• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.413-416
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• 2004

In this study, zinc oxide(ZnO) having large misfit(18.2%) with sapphire was tried to be grown on very thin nitride buffer layers. For the creation of various kinds of nitride buffer layer, sapphire surface was modified by an irradiation of nitrogen ion beam with low energy generated from stationary plasma thruster(SPT) at room temperature. After the irradiation of ion beam, Al-N and Al-O-N bonding was identified to be formed as nitride buffet layers. Surface morphology was measured by AFM and then ZnO growth was followed by pulsed laser deposition(PLD). Their properties are analyzed by XRD, AFM, TEM, and PL. We observed that surface morphology was improved and deep level emission related to defects was almost vanished in PL spectra from the ZnO grown on nitride buffer layer.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.473-476
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• 2003

This paper shows necessity of encapsulation layer to maximite flexibility of brittle indium-tin-oxide (ITO) on polymer substrates. And, Young's modulus (E) of encapsulation layer have an significant effect on external bending stress and the coefficient of thermal expansion (CTE) of that have a significant effect on internal thermal stress. To compare magnitude of total mechanical stress including both bending stress and thermal stress, the mechanical stress of triple-layer structure (substrate / ITO / encapsulation layer or substrate / buffer layer / ITO) can be quantified and numerically analyzed through the farthest cracked island position. As a result, it should be noted that multi-layer structures with more elastic encapsulation material have small mechanical stress compared to that of buffer and encapsulation structure of large Young's modulus material when they were externally bent.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.390-391
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• 2006

This paper describes the design, fabrication and characteristics of a micromachined piezoelectric valve utilizing a multilayer ceramic actuator (MCA). The micromachined MCA valve, which uses a buckling effect, consists of three separate structures: the MCA, the valve actuator die and the seat die. The valve seat die with 6 trenches was made, and the actuator die, which is driven by the MCA under optimized conditions, was also fabricated. After Si wafer direct bonding between the seat die and the actuator die, the MCA was also anodically bonded to the seat/actuator die structure. A polydimethylsiloxane (PDMS) sealing pad was fabricated to minimize the leak rate. Finally, the PDMS sealing pad was also bonded to the seat die and the stainless steel package. The MCA valve shows a flow rate of 9.13 sccm at an applied DC voltage of 100 V with a 50% duty cycle and a maximum non-linearity of 2.24% FS. Therefore, the fabricated MCA valve is suitable for a variety of flow control equipment, as a medical bio-system and in the automobile industry.

• Composites Research
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• 제32권3호
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• pp.127-133
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• 2019

탄소나노튜브는 이론적인 기계적, 전기적 물성이 우수함에도 불구하고 아직까지 그 수준에 도달하고 있지 않다. 특히나 인장 강도는 10% 미만의 수준 정도에 그치고 있어 이를 보안하기 위한 연구가 활발히 진행되고 있다. 기계적 강도를 향상하기 위한 방법으로는 긴 탄소나노튜브의 합성, 배향 외에 화학적 가교, 수소결합, 고분자 함침 등의 방법이 연구되고 있다. 본 총설 논문에서는 탄소소재의 전구체인 폴리아크릴로니트릴(PAN), 폴리도파민(PDA)을 탄소나노튜브 섬유에 코팅 또는 함침하여 탄화 공정을 거쳐 고강도 고전도성 탄소나노튜브 섬유/탄소 복합소재를 제조하는 연구를 소개하고자 한다.

• 한국전기전자재료학회논문지
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• 제35권4호
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• pp.342-347
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• 2022

In-situ analyzation and detection of real-time chemical reactions can be a significant part in interpreting the underlying mechanism in very reactive chemical reactions. To do this, first we have designed a microfluidic device (MFD) pattern for observation of synthesis of hierarchical nanostructures based on graphene oxide (GO), conjugating the well-known coupling reaction by which the solution of 1-ethyl-3-(3-dimethylaminopropyl) carbodiimide (EDC)-mediated coupling is enhanced in the presence of n-hydroxysuccinimide (NHS) to make amide bonding, hereafter called as the EDC coupling. Then, we have manufactured microfluidic devices with multiple tens of micrometer-sized channels that can circulate those nanomaterials to be chemically reacted in the channels. These microfluidic devices were made by negative photo lithography and soft lithography. We showed the possibility of using Raman spectroscopy to reveal the basic mechanism of the energy storage applications.

• Current Photovoltaic Research
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• 제10권3호
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• pp.73-76
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• 2022

BIPV (Building Integrated Photovoltaic) supplemented the minimum area problem required when installing existing solar modules. However, in order to apply it to buildings, research was needed to increase the aesthetics of solar modules and use them as a design. Accordingly, modules with color applied to the entire surface of the photovoltaic module were being developed, but there was a disadvantage of low power. Therefore, by dividing and bonding the cell strips, it was possible to improve the output power by applying a shingled technology in which other divided cells overlap in a busbar region where light couldn't be received. Shingled technology was advantageous for color modules because the front busbar part that degrades aesthetics was removed. In this research, four color shingled solar modules (Green, Yellow, Blue, Gray) were manufactured and power degradation was analyzed by measuring transmittance and reflectance. Gray color had 80.83% transmittance, which was 31.31% higher than Yellow, resulting in a power difference of 4.45 W.

