• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.10
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• pp.1364-1370
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• 2014

Power system fault analysis has been based on symmetrical component method, which describes power system elements by positive, negative and zero sequence impedance. Obtaining accurate line impedances as possible are very important for estimating fault current magnitude and setting distance relay accurately. Especially, accurate calculation of zero sequence impedance is important because most of transmission line faults are line-to-ground faults, not balanced three-phase fault. Since KEPCO has started measuring of transmission line impedance at 2005, it has been revealed that the measured and calculated line impedances are well agreed within reasonable accuracy. In case of underground transmission lines, however, large discrepancies in zero sequence impedance were observed occasionally. Since zero sequence impedance is an important input data for distance relay to locate faulted point correctly, it is urgently required to analyze, detect and consider countermeasures to the source of these discrepancies. In this paper, development of pre/post processor to ATP (Alternative Transient Program) version of EMTP (Electro-Magnetic Transient Program) for sequence impedance calculation was described. With the developed processor ATP-cable, effects of ground resistance and ECC (Earth Continuity Conductor) on sequence impedance were analyzed.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.170-170
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• 2000

Synthetic polymers such as polyimide, polycarbonate, and poly(methyl methacrylate) are long chain molecules which consist of carbon, hydrogen, and heteroatom linked together chemically. Recently, polymer surface can be modified by using a high energy ion beam process. High energy ions are introduced into polymer structure with high velocity and provide a high degree of chemical bonding between molecular chains. In high energy beam process the modified polymers have the highly crosslinked three-dimensionally connected rigid network structure and they showed significant improvements in electrical conductivity, in hardness and in resistance to wear and chemicals. Polyimide films (Kapton, types HN) with thickness of 50~100${\mu}{\textrm}{m}$ were used for investigations. They were treated with two different surface modification techniques: Plasma Source Ion Implantation (PSII) and conventional Ion Implantation. Polyimide films were implanted with different ion species such as Ar+, N+, C+, He+, and O+ with dose from 1 x 1015 to 1 x 1017 ions/cm2. Ion energy was varied from 10keV to 60keV for PSII experiment. Polyimide samples were also implanted with 1 MeV hydrogen, oxygen, nitrogen ions with a dose of 1x1015ions/cm2. This work provides the possibility for inducing conductivity in polyimide films by ion beam bombardment in the keloelectronvolt to megaelectronvolt energy range. The electrical properties of implanted polyimide were determined by four-point probe measurement. Depending on ion energy, doses, and ion type, the surface resistivity of the film is reduced by several orders of magnitude. Ion bombarded layers were characterized by Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS), XPS, and SEM.

• Journal of the Korea Institute of Building Construction
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• v.21 no.6
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• pp.519-527
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• 2021

In this study, an electromagnetic pulse shielding effect was obtained by applying the arc metal spraying method to the ordinary concrete. For this study, to evaluate the electrical properties in the thickness of the metal sprayed coating, 8 types of metals(Cu, CuAl, CuNi, CuZn, Al, Zn, ZnAl, AlMg) were sprayed as coatings with a thickness of 100, 200 and 500㎛. The electrical conductivity on the surface was measured with a 4-pin probe, and an electromagnetic wave shielding effect test was performed according to KS. Based on the test results, 200 ㎛ was proposed as an optimal metal coating thickness for electromagnetic pulse shielding, and it was thermally sprayed on a 300×300×100mm concrete specimen to analyze the electromagnetic wave shielding performance. However, in the area of adhesion strength, the maximum was 1.11MPa, which was found to be less than 74% of the target performance.

