• 제목/요약/키워드: Effect of Cu addition

검색결과 506건 처리시간 0.033초

PTAW법에 의한 Al 합금 표면의 후막경화층 형성에 관한 연구 (A Study on Formation of Thick Hardened Layer on Al Alloy Surface by PYAW Process)

  • 임병수;김봉수;오세훈;황선효;서창제
    • Journal of Welding and Joining
    • /
    • 제15권5호
    • /
    • pp.92-103
    • /
    • 1997
  • The purpose of this study is to improve the wear resistance and hardness of Al alloy by making a formation of the thick surface hardening layers. The thick surface hardening layers were formed by PTAW(Plasma Transferred Arc Welding), with the addition of metal powders (Cu), ceramics powders (NbC, TiC), and mixture powders (Cu+NbC) in Al alloy (A1050, A5083). Mechanical properties of overlaid layers (wear resistance, hardness) were investigated in relation to the microstructure. The results obtained are summarized as follows: The depth of penetration was increased with increasing powder feeding rate. It is considered that these increase were due to the thermal pinch effect by the addition of powders, especially, for the Cu powders, were due to the heat of reaction with the matrix. The hardness and wear resistance of overlaid layers were improved with increasing powder feeding rate. For the Cu powders, it is considered that these increase were due to the increase of the formation of ${\theta}(CuAl_2)$ phase with increasing feeding rate of Cu powers.

  • PDF

TiN의 충진처리가 확산방지막 특성에 미치는 영향(II) : Cu/TiN/Si 구조 (Effect of Stuffing of TiN on the Diffusion Barrier Property (II) : Cu/TiN/Si Structure)

  • 박기철;김기범
    • 한국재료학회지
    • /
    • 제5권2호
    • /
    • pp.169-177
    • /
    • 1995
  • Cu와 Si사이의 확산방지막으로 1000$\AA$ 두께의 TiN의 특성에 대하여 면저항 측정, 식각패임자국 관찰, X선 회절, AES, TEM 등을 이용하여 조사하였다. TiN 확산방지막은 $550^{\circ}C$, 1시간의 열처리 후에 Cu의 안쪽 확산으로 인해 Si(111)면을 따라 결정결함(전위)을 형성하고, 전위 주위에 Cu 실리사이드로 보이는 석출물들을 형성함으로써 파괴되었다. Al의 경우와는 달리 Si 패임자국이 형성되지 안흔 것으로부터 TiN확산방지막의 파괴는 Cu의 안쪽 확산에 의해서만 일어나는 것을 알 수 있었다. 또한, Al의 경우에는 우수한 확산방지막 특성을 보여주었던 충진처리된 TiN가 Cu의 경우에는 거의 효과가 없는 것을 알 수 있었다. 이것은 Al의 경우에는 TiN의 결정립계에 존재하는 $TiO_{2}$가 Al과 반응하여 $Al_{2}O_{3}$를 형성함으로써 Al의 확산을 방해하는 화학적 효과가 매우 크지만, Cu의 경우에는 CuO 또는 $Cu_{2}O$와 같은 Cu 산화물은$TiO_{2}$에 비해서 열역학적으로 불안정하기 때문에 이러한 화학적 효과를 기대할 수 없으며, 따라서 충진처리 효과가 거의 없는 것으로 이해된다.

  • PDF

Mn 및 Cu가 PSN-PNN-PZT 세라믹스의 압전특성에 미치는 영향 (Effect of the Piezoelectric characteristics on the PSN-PNN-PZT Ceramics added with Mn and Cu)

  • 이선곤;이기수
    • 한국안전학회지
    • /
    • 제24권4호
    • /
    • pp.22-27
    • /
    • 2009
  • In this paper, the minuteness structure, piezoelectric, and dielectric characteristics of $0.95{Pb(Sb_{1/2}Nb_{1/2})_{0.02})_{0.02}(Ni_{1/3}Nb_{2/3})_{0.13}(Zr_{0.48}Ti_{0.52})_{0.85}}O_3+0.05Pb(CO_{1/2}W_{1/2})O_3+0.3%$ $MnO_2+0.3wt%$ CuO ceramics has been systematically investigated as a function of the sintering temperature after manufacturing the specimens with a general method. This study will be very helpful as basic data for developing ceramic materials, More study in a soon time for improving stability of temperature, effect of adds and stability and reality of frequency with improved production condition for specimens will give a powerful potentiality as a applied material of dielectric ceramics.

