• Title/Summary/Keyword: Edge termination

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Design of Unified Trench Gate Power MOSFET for Low on Resistance and Chip Efficiency (낮은 온저항과 칩 효율화를 위한 Unified Trench Gate Power MOSFET의 설계에 관한 연구)

  • Kang, Ey-Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.10
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    • pp.713-719
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    • 2013
  • Power MOSFET operate voltage-driven devices, design to control the large power switching device for power supply, converter, motor control, etc. We have optimal designed planar and trench gate power MOSFET for high breakdown voltage and low on resistance. When we have designed $6,580{\mu}m{\times}5,680{\mu}m$ of chip size and 20 A current, on resistance of trench gate power MOSFET was low than planar gate power MOSFET. The on state voltage of trench gate power MOSFET was improved from 4.35 V to 3.7 V. At the same time, we have designed unified field limit ring for trench gate power MOFET. It is Junction Termination Edge type. As a result, we have obtained chip shrink effect and low on resistance because conventional field limit ring was convert to unify.

Suppression of the leakage current of a Ni/Au Schottky barrier diode fabricated on AlGaN/GaN hetero-structure by oxidation (Ni/Au 쇼트키 접합의 산화를 통해, AlGaN/GaN heterostructure 웨이퍼 위에 제작한 쇼트키 장벽 다이오드의 누설전류 억제)

  • Lim, Ji-Yong;Lee, Seung-Chul;Ha, Min-Woo;Han, Min-Koo
    • Proceedings of the KIEE Conference
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    • 2005.11a
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    • pp.3-5
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    • 2005
  • Ni/Au 쇼트키 접합의 산화를 통해 항복전압이 증가하고 누설 전류가 감소한 수평방향 GaN 쇼트키 장벽 다이오드를 제작하였다. 산화 과정 후, 턴-온 전압이 미세하게 증가하였으며 높은 애노드 전압하에서 애노드 전류가 증가하였다. 5분과 10분의 산화 과정 후, 누설 전류는 1nA 이하 수준으로 현저히 감소하였다. Edge Termination 방법으로 Floating Metal Ring을 사용하고, 산화 과정을 적용하여 제안된 GaN 쇼트키 장벽 다이오드의 항복전압은 750볼트의 큰 값을 얻을 수 있었다. 상온과 $125^{\circ}C$ 에서 제작한 GaN 쇼트키 장벽 다이오드의 역방향 회복 파형도 측정하였으며, 제작한 소자는 매우 빠른 역방향 회복 특성을 보였다.

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The Fabrication of Packaged 4H-SiC 2kV power PiN diode and Its Electrical Characterization (탄화규소 (4H-SiC) 기반 패키지 된 2kV PiN 파워 다이오드 제작과 전기적 특성 분석)

  • Song, Jae-Yeol;Kang, In-Ho;Bahng, Wook;Joo, Sung-Jae;Kim, Sang-Cheol;Kim, Nam-Kyun;Lee, Yong-Jae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.67-68
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    • 2008
  • In this study we have developed a packaged silicon carbide power diode with blocking voltage of 2kV. PiN diodes with 7 field limiting rings (FLRs) as an edge termination were fabricated on a 4H-SiC wafer with $30{\mu}m$-thick n-epilayer with donor concentration of $1.6\times10^{15}cm^{-3}$. From packaged PiN diode testing, we obtained reverse blocking voltage of 2kV, forward voltage drop of 4.35V at 100A/$cm^2$, on-resistance of $6.6m{\Omega}cm^2$, and about 8 nanosec reverse recovery time. These properties give a potential for the power system application.

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Fabrication of 5,000V, 4-Inch Light Triggered Thyristor using Boron Diffusion Process and its Characterization (Boron 확산공정을 이용한 5,000V, 4인치 광 사이리스터의 제작 및 특성 평가)

  • Park, Kun-Sik;Cho, Doohyung;Won, Jongil;Lee, Byungha;Bae, Youngseok;Koo, Insu
    • The Transactions of the Korean Institute of Power Electronics
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    • v.24 no.6
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    • pp.411-418
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    • 2019
  • Light-triggered thyristors (LTTs) are essential components in high-power applications, such as HVDC transmission and several pulsed-power applications. Generally, LTT fabrication includes a deep diffusion of aluminum as a p-type dopant to form a uniform p-base region, which needs careful concern for contamination and additional facilities in silicon semiconductor manufacturing factories. We fabricated 4-inch 5,000 V LTTs with boron implantation and diffusion process as a p-type dopant. The LTT contains a main cathode region, edge termination designed with a variation of lateral doping, breakover diode, integrated resistor, photosensitive area, and dV/dt protection region. The doping concentration of each region was adjusted with different doses of boron ion implantation. The fabricated LTTs showed good light triggering characteristics for a light pulse of 905 nm and a blocking voltage (VDRM) of 6,500 V. They drove an average on-state current (ITAVM) of 2,270 A, peak nonrepetitive surge current (ITSM) of 61 kA, critical rate of rise of on-state current (di/dt) of 1,010 A/㎲, and limiting load integral (I2T) of 17 MA2s without damage to the device.

