• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.2153-2155
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• 2005

SF6 &NF3 chemistry를 사용하여 W bitline process 조건에서 plasma confinement 및 gas & radical의 flow에 영향을 미치는 focus ring 재질과 두께변경을 하여 Rnit non uniformity 평가한다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.571-574
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• 2004

The LED backlight can be designed to have the desired uniformity by using many combination of reflector patterns. The uniformity of the LED backlight can improve by applying the specially designed reflector patterns. In this paper, it was shown that the 72.7% of luminance uniformity of the LED backlight with reflector patterns was obtained by computer simulation.

• Transactions on Electrical and Electronic Materials
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• v.18 no.1
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• pp.35-41
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• 2017

This study looks at optimizinge light redistribution to improve the overall illuminance uniformity of commercial IRED modules. To obtain uniform illumination over a prescribed rectangular area, a freeform surface lens was evaluated using TracePro. The LED light overall illuminance uniformity regulated in KSC 7658 was verified using Relux software. Experimental test results showed 0.81 overall illuminance uniformity for rectangular light distribution of LED lights having a radiation angle of $80^{\circ}$. After fabricating prototype IRED lights based on these simulation results, illuminance performance was observed when used as actual IRED lighting with a nighttime CCTV system. Image observation photographs of the prototype $80^{\circ}$ rectangular IRED lights confirmed that object images can be seen clearly owing to high overall illuminance uniformity, and that dark regions of the CCTV screen were not shown.

• Proceedings of the KIEE Conference
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• 2005.11a
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• pp.100-102
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• 2005

This paper presents evaluation of the electrical uniformity of zinc oxide varistors for lightning arresters. Two types of varistors were prepared which are a domestic varistor destroyed in the long duration current impulse withstand test and a new imported varistor. The domestic varistor exhibited good electrical uniformity except destroyed parts, but the imported varistor showed the worse results.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.2
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• pp.93-98
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• 2008

We investigated the effect of process temperature on removal rate and non-uniformity based on single head kinematics in oxide CMP. Generally, it has been known that the temperature profile directly transfers to the non~uniformity of removal rate on the wafer, which has similar tendency with the sliding distance of wafer. Experimental results show that platen velocity is a dominant factor in removal rate as well as average temperature. However, the non-uniformity does not coincide between process temperature and removal rate, due to slurry accumulation and low deviation of temperature. Resultantly, the removal rate is strongly dependent on the rotational speed of platen, and its non -uniformity is controlled by the rotational speed of polishing head. It means lower WIWNU (With-in-wafer-non-uniformity) can be achieved in the region of higher head speed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.49-50
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• 2006

The studies on Cu CMP have focused on material removal and its mechanisms. Although many studies have been conducted on the mechanism of Cu CMP, a study on uniformity in Cu CMP is still unknown. Since the aim of CMP is global and local planarization, the approach to uniformity in Cu CMP is essential to elucidate the Cu CMP mechanism as well. The main purpose of the experiment reported here was to investigate the roles of slurry components in the formation of the uniformity in Cu CMP. All the results of in this study showed that the uniformity in Cu CMP could be controlled by the contents of slurry components.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05c
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• pp.223-227
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• 2002

As the channel length of device shrinks below $0.13{\mu}m$, CMP(chemical mechanical polishing) process got into key process for global planarization in the chip manufacturing process. The removal rate and non-uniformity of the CMP characteristics occupy an important position to CMP process control. Especially, the post-CMP thickness variation depends on the device yield as well as the stability of subsequent process. In this paper, every wafer polished two times for the improvement of oxide CMP process characteristics. Then, we discussed the removal rate and non-uniformity characteristics of post-CMP process. As a result of CMP experiment, we have obtained within-wafer non-uniformity (WIWNU) below 4 [%], and wafer-to-wafer non-uniformity (WTWNU) within 3.5 [%]. It is very good result, because the reliable non-uniformity of CMP process is within 5 [%].

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.27 no.4
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• pp.1-7
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• 2013

Optical characteristics including the view angle and color temperature uniformity of LED packages with an integrated lens fabricated by compression molding method are investigated according to lens shape, lens materials, and phosphor coating methods. Four types of lens shape are designed and their optical output power dependence on the refractive index of silicone encapsulant are evaluated. Also, spatial color temperature uniformities of packages fabricated with different phosphor coating methods-direct coating on a chip vs. uniformly mixed with silicone encapsulant- are compared at various view angles. As the result, it is found that phosphor coating method is more effective on color temperature uniformity than lens shape. The maximum color temperature difference of a package with direct coating of phosphor on a chip is 1,340K according to the view angle at the color temperature of 5,000K, and that of a package with uniformly mixed phosphor is 250K, which indicates 1,090K improvement of color uniformity for the latter case.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.19-25
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• 2023

With an attempt to investigate the correlation between the internal pressure distribution of slit nozzle and the thickness uniformity of slot-coated thin films, we have performed computational fluid dynamics (CFD) simulations of slit nozzles and slot coating of high-viscosity (4,800 cPs) polydimethylsiloxane (PDMS) using a gantry slot-die coater. We have calculated the coefficient of variation (CV) to quantify the pressure and velocity distributions inside the slit nozzle and the thickness non-uniformity of slot-coated PDMS films. The pressure distribution inside the cavity and the velocity distribution at the outlet are analyzed by varying the shim thickness and flow rate. We have shown that the cavity pressure uniformity and film thickness uniformity are enhanced by reducing the shim thickness. It is addressed that the CV value of the cavity pressure that can ensure the thickness non-uniformity of less than 5% is equal to and less than 1%, which is achievable with the shim thickness of 150 ㎛. It is also found that as the flow rate increases, the average cavity pressure is increased with the CV value of the pressure unchanged and the maximum coating speed is increased. As the shim thickness is reduced, however, the maximum coating speed and flow rate decrease. The highly uniform PDMS films shows the tensile strain as high as 180%, which can be used as a stretchable substrate.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1583_1584
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• 2009

Reverberation chamber have become a common tool in radiated susceptibility and emission testing of electronic equipment. In a reverberation chamber, internal electromagnetic fields are mixed by metallic stirrer. Due to elimination of Polarization characteristic in reverberation chamber, electromagnetic wave reached to EUT all aspect angle. Hence, Field distribution in overmode reverberation chamber can be presented by chi-square distribution. Field uniformity in reverberation chamber have to satisfy standard deviation below 3dB and is influenced by mechanical stirrer. This paper investigates relationship between change of stirrer parameter and field uniformity in reverberation chamber.