• 한국전기전자재료학회논문지
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• 제36권2호
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• pp.151-157
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• 2023

Integrating dielectric materials into LTCC is a convenient method to increase the integration density in electronic circuits. To enable co-firing of the high-k and low-k dielectric LTCC materials in a multi-material hetero-laminate, the shrinkage characteristics of both materials should be similar. Moreover, thermal expansion mismatch between materials during co-firing should be minimized. The alternating stacking of an LTCC with silica filler and that with calcium-zirconate filler was observed to examine the use of the same glass in different LTCCs to minimize the difference in shrinkage and thermal expansion coefficient. For the LTCC of silica filler with a low dielectric constant and that of calcium zirconate filler with a high dielectric constant, the amount of shrinkage was examined through a thermomechanical analysis, and the predicted appropriate fraction of each filler was applied to green sheets by tape casting. The green sheets of different fillers were alternatingly laminated to the thickness of 500 ㎛. As a result of examining the junction, it was observed through SEM that a complete bonding was achieved by constrained sintering in the structure of 'calcium zirconate 50 vol%-silica 30 vol%-calcium zirconate 50 vol%'.

• 한국군사과학기술학회지
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• 제27권4호
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• pp.528-534
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• 2024

In continuous research of detecting highly toxic chemical warfare agents to ensure preparedness for the future battlefield, flexible and wearable sensor platforms with high sensitivity are still demanding. Herein we demonstrate a facile fabrication of polypyrrole-based chemiresistors on cellulose paper for the detection of nerve gas simulants. In order to optimize electrical properties of sensor platform, conducting polymer made of polypyrrole were first synthesized on flexible cellulose paper and interdigitated electrodes were formed thereon. Following confirmation of polypyrrole and/or oxime moiety through FT-IR analyses, electrical characteristics were measured in the various ratio of monomers between simple pyrrole and oxime-modified one. Typically for the optimized chemiresistor(2:8 molar ratio of simple pyrrole and oxime-modified one), eleven species of chemical warfare agents were examined and enhanced conductivity(10⁴~10⁵ order) was observed for three simulants(diethyl cyanophosphonate, diisopropyl fluorophosphonate and diethyl chlorophosphonate), which was mainly attributed to intermolecular hydrogen bonding, while no significant responses was recorded against sixteen common volatile organic chemicals.

• JSTS:Journal of Semiconductor Technology and Science
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• 제4권3호
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• pp.189-195
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• 2004

A 10 Gb/s limiting amplifier IC with the emitter area of $1.5{\times}10{\mu}m^2$ for optical transmission system was designed and fabricated with a AIGaAs/GaAs HBTs technology. In this stud)', we evaluated fine pitch bump using WL-CSP (Wafer Level-Chip Scale Packaging) instead of conventional wire bonding for interconnection. For this we developed WL-CSP process and formed fine pitch solder bump with the $40{\mu}m$ diameter and $100{\mu}m$ pitch on bonding pad. To study the effect of WL-CSP, electrical performance was measured and analyzed in wafer and package module using WL-CSP. In a package module, clear and wide eye diagram openings were observed and the riselfall times were about 100ps, and the output" oltage swing was limited to $600mV_{p-p}$ with input voltage ranging from 50 to 500m V. The Small signal gains in wafer and package module were 15.56dB and 14.99dB respectively. It was found that the difference of small signal gain in wafer and package module was less then 0.57dB up to 10GHz and the characteristics of return loss was improved by 5dB in package module. This is due to the short interconnection length by WL-CSP. So, WL-CSP process can be used for millimeter wave GaAs MMIC with the fine pitch pad.

• 디지털융복합연구
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• 제14권10호
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• pp.261-269
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• 2016

본 논문에서는 CATV 동축케이블 망에서 초고속인터넷 서비스를 제공하기 위한 네트워크 융복합의 새로운 기술을 제안하고, 1Gbps급 전송속도를 갖는 케이블 집선장치와 모뎀을 제작하였다. 이 기술은 기존 DOCSIS 규격의 결합(Bonding) 기술에 비해 제작비용을 낮출 수 있을 뿐만 아니라 채널 대역폭 조절에 따라 데이터 속도도 가변이 용이한 구조로 설계되었다. 실험결과에 따르면, 128QAM 컨볼루션 코드 레이트를 1/2, 2/3, 3/4, 5/6, 7/8로 변화시켰을 때, 데이터는 에러율이 0 상태에서 최대 299Mbps까지의 전송속도를 나타냈으며, 256QAM에서는 $10^{-5}$이내의 에러율 상태에서 342Mbps의 전송속도를 나타내었다. 본 논문의 결과를 활용하여, 채널 대역폭 200MHz를 확보하고 채널 상태에 따라 변조율과 부호율을 조정하면, 1Gbps 이상 전송속도가 가능하고, 기존 DOCSIS방식 보다 성능과 가격 면에서 경쟁력을 가질 것으로 기대된다.