A study on several points of commercial disputes in international license Agreement (국제라이선스계약이 가지는 상사분쟁의 주요 쟁점에 관한 고찰)

  • Jeong, Heejin
    • International Commerce and Information Review
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    • v.19 no.1
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    • pp.191-210
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    • 2017
  • The old sources of competitive edge and value added were land, labor, and capital. In today's knowledge-based economy in the 21st century, technology is attracting attention as a new engine of growth. That paradigm shift of world economy has resulted in the global spread of technology transfer and the gradual increase of trade of intangible goods including patents and know-how as well as tangible goods in international trade. An international license agreement is a representative form of technology transfer. In license agreements, the providers of technology keep their ownership of technology, allow the implementation of technology to the users of technology only for a certain period of time, and receive loyalty as a reward. Economic profit through such technology trade can be realized with the smooth implementation and termination of agreement. International license agreements are different from sales contracts, which represent international business transaction based on mutual obligation, in many aspects in that they target intangible goods of technology and aim for rent for a certain period of time. This study thus set out to examine issues that could be controversial in the main and individual obligation of the parties in international license agreements and provide implications helpful for the prevention of disputes in advance.

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Compact and Broadband L-shaped Slot Antenna (소형 광대역 L-형 슬롯 안테나)

  • Jang, Min-Gyu;Lee, Young-Soon
    • Journal of Advanced Navigation Technology
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    • v.18 no.4
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    • pp.376-380
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    • 2014
  • In the present study, oblique L-shaped monopole slot antenna with broadband characteristic is newly proposed. For bandwidth enhancement as well as size reduction, L-shaped slot with two open-terminations on the ground edge is used. The lower part of L-shaped slot comprises oblique form for bandwidth enhancement in low frequency band, whereas its higher part comprise tapered form for its enhancement in high frequency band. The short-circuit terminated microstrip line which is generally known to be more useful for bandwidth enhancement than open-circuit termination is used. The measured impedance bandwidth($S_{11}{\leq}-10dB$) and gain of the fabricated antenna have been observed to be 4.72 GHz (2.28~7 GHz) and more than 3dBi over the passband respectively.

AN EXPERIMENTAL STUDY ON THE EFFECT OF RABBIT TEMPOROMANDIBULAR JOINT BY TRAUMATIC OCCLUSION (외상성교합(外傷性咬合)이 가토악관절(家兎顎關節)에 미치는 영향(影響)에 관(關)한 실험적(實驗的) 연구(硏究))

  • Son, Han-Gee
    • The Journal of Korean Academy of Prosthodontics
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    • v.15 no.1
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    • pp.34-42
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    • 1977
  • The author attempted to observed the histological changes of the temporomandibular joints of rabbits by including malocclusion. Thirth-two healthy male rabbits were devided into two groups; control and experimental group. Eight rabbits were kept as control group, while metal crowns were seated on unilateral lower molar teeth of twenty-four rabbits as experimental group. And the interocclusal distance of the incisal edge was kept 1.5mm from the begining to the end of the experimental periods. Rabbits of each group, one of control group and three of the experimental gorup, were killed at the intervals of one day, three days, one week, two weeks, four weeks, six weeks, eight weeks, and twelve weeks after experiment. The temporomandibular joint including condyle head, articular disc and glenoid fossa were excised and decalcified. The decalcified sections were made histologic sections. The results obtained were as follows. 1. The regressive changes of the condylar head were the main reaction in this experiment that consist of decreasing or increasing thickness of the fibrocartilage zone with hyaline degeneration, decreasing of the cellularity of the proliferative zone, and the irregularity of the arrangement of chondrocytes and size of the lacunae of cartilage cells with chondroclasia and osteoclasia in hypertrophic zone. 2. The regressive changes of the condylar surface of the crown seated side were persisted to the end of the experiment. 3. On the non-crown seated side, severe aggressive changes occurred in initial stage, but hyperplastic changes of the condylar surface noted in the middle of the experimental periods. 4. Although aggressive changes occurred in initial stage of experiment on the non-crown seated side, hyperplastic changes of the condylar surface were noted in the middle of the experimental periods, and remodeling appeared at the termination of the experimental periods. 5. The articular disc exhibited pannus formation on both crown seated and non crown seated side from the beginning of the experiment. The pannus persisted throughout the experiment on the crown seated side, but on the non-crown seated side it disappeared from six week group.