• Tribology and Lubricants
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• v.38 no.3
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• pp.93-100
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• 2022

Micro-light emitting diode (micro-LED) displays offer numerous advantages such as high brightness, fast response, and low power consumption. Hence, they are spotlighted as the next-generation display. However, defective LEDs may be created due to non-uniform contact loads or LED alignment errors. Therefore, a repair process involving the replacement of defective LEDs with favorable ones is necessitated. The general repair process involves the removal of defective micro-LEDs, interconnection material transfer, as well as new micro-LED transfer and bonding. However, micro-LEDs are difficult to repair since their size decreases to a few tens of micron in width and less than 10 ㎛ in thickness. The conventional nozzle-type dispenser for fluxes and the conventional vacuum chuck for LEDs are not applicable to the micro-LED repair process. In this study, transfer conditions are determined using a micro stamp for repairing micro-LEDs. Results show that the aging time should be set to within 60 min, based on measuring the aging time of the flux. Additionally, the micro-LEDs are subjected to a compression test, and the result shows that they should be transferred under 18.4 MPa. Finally, the I-V curves of micro-LEDs processed by the laser and hot plate reflows are measured to compare the electrical properties of the micro-LEDs based on the reflow methods. It was confirmed that the micro-LEDs processed by the laser reflow show similar electrical performance with that processed by the hot plate reflow. The results can provide guidance for the repair of micro-LEDs using micro stamps.

• Journal of Powder Materials
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• v.29 no.3
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• pp.226-232
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• 2022

In this study, a new manufacturing process for a multilayer-clad electrical contact material is suggested. A thin and dense BCuP-5 (Cu-15Ag-5P filler metal) coating layer is fabricated on a Ag plate using a high-velocity oxygen-fuel (HVOF) process. Subsequently, the microstructure and bonding properties of the HVOF BCuP-5 coating layer are evaluated. The thickness of the HVOF BCuP-5 coating layer is determined as 34.8 ㎛, and the surface fluctuation is measured as approximately 3.2 ㎛. The microstructure of the coating layer is composed of Cu, Ag, and Cu-Ag-Cu3P ternary eutectic phases, similar to the initial BCuP-5 powder feedstock. The average hardness of the coating layer is 154.6 HV, which is confirmed to be higher than that of the conventional BCuP-5 alloy. The pull-off strength of the Ag/BCup-5 layer is determined as 21.6 MPa. Thus, the possibility of manufacturing a multilayer-clad electrical contact material using the HVOF process is also discussed.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.69-74
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• 2010

A new package substrate for dynamic random access memory(DRAM) devices has been developed using selective aluminum anodization. Unlike the conventional substrate structure commonly made by laminating epoxy-based core and copper clad, this substrate consists of bottom aluminum, middle anodic aluminum oxide and top copper. Anodization process on the aluminum substrate provides thick aluminum oxide used as a dielectric layer in the package substrate. Placing copper traces on the anodic aluminum oxide layer, the resulting two-layer metal structure is completed in the package substrate. Selective anodization process makes it possible to construct a fully filled via structure. Also, putting vias directly in the bonding pads and the ball pads in the substrate design, via in pad structure is applied in this work. These arrangement of via in pad and two-layer metal structure make routing easier and thus provide more design flexibility. In a substrate design, all signal lines are routed based on the transmission line scheme of finite-width coplanar waveguide or microstrip with a characteristic impedance of about $50{\Omega}$ for better signal transmission. The property and performance of anodic alumina based package substrate such as layer structure, design method, fabrication process and measurement characteristics are investigated in detail.

• Tunnel and Underground Space
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• v.31 no.6
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• pp.623-646
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• 2021

As the demand for electric power increases with acceleration of electrification at home and abroad, the needs for coal-fired electrical power plant are accordingly increased. However, these coal-fired electrical power plants induce also many environmental problems such as increase of air pollutants, increase of possibility of land contamination by reclamation of coal ash, even though these power plants have a good economical efficiency. In case of a by-product of coal-fired electrical power plants, only 70% of them are recycled and the remaining 30% of by-product are fully buried in surrounding ground. Consequently, this study deals with coal ash backfilling mechanism in abandoned mine openings for the purposes of increasing the coal ash recycling rate as well as securing the mine area stability. In order to analyze the backfill and ground reinforcement by interaction between rock mass and backfills, the copying samples of discontinuous surface with different roughnesses were produced for bond strength tests and direct shear tests. And statistical analysis was also conducted to decide the characteristics of bond and shear behavior with joint roughness and their curing day. Numerical simulations were also analyzed for examining the effect of interface behavior on ground stability.