V2O5 도핑된 NiCuZn 페라이트로 제조된 칩인덕터에서의 Ag/cu 석출 (Ag and Cu Precipitation in Multi-Layer Chip Inductors Prepared with V2O5 Doped NiCuZn Ferrites)

  • 제해준;김병국
    • 한국재료학회지
    • /
    • 제13권8호
    • /
    • pp.503-508
    • /
    • 2003
  • The purpose of this study is to investigate the effect of $V_2$$O_{5}$ addition on the Ag and Cu precipitation in the NiCuZn ferrite layers of 7.7${\times}$4.5${\times}$1.0 mm sized multi-layer chip inductors prepared by the screen printing method using 0∼0.5 wt% $V_2$$O_{5}$ -doped ferrite pastes. With increasing the $V_2$$O_{5}$ content and sintering temperature, Ag and Cu oxide coprecipitated more and more at the polished surface of ferrite layers during re-annealing at $840^{\circ}C$. It was thought that during the sintering process, V dissolved in the NiCuZn ferrite lattice and the Ag-Cu liquid phase of low melting point was formed in the ferrite layers due to the Cu segregation from the ferrite lattice and Ag diffusion from the internal electrode. During re-annealing at $840^{\circ}C$, the Ag-Cu liquid phase came out the polished surface of ferrite layers, and was decomposed into the isolated Ag particles and the Cu oxide phase during the cooling process.

Cu/hexaaluminate 펠렛 촉매를 이용한 친환경 액체 추진제 분해 반응에 미치는 조촉매의 영향 (Effect of Promoter on the Decomposition of Eco-Frendly Liquid Monopropellant on Cu/hexaaluminate Pellet Catalyst)

  • 김문정;김우람;조영민;전종기
    • 청정기술
    • /
    • 제26권3호
    • /
    • pp.196-203
    • /
    • 2020
  • 본 연구에서는 Cu/hexaaluminate를 공침법으로 제조한 후, 바인더를 첨가하여 펠렛 형태로 성형하였다. 니켈 및 루테늄 조촉매의 첨가가 Cu/hexaaluminate pellet 촉매의 특성과 ADN계 액체 단일 추진제의 분해 반응에 미치는 영향을 고찰하는데 초점을 두었다. Cu/hexaaluminate pellet 촉매는 미세 기공은 거의 없으며 메조 기공이 발달한 촉매이다. Cu/hexaaluminate pellet 촉매에 루테늄을 조촉매로 첨가하면 기공의 부피와 기공의 크기는 큰 폭으로 증가하였다. ADN 기반 액체 단일 추진제의 열분해 반응에서 분해 개시 온도는 170.2 ℃이다. Cu/hexaaluminate pellet 촉매를 사용한 경우, 분해 개시 온도는 93.5 ℃로 크게 감소한 것을 확인하였다. 루테늄 1% 및 3%를 조촉매로 첨가했을 때, ADN 기반 액체 단일 추진제 분해 개시 온도가 각각 91.0 ℃와 83.3 ℃로 낮아졌다. 즉, 루테늄 조촉매가 ADN 기반 액체 단일 추진제의 분해 개시 온도를 낮추는데 효과가 있다는 것을 의미한다. 이는 루테늄 금속이 ADN 기반 액체 단일 추진제 분해 반응에 활성이 뛰어나면서, 동시에 기공 부피와 기공의 크기를 증가시키는데 기여하였기 때문이다. Cu/hexaaluminate pellet 촉매의 내열성에 루테늄이 미치는 영향을 확인하기 위하여 1200 ℃에서의 열처리와 ADN 기반 액체 단일 추진제 분해 실험을 반복적으로 수행한 결과, 루테늄의 첨가 비율이 증가함에 따라 내열성이 증가하는 것을 확인할 수 있었다.

