptions per unit area of 3.7[W/m$^2$] are accomplished.

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An Improved Texture Feature Extraction Method for Recognizing Emphysema in CT Images

  • Peng, Shao-Hu;Nam, Hyun-Do
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.24 no.11
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    • pp.30-41
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    • 2010
  • In this study we propose a new texture feature extraction method based on an estimation of the brightness and structural uniformity of CT images representing the important characteristics for emphysema recognition. The Center-Symmetric Local Binary Pattern (CS-LBP) is first used to combine gray level in order to describe the brightness uniformity characteristics of the CT image. Then the gradient orientation difference is proposed to generate another CS-LBP code combining with gray level to represent the structural uniformity characteristics of the CT image. The usage of the gray level, CS-LBP and gradient orientation differences enables the proposed method to extract rich and distinctive information from the CT images in multiple directions. Experimental results showed that the performance of the proposed method is more stable with respect to sensitivity and specificity when compared with the SGLDM, GLRLM and GLDM. The proposed method outperformed these three conventional methods (SGLDM, GLRLM, and GLDM) 7.85[%], 22.87[%], and 16.67[%] respectively, according to the diagnosis of average accuracy, demonstrated by the Receiver Operating Characteristic (ROC) curves.

Effects of electrode configurations on uniformity of copper films on flexible polymer substrate prepared by ECR-MOCVD (ECR-MOCVD에 의해 연성 고분자 기판에 제조된 구리막의 균일도에 전극의 형태가 미치는 영향)

  • 전법주;이중기
    • Journal of the Korea Institute of Military Science and Technology
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    • v.7 no.1
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    • pp.34-46
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    • 2004
  • Copper films were prepared by using ECR-MOCVD(Electron Cyclotron Resonance Metal Organic Chemical Vapor Deposition) coupled with a DC bias system. The DC bias is connected to the electrode which placed 1∼3cm above the polymer substrate. The pulse electrical field around the electrode attracts the positive charged copper ions generated from the dissociation of copper precursor, $Cu(hfac)_2$, under ECR plasma. Condensation of supersaturated copper ions in the space between the electrode and substrate, makes it possible to deposit copper film on the polymer substrate even at room temperature. In this study, optimization of the electrode configuration was carried out in order to obtain the uniform films. The uniformity of the deposited films were closely related to the parameters of electrode geometry such as electrode shape, thickness, grid size and the spacing between electrodes. The most uniform copper film was observed with the electrode that enabled uniform electrical field distribution across the whole dimension of electrode.