• Fashion & Textile Research Journal
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• v.22 no.3
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• pp.386-398
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• 2020

This study compared dip-coating and in situ polymerization methods for the development of nanofiber-based E-textile using polypyrrole. Nanofiber webs were fabricated by electrospinning an aqueous poly (vinyl alcohol) (PVA) solution. Subsequently, the PVA nanofiber web underwent thermal treatment to improve water resistance. Dip-coating and in situ polymerization methods were used to deposit polypyrrole on the surfaces of the nanofiber web. An FE-SEM analysis was also conducted to examine specimen surface characteristics along with EDS and FT-IR that analyzed the chemical bonding between polypyrrole and specimens. The line resistance and sheet resistance of the treated specimens were measured. Finally, an electrocardiogram (ECG) was measured with textile sensors made of the polypyrrole-deposited PVA nanofiber webs. The polypyrrole-deposited PVA nanofiber webs fabricated by dip-coating dissolved in the dip-coating solution and indicated damage to the nanofibers. However, in the case of in situ polymerization, polypyrrole nanoparticles were deposited on the surface and inter-web structure of the PVA nanofiber web. The resistance measurements indicated that polypyrrole-deposited PVA nanofiber webs fabricated by in situ polymerization with an average sheet resistance of 5.3 k(Ω/□). Polypyrrole-deposited PVA nanofiber webs fabricated by dip-coating showed an average sheet resistance of 57.3 k(Ω/□). Polypyrrole-deposited PVA nanofibers fabricated by in situ polymerization showed a lower line and sheet resistance; in addition, they detected the electrical activity of the heart during ECG measurements. The electrodes made from polypyrrole-deposited PVA nanofiber webs by in situ polymerization showed the best performance for sensing ECG signals among the evaluated specimens.

• Korean Journal of Materials Research
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• v.26 no.5
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• pp.258-265
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• 2016

Fluorine-doped tin oxide (FTO) nanoparticles have been successfully synthesized using ultrasonic spray pyrolysis. The morphologies, crystal structures, chemical bonding states, and electrochemical properties of the nanoparticles are investigated. The FTO nanoparticles show uniform morphology and size distribution in the range of 6-10 nm. The FTO nanoparticles exhibit excellent electrochemical performance with high discharge specific capacity and good cycling stability ($620mAhg^{-1}$ capacity retention up to 50 cycles), as well as excellent high-rate performance ($250mAhg^{-1}$ at $700mAg^{-1}$) compared to that of commercial $SnO_2$. The improved electrochemical performance can be explained by two main effects. First, the excellent cycling stability with high discharge capacity is attributed to the nano-sized FTO particles, which are related to the increased electrochemical active area between the electrode and electrolyte. Second, the superb high-rate performance and the excellent cycling stability are ascribed to the increased electrical conductivity, which results from the introduction of fluorine doping in $SnO_2$. This noble electrode structure can provide powerful potential anode materials for high-performance lithiumion batteries.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.25.1-25.1
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• 2011

Over the past few decades, metallic nanoparticles (NPs) have been of great interest due to their unique mesoscopic properties which distinguish them from those of bulk metals; such as lowered melting points, greater versatility that allows for more ease of processability, and tunable optical and mechanical properties. Due to these unique properties, potential opportunities are seen for applications that incorporate nanomaterials into optical and electronic devices. Specifically, the development of metallic NPs has gained significant interest within the electronics field and technological community as a whole. In this study, gold (Au) pads for surface finish in electronic package were developed by inkjet printing of Au NPs. The microstructures of inkjet-printed Au film were investigated by various thermal treatment conditions. The film showed the grain growth as well as bonding between NPs. The film became denser with pore elimination when NPs were sintered under gas flows of $N_2$-bubbled through formic acid ($FA/N_2$) and $N_2$, which resulted in improvement of electrical conductance. The resistivity of film was 4.79 ${\mu}{\Omega}$-cm, about twice of bulk value. From organic anlayses of FTIR, Raman spectroscopy, and TGA, the amount of organic residue in the film was 0.43% which meant considerable removal of the solvent or organic capping molecules. The solder ball shear test was adopted for solderability and shear strength value was 820 gf (1 gf=9.81 mN) on average. This shear strength is good enough to substitute the inkjet-printed Au nanoparticulate film for electroplating in electronic package.