폴리이미드에 스퍼터 증착한 Cu-Cr, Cu-Ti 합금박막의 열처리 전후의 접착력과 미세구조 (Microsstructure of Sputter-Deposited and Annealed Cu-Cr, Cu-Ti Alloy Films on Polyimide Substrate and Their Adhesion Property)

  • 서환석;김기범
    • 한국표면공학회지
    • /
    • 제27권5호
    • /
    • pp.261-272
    • /
    • 1994
  • Both Cu-Cr and Cu-Ti alloy films with different composition were prepared by dc magnetron sputtering onto polyimide substrate and their adhesion and microstructure were observed. In addition, the effect of heat treatment at $400^{\circ}C$ for 2 hours on the variation of adhesion properties and on the changess of microstructure were investigated. Cu-Cr alloy films have crystalline structure of either for or bcc phase depending on the composition of the film. However, the Cu-Ti alloy film forms fcc phase at low Ti concentration while it forms an amorphous phase as the Ti concentration in the films is increased to more than 25at.%. TEM analysis reveal that the microstructure of Cu-Cr and Cu-Ti films forms an open structure with vacant spaces. The adhesion between Cu-Cr, Cu-Ti alloy films and polyimide substrate is relatively good before the heat treatment, but is noticeably reduced after the heat treatment. In particular, the adhesion strength is significantly reduced in the Cu-Ti alloy films after the heat treatment. The reduction of adhesion strength after the heat treatment is identified to relate with the formation of oxide phases at the metal/polyimide interface by AES(Auger Electron Spectroscopy).

  • PDF

Ag와 $Y_2BaCuO_5$ 가 고온초전도체의 임계특성에 미치는 영향 (The Effects of Ag and $Y_2BaCuO_5$ on Critical Characteristics of $YBa_2Cu_3O_X$ Fabricated by MPMG Method)

  • 임성훈
    • 한국전기전자재료학회논문지
    • /
    • 제11권6호
    • /
    • pp.493-501
    • /
    • 1998
  • $YBa_2Cu_3O_X$ samples were fabricated by MPMG(Melt Powdered Melt Growth). Intitial composition of the mixed powders were prepared as follow ; $YBa_2Cu_3O_X$ : $Y_2BaCuO_5$ = 1:0, 1:0.2, 1:0.3, 1:0.4. After the first melt and cooling, 5wt% to 20wt% fo Ag power was added to the powder. Effects of the different initial $Y_2BaCuO_5$ and Ag addition amount on $J_c$ and magnetization of $YBa_2Cu_3O_X$ fabricated by MPMG method were investigated. The critical current density increased with the amount of $Y_2BaCuO_5$ and Ag. It was also observed that the difference between negative and positive magnetization in the magnetization hysteresis measurement at 77K was larger than the case where $Y_2BaCuO_5$and Ag were not added to the $YBa_2Cu_3O_X$ powders. It is concluded that $Y_2BaCuO_5$ sample with 40wt% amount of $Y_2BaCuO_5$ and 20wt% amount of Ag has not only the largest $J_c$ but also the improved pinning effect.

