• Proceedings of the KSR Conference
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• 2004.10a
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• pp.1431-1436
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• 2004

In this paper, measuring programs for EMC type tests in the railway environments were designed and developed the train harmonic current in ATP frequency band and psophometric current using PXI components and LabVIEW software form National Instruments. As real time applications for EMC tests, harmonic current and psophometric current results of the train were also presented. This new measuring programs for EMC tests in the train are expected to increase test reliability and real-time performance.

• Composites Research
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• v.34 no.1
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• pp.47-50
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• 2021

In this paper, the Curing process for Epoxy Molding Compound (EMC) Package was developed by comparing the performance of the EMC/Cu Bi-layer package manufactured by the conventional Hot Press process system and Carbon Nanotubes (CNT) Heater process system of the surface heating system. The viscosity of EMC was measured by using a rheometer for the curing cycle of the CNT Heater. In the EMC/Cu Bi-layer Package manufactured through the two process methods by mentioned above, the voids inside the EMC was analyzed using an optical microscope. In addition, the interfacial void and warpage of the EMC/Cu Bi-layer Package were analyzed through C-Scanning Acoustic Microscope and 3D-Digital Image Correlation. According to these experimental results, it was confirmed that there was neither void in the EMC interior nor difference in the warpage at room temperature, the zero-warpage temperature and the change in warpage.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2000.11a
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• pp.75-78
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• 2000

Since the most of malfunctions in the industrial equipment controlled by processors is occured by the Electrical Fast Transient(EFT), the International Electrotechnical Commission(IEC) prepared the dummy signal to test the immunity level of the equipments. In this paper. we designed a new EMC filter for power line in break-box, which is consist of the feed-through capacitor and ferrite materials with high permeability which was wound or inserted in the second layer of the power cable in order to increase common mode inductance. We have obtained a excellent insertion loss characteristics over wide frequency band from 100 KHz up to 6 GHz. It is expected that the new EMC filter could be effectively used for industrial, MIL, and medical equipments to reduce a malfunctions and be suitable for IEC 61000-4-4.

• Journal of the Semiconductor & Display Technology
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• v.3 no.4
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• pp.33-37
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• 2004

As the high speed and high integration of semiconductor devices and the generation of heat increases resulted in the effective heat dissipation influences on the performance and lifetime of semiconductor devices. The heat resistance or heat spread function of EMC(epoxy molding compound) which protects these devices became one of very important factors in the evaluation of semiconductor chips. Recently, silica, alumina, AlN(aluminum nitride) powders are widely used as the fillers of EMC. The filler loading in encapsulants was high up to about 80 vol%. A high loading of filler was improved low water absorption, low stress, high strength, better flowability and high thermal conductivity. In this study, the thermal properties were investigated through thermal, mechanical and microstructure. Thermophysical properties were investigated by laser flash and differential scanning calorimeter(DSC). For detailed inspection of materials, the samples were examined by SEM.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.23 no.5
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• pp.41-46
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• 2023

It is very important to meet the maximum detection range in a radar system. In order to meet the maximum detection Range, the sensitivity of the received signal of the radar system must be high. In addition, the dynamic range should be wide in the radar signal processing board. To meet these requirements, the signal processing board must be designed to be robust against external and internal noise. In particular, a design is required to minimize the effect of noise generated by various switching circuits inside the board on the received radar signal. In this paper, we derive the requirements of the signal processor board to meet the radar system performance and describe the design to meet the derived requirements. In addition, the EMC design to minimize the influence of noise input from the outside or generated from the inside is described. Confirm the secured performance through the test of the manufactured board.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.33 no.4
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• pp.100-109
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• 2005

This paper introduce electromagnetic environmental requirements, test procedures and test results for the Command Telemetry Unit(CTU), which is engineering qualification model for communication satellite in geostationary earth orbit. Also, through debugging of the CTU during the Electro Magnetic Compatibility(EMC) tests, this paper evaluates characteristics of noise generated by the CTU. It is also obtained that better EMC performance can be acquired by improving electrical power converter module of the CTU.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.58 no.3
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• pp.235-240
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• 2009

In automobile, the introduction of electronically commutated motors has been accompanied by a proliferation of electronic devices. With this proliferation of electronic devices, an emphasis has been placed on EMC issues. This paper is proposed to use SRM as a radiator cooling fan in automotive applications. To drive SRM, Energy efficient C-dump converter is applied. Energy efficient C-dump converter, derived from the conventional C-dump converter, is proposed as a switched reluctance motor (SRM) drive for automotive engine cooling application. It is verified more efficient than other converters through simulation and experiments. And also SRM is valid for automotive applications that have strict EMC standards. Simulation and experimental results obtained on a laboratory prototype are finally presented to evaluate the performance.

• Applied Chemistry for Engineering
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• v.8 no.3
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• pp.533-542
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• 1997

Due to the trends of faster and denser circuit design, dielectric properties of packaging materials for semiconductor will give a greater influence on performance and reliability. Also as chip becomes more densified, thermal dissipation becomes a critical reliability issue. Consequently, four important properties for manufacturing semiconductor packaging materials are low values of dielectric constant, high values of thermal conductivity, relatively low values of thermal expansion coefficient and low cost. Thus, in this study, to achieve increased performance of EMC, crystalline silica was selected as the filler for epoxy matrix. As a result, when the volume percent of crystal silica was 60~70%, good properties as packaging materials for semiconductor were achieved. In addition, overall molding condition of EMC in this experiment was established.

• Journal of the Korean Society for Railway
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• v.14 no.6
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• pp.507-514
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• 2011

Recently, we developed a new subway train with many cooperative companies. The main controller of the subway train is Control and Monitoring System (TCMS), so we conducted requirement analysis of TCMS considering system performance, easy maintenance and service oriented flexibility. Hence, we adopted new bus architecture and QNX as a Real-time Operating System (RTOS) and developed hardware systems. The functions of TCMS are employed into two computers, service computer and control/monitor computer, to increase on their performance and to yield easy maintenance and to satisfy customer needs. The TCMS controls and monitors control devices equipped in the train through various protocols which are implemented in hardware. In order to evaluate the performance of the system and to satisfy reliability, various experiments including EMC/ECI were performed. Now the TCMS is installed on the newly developed train and is under performance evaluation through test driving.

• Journal of the Korean Society for Nondestructive Testing
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• v.37 no.2
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• pp.106-114
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• 2017

This paper presents an automated subsurface micro void detection technique based on pulsed infrared thermography for inspecting epoxy molding compounds (EMC) used in electronic device packaging. Subsurface micro voids are first detected and visualized by extracting a lock-in amplitude image from raw thermal images. Binary imaging follows to achieve better visualization of subsurface micro voids. A median filter is then applied for removing sparse noise components. The performance of the proposed technique is tested using 36 EMC samples, which have subsurface (below $150{\mu}m{\sim}300{\mu}m$ from the inspection surface) micro voids ($150{\mu}m{\sim}300{\mu}m$ in diameter). The experimental results show that the subsurface micro voids can be successfully detected without causing any damage to the EMC samples, making it suitable for automated online inspection.