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Fabrication and Characterization of 5000V class 4-inch Light Triggered Thyristor (4인치 광점호 Thyristor의 제조 및 특성 분석에 대한 연구)

  • Cho, Doohyung;Won, Jongil;Yoo, Seongwook;Ko, Sangchoon;Park, Jongmoon;Lee, Byungha;Bae, Youngseok;Koo, Insu;Park, Kunsik
    • Proceedings of the KIPE Conference
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    • 2019.07a
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    • pp.230-232
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    • 2019
  • Light Triggerd Thyristor (LTT)는 HVDC 및 산업용 스위치 등에 사용되는 대전력 반도체소자이다. 일반적인 Thyristor가 전기적 신호에 의해 trigger 되는 것과는 다르게 LTT는 광신호에 의해 동작하는 소자이다. 본 논문에서는 5,000V, 2,200A 급의 4인치 LTT 소자의 제작 및 전기적인 특성평가 결과를 기술하였다. 4인치 LTT의 구조적인 특징은 전면부 중앙에 광신호가 주입되는 수광부가 위치해 있으며 입력 전류 증폭을 위한 4-단계 증폭 게이트 (gate) 구조를 가지도록 설계하였다. $400{\Omega}{\cdot}cm$ 비저항을 갖는 1mm 두께의 n-형 실리콘 웨이퍼에 boron 이온주입과 열처리 공정으로 약 $30{\mu}m$ 깊이의 p-base를 형성하였으며, 고내압 저지를 위한 edge termination은 VLD (variable lateral doping) 기술을 적용하였다. 제작된 4인치 LTT는 6,500 V의 순방향 항복전압 ($V_{DRM}$) 특성을 나타내었으며, 100V의 어노드전압 ($V_A$)과 20 mA의 게이트전류 ($I_G$)에 의하여 thyristor가 trigger 됨을 확인하였다. 제작한 LTT 소자는 disk형 press-pack 패키지를 진행한 후, LTT의 수광부에 $10{\mu}s$, 50 mW의 900 nm 광 펄스를 조사하여 전류 특성을 평가하였다. LTT 패키지 샘플에 60 Hz 주파수의 광 펄스를 조사한 경우 2,460 A의 순방향 평균전류 ($I_T$)와 $336A/{\mu}s$의 반복전류상승기울기 (repetitive di/dt)에 안정적으로 동작함을 확인하였다. 또한, 펄스 전류 시험의 경우 61.6 kA의 최대 통전 전류 (ITSM, surge current)와 $1,050A/{\mu}s$의 펄스전류 상승 기울기 (di/dt of on-state pulse current)에도 LTT의 손상 없이 동작함을 확인하였다.

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Enhancement and Quenching Effects of Photoluminescence in Si Nanocrystals Embedded in Silicon Dioxide by Phosphorus Doping (인의 도핑으로 인한 실리콘산화물 속 실리콘나노입자의 광-발광현상 증진 및 억제)

  • Kim Joonkon;Woo H. J.;Choi H. W.;Kim G. D.;Hong W.
    • Journal of the Korean Vacuum Society
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    • v.14 no.2
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    • pp.78-83
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    • 2005
  • Nanometric crystalline silicon (no-Si) embedded in dielectric medium has been paid attention as an efficient light emitting center for more than a decade. In nc-Si, excitonic electron-hole pairs are considered to attribute to radiative recombination. However the surface defects surrounding no-Si is one of non-radiative decay paths competing with the radiative band edge transition, ultimately which makes the emission efficiency of no-Si very poor. In order to passivate those defects - dangling bonds in the $Si:SiO_2$ interface, hydrogen is usually utilized. The luminescence yield from no-Si is dramatically enhanced by defect termination. However due to relatively high mobility of hydrogen in a matrix, hydrogen-terminated no-Si may no longer sustain the enhancement effect on subsequent thermal processes. Therefore instead of easily reversible hydrogen, phosphorus was introduced by ion implantation, expecting to have the same enhancement effect and to be more resistive against succeeding thermal treatments. Samples were Prepared by 400 keV Si implantation with doses of $1\times10^{17}\;Si/cm^2$ and by multi-energy Phosphorus implantation to make relatively uniform phosphorus concentration in the region where implanted Si ions are distributed. Crystalline silicon was precipitated by annealing at $1,100^{\circ}C$ for 2 hours in Ar environment and subsequent annealing were performed for an hour in Ar at a few temperature stages up to $1,000^{\circ}C$ to show improved thermal resistance. Experimental data such as enhancement effect of PL yield, decay time, peak shift for the phosphorus implanted nc-Si are shown, and the possible mechanisms are discussed as well.