  • PDF

Ge를 첨가한 Nb$_3$Sn 초전도 선에서의 교류손실 및 미세조직 변화 (Influence of Ge addition on AC loss and micro-structure in $Nb_{3}Sn$ wires)

  • 하도우;이남진;오상수;하홍수;송규정;권영길;류강식
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
    • /
    • pp.104-107
    • /
    • 2001
  • In order to investigate the effect of Ge addition to the Cu matrix on the microstructure and the critical current density, four kinds of internal tin processed Nb$_3$Sn strands with pure Cu and Cu 0.2, 0.4, 0.6 wt % Ge alloys were drawn to 0.8 mm diameter. The microstructure and critical current of internal tin processed Nb$_3$Sn wires that were heat treated at temperatures ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$ for 240h were investigated. The Ge addition to the matrix did not make workability worse. A Ge rich layer in the Cu-Ge matrix suppressed the growth of the Nb$_3$Sn layer and promoted grain coarsening. The greater the Ge content in the matrix, the lower the net Jc result after Nb$_3$sn reaction heat treatment. There was no significant variation in Jc observed with heat treatment temperature ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$. The values of AC loss of Ge added wires were decreased to 40 % compare with no addition wire. Low AC loss was due to segregation of Ge rich layer in the Cu-Ge matrix. If Ge added wire with thin Nb filaments were fabricated, slow diffusion rate of Sn would be overcome and decreased AC loss that is weak Point of internal tin method.

  • PDF

원심주조한 Cu-Sn-Ni-Pb계 합금의 기계적 성질에 미치는 P첨가와 균질화 처리의 영향 (Effects of P Addition and Homogenizing Heat Treatment on the Mechanical Properties of Centrifugal Cast Cu-Sn-Ni-P Alloy)

  • 권영한;제창웅;윤재홍;강창룡;김창규
    • 한국주조공학회지
    • /
    • 제17권5호
    • /
    • pp.443-449
    • /
    • 1997
  • The purpose of this study is to investigate the effect of P addition and homogenizing heat treatment on the mechanical properties of Cu-Sn-Ni alloy. The addition of P was 0.025wt.%P to 0.085wt.%P and homogenizing heat-treated at 400, 500, $600^{\circ}C$ under $N_2$ gas atmosphere. Mechanical properties was investigated in this study were Rockwell hardness, tensile strength, and elongation. Tensile strength and elongation increased with P and homogenizing time. Temperature was significantly influence on mechanical properties. Hardness decreased with increasing homogenizing time and temperature, but 0.085wt.%P specimen was showed higher hardness and lower tensile strength and elongation than 0.073wt.%P specimen due to the presence of more $Cu_3P$ in matrix.

  • PDF

Ti-Ni-Cu 형상기억합금의 상변태 및 초탄성에 미치는 가공열처리의 영향 (Effect of Thermomechanical Treatment on the Phase Transformation and Superelasticity in Ti-Ni-Cu Shape Memory Alloy)

  • 이오연;박영구;천병선
    • 열처리공학회지
    • /
    • 제7권4호
    • /
    • pp.253-261
    • /
    • 1994
  • Transformation behavior and superelastic behavior of Ti-Ni-Cu alloys with various Cu content has been investigated by means of electrical resistivity measurement, X-ray diffraction, tensile test and transmission electron microscopy. Two types of heat treatment are given to the specimens: i) Solutions treatment. ii) thermo-mechanical treatment. The transformation sequence in solution treated Ti-Ni-Cu Alloys substituted by Cu for Ni up to 5at.% occurs to $B2{\rightleftarrows}B19^{\prime}$ and it proceeds in two stages by addition of 10at.%Cu, i. e, $B2{\rightleftarrows}B19{\rightleftarrows}B19^{\prime}$. Also, it has been found that Ti-30Ni-20Cu alloy transformed in one stage : $B2{\rightleftarrows}B19$. The thermo-mechanically treated Ti-47Ni-3Cu alloy transformed in two stages: B2${\rightleftarrows}$rhomboheral phase${\rightleftarrows}B19^{\prime}$, while transformation sequence in Ti-45Ni-5Cu and Ti-40Ni-10Cu alloy transformed as same as solution treated specimens. The critical stress for inducing slip deformation in solution treated and thermo-mechanically treated Ti-40Ni-10Cu alloy is about 90MPa and 320Mpa respectively.

  • PDF